Abstract: A method for packaging discrete and integrated circuit (IC) die each having a pattern of input/output (I/O) pads has steps of (a) forming a first pattern of openings through a thickness of a silicon substrate wafer in a plurality of die attach positions, and metallizing through the openings; (b) attaching the IC die to a first surface of the wafer in individual ones of the plurality of positions; (c) electrically connecting individual ICs from the I/O pads to the metallized vias; (d) covering the attached and I/O-connected ICs on the first surface with an encapsulation material, forming a laminate encapsulating the ICs on the wafer; and (e) singulating the laminate into individual packages comprising at least one encapsulated IC on a silicon substrate having a pattern of electrical contacts on an outside surface of the substrate communicating electrically with I/O pads on the encapsulated IC. The substrate wafer can be a reclaimed wafer.