Abstract: A bondwire transition arrangement for interconnecting a signal port on one IC of a multichip module with a signal port on another, adjacent, IC of the same module employs a distributed signal-transition process in which the signal on one port appears as subsignals at tapping points along a series transmission-line segment arrangement between that port and ground on the same IC and the subsignals are recombined along a second series transmission-line segment arrangement connected between the other port and ground on the other IC. Spatially corresponding tapping points are interconnected via bondwires.

Abstract: A screening housing for microwave circuits has a housing body having an interior and open at least at one side, a cover closing the interior of the housing, and means forming a plurality of chambers provided for accommodating of individual circuit units and screened from one another, the means including a substrate and applied on an inner side of the cover and a plurality of webs which are formed on the substrates so that when the cover closes the housing the webs form separating walls between the chambers.