Patents by Inventor Haresh Siriwardane
Haresh Siriwardane has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11001529Abstract: A crucible includes an outer element and an inner element. The outer element includes a first portion that is horizontal at a bottom end of the crucible and a second portion that ascends radially outwardly from the bottom end of the crucible to a top end of the crucible at a first acute angle to a vertical axis. The inner element includes a conus with a cylinder at a base of the conus. The conus descends radially outwardly from the top end of the crucible to the bottom end of the crucible at a second acute angle to the vertical axis. The inner element includes a base portion of the cylinder attached to the first portion of the outer element using a sealant to form a hollow mold between an inner portion of the outer element and an outer portion of the inner element.Type: GrantFiled: May 24, 2018Date of Patent: May 11, 2021Assignee: SILFEX, INC.Inventors: Rong Wang, Haresh Siriwardane, Igor Peidous, Vijay Nithianathan
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Patent number: 10724796Abstract: A furnace includes a pedestal, a crucible, first and second heaters, and a controller. The crucible is arranged on a pedestal that is movable downwardly and is rotatable. The first and second heaters are spaced vertically along an outer wall of the crucible and are arranged around the crucible to heat pieces of solid material deposited in the crucible. A third heater is arranged above the crucible if the crucible includes a solid cylindrical mold or in a hollow cylindrical space of the crucible if the crucible includes a hollow cylindrical mold. The controller is configured to control the first and second heaters to heat the pieces of the solid material to form a melted liquid. The controller is configured to control the rotational and downward movements of the pedestal relative to the first and second heaters during solidification of the melted liquid to form an ingot.Type: GrantFiled: May 24, 2018Date of Patent: July 28, 2020Assignee: SILFEX, INCInventors: Rong Wang, Haresh Siriwardane, Vijay Nithiananthan
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Publication number: 20190360750Abstract: A furnace includes a pedestal, a crucible, first and second heaters, and a controller. The crucible is arranged on a pedestal that is movable downwardly and is rotatable. The first and second heaters are spaced vertically along an outer wall of the crucible and are arranged around the crucible to heat pieces of solid material deposited in the crucible. A third heater is arranged above the crucible if the crucible includes a solid cylindrical mold or in a hollow cylindrical space of the crucible if the crucible includes a hollow cylindrical mold. The controller is configured to control the first and second heaters to heat the pieces of the solid material to form a melted liquid. The controller is configured to control the rotational and downward movements of the pedestal relative to the first and second heaters during solidification of the melted liquid to form an ingot.Type: ApplicationFiled: May 24, 2018Publication date: November 28, 2019Inventors: Rong WANG, Haresh SIRIWARDANE, Vijay NITHIANATHAN
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Publication number: 20190359529Abstract: A crucible includes an outer element and an inner element. The outer element includes a first portion that is horizontal at a bottom end of the crucible and a second portion that ascends radially outwardly from the bottom end of the crucible to a top end of the crucible at a first acute angle to a vertical axis. The inner element includes a conus with a cylinder at a base of the conus. The conus descends radially outwardly from the top end of the crucible to the bottom end of the crucible at a second acute angle to the vertical axis. The inner element includes a base portion of the cylinder attached to the first portion of the outer element using a sealant to form a hollow mold between an inner portion of the outer element and an outer portion of the inner element.Type: ApplicationFiled: May 24, 2018Publication date: November 28, 2019Inventors: Rong WANG, Haresh Siriwardane, Igor Peidous, Vijay Nithianathan
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Patent number: 10415149Abstract: A system comprises a silicon seed arranged on a pedestal, where the silicon seed is ring shaped and is configured to receive melted silicon at a feed rate to form an ingot, and where the pedestal is configured to rotate at a rotational speed. A controller is configured to, while the silicon seed receives the melted silicon and while the ingot is forming: receive feedback regarding a diameter of the ingot and regarding an angle of a meniscus of the ingot, and control the rotational speed of the pedestal and the feed rate of the melted silicon based on the feedback to control the diameter of the ingot and the angle of the meniscus of the ingot.Type: GrantFiled: March 13, 2018Date of Patent: September 17, 2019Assignee: SILFEX, INC.Inventors: George David Stephen Hudelson, Igor Peidous, Haresh Siriwardane, Steven M. Joslin, Jihong Chen
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Publication number: 20180282898Abstract: A system comprises a silicon seed arranged on a pedestal, where the silicon seed is ring shaped and is configured to receive melted silicon at a feed rate to form an ingot, and where the pedestal is configured to rotate at a rotational speed.Type: ApplicationFiled: March 13, 2018Publication date: October 4, 2018Inventors: George David Stephen Hudelson, Igor Peidous, Haresh Siriwardane, Steven M. Joslin, Jihong Chen
