Patents by Inventor Hardik Dalal

Hardik Dalal has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250039061
    Abstract: A method (700) for distributed machine learning, ML, using a set of N CDs. The method includes obtaining first topology information, wherein, for each CD included in the set of N CDs, the first topology information identifies other CDs included in the set of N CDs to which the CD is connected, thereby identifying a set of CD pairs. The method also includes obtaining first network state information, wherein, for each CD included in the set of N CDs, the first network state information comprises a network state vector for the CD, wherein the network state vector for the CD comprises, for each other CD to which the CD is indicated as being connected by the first topology information, a determined network state value. The method further includes determining a consensus weight matrix (W) using the obtained first network state information and the first topology information.
    Type: Application
    Filed: December 17, 2021
    Publication date: January 30, 2025
    Applicant: TELEFONAKTIEBOLAGET LM ERICSSON (PUBL)
    Inventors: Hardik DALAL, Emmanuel Thepie Fapi, Zhongwen Zhu, Ben Liang, Jingrong Wang
  • Publication number: 20250016069
    Abstract: Methods, systems and computer program products for multi-node analysis, are provided. Such methods, systems and products may comprise, or may comprise instructions operable to configure one or more processors to perform, a set of acts. Such acts may comprise receiving a performance indicator equation comprising a corresponding set of measurement parameters. Such a set of acts may also comprise, for each node from a set of nodes, receiving a set of measurement values for that node from a database and determining that node's contribution to a cluster value for a performance indicator corresponding to the performance indicator equation. Such a set of acts may also comprise reporting performance indicator information for the set of nodes wherein the reported performance indicator information is based on relative contributions of each node from the set of nodes to the cluster value for the performance indicator corresponding to the performance indicator equation.
    Type: Application
    Filed: December 10, 2021
    Publication date: January 9, 2025
    Applicant: Telefonaktiebolaget LM Ericsson (publ)
    Inventors: Emmanuel Thepie FAPI, Hardik DALAL, Zhongwen ZHU
  • Patent number: 11383503
    Abstract: Disclosed herein is a composite sandwich panel that includes a first face portion with fully consolidated comingled first fibers and a first thermoplastic matrix. The composite sandwich panel also includes a second face portion with fully consolidated comingled second fibers and a second thermoplastic matrix. Additionally, the composite sandwich panel includes at least one core portion with partially consolidated comingled third fibers and a third thermoplastic matrix. The at least one core portion is interposed between the first and second face portions. The first thermoplastic matrix is melded with the third thermoplastic matrix and the second thermoplastic matrix is melded with the third thermoplastic. A density of the fibers across a thickness of the composite panel is non-uniform.
    Type: Grant
    Filed: December 17, 2019
    Date of Patent: July 12, 2022
    Assignee: The Boeing Company
    Inventors: Hardik Dalal, Panagiotis E. George, Kelsi M. Hurley, Ashley C. Tracey
  • Patent number: 11377535
    Abstract: Methods and compositions for depolymerizing the polymer component of fiber reinforced polymers to facilitate the recovery of free fibers.
    Type: Grant
    Filed: March 9, 2020
    Date of Patent: July 5, 2022
    Assignee: The Boeing Company
    Inventors: Adam F. Gross, John J. Vajo, Ashley M. Nelson, April R. Rodriguez, Hardik Dalal, Panagiotis E. George
  • Patent number: 11331833
    Abstract: Systems and methods of curing a thermoset composite (TSC) to a target state of cure (SOC) are disclosed herein. The methods include heating the thermoset composite to greater than a threshold temperature. During the heating, the methods further include monitoring an actual temperature of the thermoset composite, determining a maximum temperature achieved by the thermoset composite, and determining an elapsed time that the actual temperature of the thermoset composite is greater than the threshold temperature. The methods further include ceasing the heating based, at least in part, on the maximum temperature of the TSC and the elapsed time. The systems include a heating assembly, a support mandrel, a thermoset composite, a temperature detector, and a controller programmed to perform the methods.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: May 17, 2022
    Assignees: The Boeing Company, Toray Industries, Inc.
    Inventors: Hardik Dalal, Karl M. Nelson, Travis James Sherwood, Felix N. Nguyen
  • Patent number: 11247409
    Abstract: Methods of co-bonding a first thermoset composite (TSC) and a second TSC to define a cured composite part are disclosed herein. The methods include partially curing the first TSC to a target state of cure (SOC) to define a first partially cured TSC. The partially curing is based, at least in part, on a maximum temperature of the first TSC during the partially curing and on an elapsed time that an actual temperature of the first TSC is greater than a threshold temperature. The methods further include combining the first partially cured TSC with the second TSC to define a partially cured TSC assembly and heating the partially cured TSC assembly to bond the first partially cured TSC to the second TSC, cure the partially cured TSC assembly, and produce a cured composite part.
