Abstract: A semiconductor package carrier used to support a semiconductor package (e.g., a semiconductor, a microprocessor, etc.) as the semiconductor package is moved from a shipping tray to a land grid array (LGA) socket during assembly of an electronic device. The semiconductor package carrier including a carrier body including a plurality of support structures arranged to support a portion of the semiconductor package. The semiconductor package carrier further including a locking structure moveable between a first position and a second position, wherein the first position allows the support structures to receive the semiconductor package and the second position secures the semiconductor package to the carrier body. In some embodiments, the semiconductor package carrier may also include a thermal interface material (TIM) breaker to facilitate removal of a heatsink from the semiconductor package. Other embodiments are described and claimed.

Abstract: In one embodiment, an additive manufacturing system includes a dispensing nozzle configured to dispense material to be used to manufacture a component, a barrel to which the nozzle is mounted, the barrel being configured to deliver the material to the dispensing nozzle, a barrel heater that surrounds the barrel, the barrel heater including a heating element configured to heat the barrel heater, the nozzle, and the material contained within the nozzle before it is dispensed from the nozzle, and a supplemental heater configured to heat previously deposited material so as to increase bonding and merging of the material that is being dispensed with the previously deposited material.

Abstract: Disclosed herein is a system comprising a) a nozzle comprising an aperture configured to dispense a material to form a material layer on a build plate, and b) one or more members positioned in a spatial configuration along the x and z-axis relative to the nozzle such that the one or more members are configured to apply a compression load on the layer of the material and to form a manufactured part having a reduced void fraction.

Abstract: Techniques and mechanisms for enabling a flow of fluid through microchannels of a fluid conduit, which is thermally coupled to cool integrated circuitry. In an embodiment, sidewall structures of the fluid conduit extend from a base structure to form at least in part microchannels, which extend along the base structure. The sidewall structures accommodate a flow of a coolant fluid through the fluid conduit, where the flow in turn facilitates conduction of heat, which has been transferred to the fluid conduit from the integrated circuitry. The sidewall structures comprise pores, which extend through a corresponding sidewall structure between two microchannel regions. In another embodiment, a sidewall structure provides a gradient of average porosity along one or more dimensions.

Abstract: In one embodiment, an additive manufacturing system includes a dispensing nozzle configured to dispense material to be used to manufacture a component, a barrel to which the nozzle is mounted, the barrel being configured to deliver the material to the dispensing nozzle, a barrel heater that surrounds the barrel, the barrel heater including a heating element configured to heat the barrel heater, the nozzle, and the material contained within the nozzle before it is dispensed from the nozzle, and a supplemental heater configured to heat previously deposited material so as to increase bonding and merging of the material that is being dispensed with the previously deposited material.