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Patent number: 9358659Abstract: The invention provides a chemical-mechanical polishing composition containing (a) abrasive particles, (b) a polymer, and (c) water, wherein (i) the polymer possesses an overall charge, (ii) the abrasive particles have a zeta potential Za measured in the absence of the polymer and the abrasive particles have a zeta potential Zb measured in the presence of the polymer, wherein the zeta potential Za is a numerical value that is the same sign as the overall charge of the polymer, and (iii) |zeta potential Zb|>|zeta potential Za|. The invention also provides a method of polishing a substrate with the polishing composition.Type: GrantFiled: March 4, 2013Date of Patent: June 7, 2016Assignee: Cabot Microelectronics CorporationInventors: Hon Wu Lau, Haresh Siriwardane
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Patent number: 9330703Abstract: The invention provides a chemical-mechanical polishing composition comprising alpha alumina, fumed alumina, silica, an oxidizing agent that oxidizes nickel-phosphorous, a complexing agent, and water. The invention also provides a method of chemically-mechanically polishing a substrate comprising contacting a substrate with a polishing pad and the chemical-mechanical polishing composition, moving the polishing pad and the polishing composition relative to the substrate, and abrading at least a portion of the substrate to polish the substrate.Type: GrantFiled: June 4, 2009Date of Patent: May 3, 2016Assignee: Cabot Microelectronics CorporationInventors: Selvaraj Palanisamy Chinnathambi, Haresh Siriwardane
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Patent number: 9039914Abstract: The invention provides a chemical-mechanical polishing composition containing wet-process silica, an oxidizing agent that oxidizes nickel-phosphorous, a chelating agent, polyvinyl alcohol, and water. The invention also provides a method of chemically-mechanically polishing a substrate, especially a nickel-phosphorous substrate, by contacting a substrate with a polishing pad and the chemical-mechanical polishing composition, moving the polishing pad and the polishing composition relative to the substrate, and abrading at least a portion of the substrate to polish the substrate.Type: GrantFiled: May 23, 2012Date of Patent: May 26, 2015Assignee: Cabot Microelectronics CorporationInventors: Selvaraj Palanisamy Chinnathambi, Haresh Siriwardane
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Publication number: 20140248823Abstract: The invention provides a chemical-mechanical polishing composition containing (a) abrasive particles, (b) a polymer, and (c) water, wherein (i) the polymer possesses an overall charge, (ii) the abrasive particles have a zeta potential Za measured in the absence of the polymer and the abrasive particles have a zeta potential Zb measured in the presence of the polymer, wherein the zeta potential Za is a numerical value that is the same sign as the overall charge of the polymer, and (iii) |zeta potential Zb|>|zeta potential Za|. The invention also provides a method of polishing a substrate with the polishing composition.Type: ApplicationFiled: March 4, 2013Publication date: September 4, 2014Applicant: CABOT MICROELECTRONICS CORPORATIONInventors: Hon Wu Lau, Haresh Siriwardane
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Publication number: 20130313226Abstract: The invention provides a chemical-mechanical polishing composition containing wet-process silica, an oxidizing agent that oxidizes nickel-phosphorous, a chelating agent, polyvinyl alcohol, and water. The invention also provides a method of chemically-mechanically polishing a substrate, especially a nickel-phosphorous substrate, by contacting a substrate with a polishing pad and the chemical-mechanical polishing composition, moving the polishing pad and the polishing composition relative to the substrate, and abrading at least a portion of the substrate to polish the substrate.Type: ApplicationFiled: May 23, 2012Publication date: November 28, 2013Applicant: CABOT MICROELECTRONICS CORPORATIONInventors: Selvaraj Palanisamy Chinnathambi, Haresh Siriwardane
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Patent number: 8557137Abstract: The invention provides a chemical-mechanical polishing composition comprising alpha alumina, fumed alumina, silica, an oxidizing agent that oxidizes nickel-phosphorous, oxalic acid, optionally, tartaric acid, optionally, a nonionic surfactant, optionally, a biocide, and water. The invention also provides a method of chemically-mechanically polishing a substrate comprising contacting a substrate with a polishing pad and the chemical-mechanical polishing composition, moving the polishing pad and the polishing composition relative to the substrate, and abrading at least a portion of the substrate to polish the substrate.Type: GrantFiled: July 11, 2012Date of Patent: October 15, 2013Assignee: Cabot Microelectronics CorporationInventors: Selvaraj Palanisamy Chinnathambi, Haresh Siriwardane
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Patent number: 8518135Abstract: The invention provides a polishing composition that contains (a) an abrasive comprising (i) first alpha alumina particles that have an average aspect ratio of 0.8:1 to 1.2:1, (ii) second alpha alumina that have an average aspect ratio of greater than 1.2:1, (iii) fumed alumina particles, and (iv) wet-process silica particles, and (b) water. The invention also provides a method of polishing a substrate, especially a nickel-phosphorous substrate, with the polishing composition.Type: GrantFiled: August 27, 2012Date of Patent: August 27, 2013Assignee: Cabot Microelectronics CorporationInventors: Rujee Lorpitthaya, Selvaraj Palanisamy Chinnathambi, Haresh Siriwardane