    Type: Grant
    Filed: March 15, 2018
    Date of Patent: February 15, 2022
    Assignees: The Boeing Company, Toray Industries, Inc.
    Inventors: Karl M. Nelson, Travis James Sherwood, Hardik Dalal, Felix N. Nguyen, Dongyeon Lee, Kenichi Yoshioka, Hideo Andrew Koyanagi
  • Patent number: 11208345
    Abstract: A composition comprising a Lewis base containing depolymerization liquid and methods of using the Lewis base depolymerization liquid to depolymerize the polymer component of fiber reinforced polymers to form free fibers.
    Type: Grant
    Filed: April 10, 2020
    Date of Patent: December 28, 2021
    Assignee: The Boeing Company
    Inventors: Adam F. Gross, April R. Rodriguez, Ashley M. Nelson, John J. Vajo, Hardik Dalal, Panagiotis Emanuel George, Xin N. Guan, James Hillard Davis, Jr.
  • Patent number: 11167451
    Abstract: Disclosed are methods and apparatus for recovering fibers from fiber reinforced polymers wherein the fiber reinforced polymer is contacted with a Lewis base for a time sufficient to allow at least partial depolymerization of the polymer.
    Type: Grant
    Filed: August 3, 2018
    Date of Patent: November 9, 2021
    Assignee: The Boeing Company
    Inventors: Adam F. Gross, Adam E. Sorensen, John J. Vajo, Hardik Dalal, Panagiotis Emanuel George, Xin N. Guan
  • Patent number: 10889072
    Abstract: The present disclosure is directed to a method of making a composite part. The method comprises covering a mold tool for a composite part with a parting film. The method further comprises laying up at least one layer of pre-preg on the parting film covering the mold tool to form a laid-up composite part and removing the laid-up composite part from the parting film. The parting film comprises a polymer sheet having a first major surface and a second major surface; and a first adhesive disposed on the first major surface of the polymer sheet, the first adhesive adhering the polymer sheet to the mold tool.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: January 12, 2021
    Assignee: The Boeing Company
    Inventors: Hardik Dalal, Alain A. Adjorlolo, Adam F. Gross, Andrew P. Nowak, Brad Andrew Coxon, Kurtis Willden, Daniel M. Rotter, Stephen Lee Metschan, Berryinne Decker
  • Publication number: 20200239357
    Abstract: A composition comprising a Lewis base containing depolymerization liquid and methods of using the Lewis base depolymerization liquid to depolymerize the polymer component of fiber reinforced polymers to form free fibers.
    Type: Application
    Filed: April 10, 2020
    Publication date: July 30, 2020
    Inventors: Adam F. Gross, April R. Rodriguez, Ashley M. Nelson, John J. Vajo, Hardik Dalal, Panagiotis Emanuel George, Xin N. Guan, James Hillard Davis, JR.
  • Publication number: 20200207940
    Abstract: Methods and compositions for depolymerizing the polymer component of fiber reinforced polymers to facilitate the recovery of free fibers.
    Type: Application
    Filed: March 9, 2020
    Publication date: July 2, 2020
    Inventors: Adam F. Gross, John J. Vajo, Ashley M. Nelson, April R. Rodriguez, Hardik Dalal, Panagiotis E. George
  • Patent number: 10662108
    Abstract: A composition comprising a Lewis base containing depolymerization liquid and methods of using the Lewis base depolymerization liquid to depolymerize the polymer component of fiber reinforced polymers to form free fibers.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: May 26, 2020
    Assignee: The Boeing Company
    Inventors: Adam F. Gross, April R. Rodriguez, Ashley M. Nelson, John J. Vajo, Hardik Dalal, Panagiotis Emanuel George, Xin N. Guan, James Hillard Davis, Jr.
  • Publication number: 20200122442
    Abstract: Disclosed herein is a composite sandwich panel that includes a first face portion with fully consolidated comingled first fibers and a first thermoplastic matrix. The composite sandwich panel also includes a second face portion with fully consolidated comingled second fibers and a second thermoplastic matrix. Additionally, the composite sandwich panel includes at least one core portion with partially consolidated comingled third fibers and a third thermoplastic matrix. The at least one core portion is interposed between the first and second face portions. The first thermoplastic matrix is melded with the third thermoplastic matrix and the second thermoplastic matrix is melded with the third thermoplastic. A density of the fibers across a thickness of the composite panel is non-uniform.
    Type: Application
    Filed: December 17, 2019
    Publication date: April 23, 2020
    Inventors: Hardik Dalal, Panagiotis E. George, Kelsi M. Hurley, Ashley C. Tracey
  • Patent number: 10611892
    Abstract: Methods and compositions for depolymerizing the polymer component of fiber reinforced polymers to facilitate the recovery of free fibers.
    Type: Grant
    Filed: April 7, 2017
    Date of Patent: April 7, 2020
    Assignee: The Boeing Company
    Inventors: Adam F. Gross, John J. Vajo, Ashley M. Nelson, April R. Rodriguez, Hardik Dalal, Panagiotis E. George
  • Patent number: 10595428
    Abstract: A composite part comprising an electronic device and method for making the same. A primer is deposited on a surface of the composite part. An electronic device comprising a group of conductive elements is deposited on the primer. An embodiment may include the group of conductive elements within a layer of material co-bonded to the composite part. Power may be supplied to a device connected to the composite part through current flowing through the group of conductive elements.
    Type: Grant
    Filed: August 27, 2018
    Date of Patent: March 17, 2020
    Assignee: The Boeing Company
    Inventors: Hardik Dalal, Jeffrey Lynn Duce, Yelina Rosillo, Brent A. Robbins, Breana K. Merriweather
  • Publication number: 20200055261
    Abstract: Methods of co-bonding a first thermoset composite (TSC) and a second TSC to define a cured composite part are disclosed herein. The methods include partially curing the first TSC to a target state of cure (SOC) to define a first partially cured TSC. The partially curing is based, at least in part, on a maximum temperature of the first TSC during the partially curing and on an elapsed time that an actual temperature of the first TSC is greater than a threshold temperature. The methods further include combining the first partially cured TSC with the second TSC to define a partially cured TSC assembly and heating the partially cured TSC assembly to bond the first partially cured TSC to the second TSC, cure the partially cured TSC assembly, and produce a cured composite part.
    Type: Application
    Filed: March 15, 2018
    Publication date: February 20, 2020
    Inventors: Karl M. Nelson, Travis James Sherwood, Hardik Dalal, Felix N. Nguyen, Dongyeon Lee, Kenichi Yoshioka, Hideo Andrew Koyanagi
  • Publication number: 20200039115
    Abstract: Disclosed are methods and apparatus for recovering fibers from fiber reinforced polymers wherein the fiber reinforced polymer is contacted with a Lewis base for a time sufficient to allow at least partial depolymerization of the polymer.
    Type: Application
    Filed: August 3, 2018
    Publication date: February 6, 2020
    Inventors: Adam F. Gross, Adam E. Sorensen, John J. Vajo, Hardik Dalal, Panagiotis Emanuel George, Xin N. Guan
  • Patent number: 10543666
    Abstract: Disclosed herein is a composite sandwich panel that includes a first face portion with fully consolidated comingled first fibers and a first thermoplastic matrix. The composite sandwich panel also includes a second face portion with fully consolidated comingled second fibers and a second thermoplastic matrix. Additionally, the composite sandwich panel includes at least one core portion with partially consolidated comingled third fibers and a third thermoplastic matrix. The at least one core portion is interposed between the first and second face portions. The first thermoplastic matrix is melded with the third thermoplastic matrix and the second thermoplastic matrix is melded with the third thermoplastic. A density of the fibers across a thickness of the composite panel is non-uniform.
    Type: Grant
    Filed: June 29, 2015
    Date of Patent: January 28, 2020
    Assignee: The Boeing Company
    Inventors: Hardik Dalal, Panagiotis E. George, Kelsi M. Hurley, Ashley C. Tracey
  • Publication number: 20200009765
    Abstract: Systems and methods of curing a thermoset composite (TSC) to a target state of cure (SOC) are disclosed herein. The methods include heating the thermoset composite to greater than a threshold temperature. During the heating, the methods further include monitoring an actual temperature of the thermoset composite, determining a maximum temperature achieved by the thermoset composite, and determining an elapsed time that the actual temperature of the thermoset composite is greater than the threshold temperature. The methods further include ceasing the heating based, at least in part, on the maximum temperature of the TSC and the elapsed time. The systems include a heating assembly, a support mandrel, a thermoset composite, a temperature detector, and a controller programmed to perform the methods.
    Type: Application
    Filed: March 15, 2018
    Publication date: January 9, 2020
    Inventors: Hardik Dalal, Karl M. Nelson, Travis James Sherwood, Felix N. Nguyen
  • Publication number: 20190283341
    Abstract: The present disclosure is directed to a method of making a composite part. The method comprises covering a mold tool for a composite part with a parting film. The method further comprises laying up at least one layer of pre-preg on the parting film covering the mold tool to form a layed-up composite part and removing the layed-up composite part from the parting film. The parting film comprises a polymer sheet having a first major surface and a second major surface; and a first adhesive disposed on the first major surface of the polymer sheet, the first adhesive adhering the polymer sheet to the mold tool.
    Type: Application
    Filed: June 3, 2019
    Publication date: September 19, 2019
    Applicant: The Boeing Company
    Inventors: Hardik Dalal, Alain A. Adjorlolo, Adam F. Gross, Andrew P. Nowak, Brad Andrew Coxon, Kurtis Willden, Daniel M. Rotter, Stephen Lee Metschan, Berryinne Decker