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Publication number: 20120273715Abstract: The invention provides a chemical-mechanical polishing composition comprising alpha alumina, fumed alumina, silica, an oxidizing agent that oxidizes nickel-phosphorous, oxalic acid, optionally, tartaric acid, optionally, a nonionic surfactant, optionally, a biocide, and water. The invention also provides a method of chemically-mechanically polishing a substrate comprising contacting a substrate with a polishing pad and the chemical-mechanical polishing composition, moving the polishing pad and the polishing composition relative to the substrate, and abrading at least a portion of the substrate to polish the substrate.Type: ApplicationFiled: July 11, 2012Publication date: November 1, 2012Inventors: Selvaraj PALANISAMY CHINNATHAMBI, Haresh SIRIWARDANE
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Patent number: 8226841Abstract: The invention provides a chemical-mechanical polishing composition comprising alpha alumina, fumed alumina, silica, an oxidizing agent that oxidizes nickel-phosphorous, oxalic acid, optionally, tartaric acid, optionally, a nonionic surfactant, optionally, a biocide, and water. The invention also provides a method of chemically-mechanically polishing a substrate comprising contacting a substrate with a polishing pad and the chemical-mechanical polishing composition, moving the polishing pad and the polishing composition relative to the substrate, and abrading at least a portion of the substrate to polish the substrate.Type: GrantFiled: February 3, 2009Date of Patent: July 24, 2012Assignee: Cabot Microelectronics CorporationInventors: Selvaraj Palanisamy Chinnathambi, Haresh Siriwardane
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Publication number: 20100308016Abstract: The invention provides a chemical-mechanical polishing composition comprising alpha alumina, fumed alumina, silica, an oxidizing agent that oxidizes nickel-phosphorous, a complexing agent, and water. The invention also provides a method of chemically-mechanically polishing a substrate comprising contacting a substrate with a polishing pad and the chemical-mechanical polishing composition, moving the polishing pad and the polishing composition relative to the substrate, and abrading at least a portion of the substrate to polish the substrate.Type: ApplicationFiled: June 4, 2009Publication date: December 9, 2010Inventors: Selvaraj Palanisamy Chinnathambi, Haresh Siriwardane
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Publication number: 20100193470Abstract: The invention provides a chemical-mechanical polishing composition comprising alpha alumina, fumed alumina, silica, an oxidizing agent that oxidizes nickel-phosphorous, oxalic acid, optionally, tartaric acid, optionally, a nonionic surfactant, optionally, a biocide, and water. The invention also provides a method of chemically-mechanically polishing a substrate comprising contacting a substrate with a polishing pad and the chemical-mechanical polishing composition, moving the polishing pad and the polishing composition relative to the substrate, and abrading at least a portion of the substrate to polish the substrate.Type: ApplicationFiled: February 3, 2009Publication date: August 5, 2010Applicant: Cabot Microelectronics CorporationInventors: Selvaraj Palanisamy Chinnathambi, Haresh Siriwardane
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Patent number: 6648967Abstract: A crystal-pulling apparatus for pulling and growing a monocrystalline silicon ingot comprises a quartz crucible placed in a chamber and containing a silicon melt from which a monocrystalline silicon ingot will be pulled, a graphite crucible container to support the quartz crucible by surrounding the outer circumferential surface and external base surface of crucible, and a heater provided around the outer circumferential surface of the crucible container to heat the silicon melt. This apparatus further comprises a spacer having a top surface whose area is smaller than the base area of the quartz crucible and having a melting point higher than that of silicon, is inserted between the base of the quartz crucible and the base of the crucible container while the monocrystalline silicon ingot is pulled.Type: GrantFiled: November 20, 2001Date of Patent: November 18, 2003Assignees: Mitsubishi Materials Silicon Corporation, Mitsubishi Silicon America CorporationInventors: Volker R. Todt, Rocky Oakley, Peter Wildes, Fritz Kirscht, Haresh Siriwardane, Joel Kearns
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Publication number: 20030084840Abstract: A crystal-pulling apparatus for pulling and growing a monocrystalline silicon ingot comprises a quartz crucible placed in a chamber and containing a silicon melt from which a monocrystalline silicon ingot will be pulled, a graphite crucible container to support the quartz crucible by surrounding the outer circumferential surface and external base surface of crucible, and a heater provided around the outer circumferential surface of the crucible container to heat the silicon melt. This apparatus further comprises a spacer having a top surface whose area is smaller than the base area of the quartz crucible and having a melting point higher than that of silicon, is inserted between the base of the quartz crucible and the base of the crucible container while the monocrystalline silicon ingot is pulled.Type: ApplicationFiled: November 20, 2001Publication date: May 8, 2003Inventors: Volker R. Todt, Rocky Oakley, Peter Wildes, Fritz Kirscht, Haresh Siriwardane, Joel Kearns