Patents by Inventor Haretaro Hidaka

Haretaro Hidaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20150259971
    Abstract: A door part of a platform door apparatus includes: a panel member that has two metal plates and a honeycomb member sandwiched between the two metal plates; and a transparent member that has a transparent polycarbonate plate and a transparent glass plate thinner than the polycarbonate plate and entirely bonded to the polycarbonate plate and that is set in an opening formed in the panel member.
    Type: Application
    Filed: March 13, 2015
    Publication date: September 17, 2015
    Inventors: Haretaro HIDAKA, Kazuma YOSHIMOTO
  • Publication number: 20120297685
    Abstract: Provided is a platform screen door device capable of reducing total weight of the whole device and securing sufficient strength and durability thereof. The platform screen door device includes a door case provided on a platform; and a sliding door moving in and out of the door case. At least one of the door case and the sliding door includes a frame formed by integrating horizontal door case frame members and vertical door case frame members disposed orthogonally relative to each other, or by integrating horizontal door frame members and vertical door case frame members disposed orthogonally relative to each other, through fastening members using bolts and fixing members using adhesive or the like, supplemental for joint strength of the fastening members using the bolts.
    Type: Application
    Filed: May 22, 2012
    Publication date: November 29, 2012
    Applicant: Mitsubishi Heavy Industries Transportation Equipment Engineering & Service Co., Ltd.
    Inventors: Makoto KAWAMOTO, Haretaro HIDAKA
  • Patent number: 7640948
    Abstract: A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both surfaces of the integrated piping plate, and the instrument and the component, or the instrument, or the component are or is connected by fluid channel grooves formed in joining surfaces of the plates, and communication holes formed in the plates. The machining method welds the joining surfaces of the plates around the entire periphery of the fluid channel grooves, for example, by an FSW welding machine, to join the plates. Compared with joining of the plates by an adhesive, the machining method can increase the durability of the plate joining portion and increase pressure resistance. Also, the method can increase work efficiency and further downsize the integrated piping plate.
    Type: Grant
    Filed: August 28, 2007
    Date of Patent: January 5, 2010
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Haretaro Hidaka, Michio Tsukamoto
  • Publication number: 20090126814
    Abstract: A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both surfaces of the integrated piping plate, and the instrument and the component, or the instrument, or the component are or is connected by fluid channel grooves formed in joining surfaces of the plates, and communication holes formed in the plates. The machining method welds the joining surfaces of the plates around the entire periphery of the fluid channel grooves, for example, by an FSW welding machine, to join the plates. Compared with joining of the plates by an adhesive, the machining method can increase the durability of the plate joining portion and increase pressure resistance. Also, the method can increase work efficiency and further downsize the integrated piping plate.
    Type: Application
    Filed: January 14, 2009
    Publication date: May 21, 2009
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Haretaro Hidaka, Michio Tsukamoto
  • Patent number: 7434598
    Abstract: A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both surfaces of the integrated piping plate, and the instrument and the component, or the instrument, or the component are or is connected by fluid channel grooves formed in joining surfaces of the plates, and communication holes formed in the plates. The machining method welds the joining surfaces of the plates around the entire periphery of the fluid channel grooves, for example, by an FSW welding machine, to join the plates. Compared with joining of the plates by an adhesive, the machining method can increase the durability of the plate joining portion and increase pressure resistance. Also, the method can increase work efficiency and further downsize the integrated piping plate.
    Type: Grant
    Filed: August 28, 2007
    Date of Patent: October 14, 2008
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Haretaro Hidaka, Michio Tsukamoto
  • Publication number: 20080245516
    Abstract: In a heat exchanger plate, machine time required for processing can be shortened, production costs can be reduced, and a penetration bead of a weld can be prevented from intruding into a flow channel, thereby preventing the weld from deforming a cover section. The heat exchanger plate comprises: a flat main body on a surface of which is formed at least one first groove having a rectangular cross-sectional shape; and a cover which has substantially the same shape as the first groove in plan view and which is formed such that when embedded in the first groove, a rear face thereof contacts a bottom of the first groove and opposite side faces thereof contact opposite side faces of the first groove, and a surface thereof is substantially flush with that of the main body, wherein there is provided a second groove formed extending along the opposite side faces at a center of the rear face, and the cover is joined to the main body by friction stir welding.
    Type: Application
    Filed: September 20, 2007
    Publication date: October 9, 2008
    Inventors: Soichiro Ishikawa, Haretaro Hidaka, Seiji Matsushima
  • Publication number: 20080245517
    Abstract: In a heat exchanger plate freedom of design of the flow channel is improved. A flat main body on a surface of which is formed at least one first groove having a rectangular cross-sectional shape, and a second groove having a rectangular cross-sectional shape that is narrower than the first groove, and that is formed following along opposite side faces of the first groove at a center of a bottom face of the first groove; and a flat cover which covers an entire surface of the main body, and on a rear face of which is formed a protrusion whose top face contacts a bottom face of the first groove and whose opposite side faces contact opposite side faces of the first groove, when the cover is superposed on the surface of the main body, and which forms a flow channel by means of a top face thereof and the second groove, are joined by friction stir welding.
    Type: Application
    Filed: September 20, 2007
    Publication date: October 9, 2008
    Inventors: Soichiro Ishikawa, Haretaro Hidaka, Seiji Matsushima
  • Patent number: 7367360
    Abstract: A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both surfaces of the integrated piping plate, and the instrument and the component, or the instrument, or the component are or is connected by fluid channel grooves formed in joining surfaces of the plates, and communication holes formed in the plates. The machining method welds the joining surfaces of the plates around the entire periphery of the fluid channel grooves, for example, by an FSW welding machine, to join the plates. Compared with joining of the plates by an adhesive, the machining method can increase the durability of the plate joining portion and increase pressure resistance. Also, the method can increase work efficiency and further downsize the integrated piping plate.
    Type: Grant
    Filed: August 28, 2007
    Date of Patent: May 6, 2008
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Haretaro Hidaka, Michio Tsukamoto
  • Publication number: 20080011374
    Abstract: A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both surfaces of the integrated piping plate, and the instrument and the component, or the instrument, or the component are or is connected by fluid channel grooves formed in joining surfaces of the plates, and communication holes formed in the plates. The machining method welds the joining surfaces of the plates around the entire periphery of the fluid channel grooves, for example, by an FSW welding machine, to join the plates. Compared with joining of the plates by an adhesive, the machining method can increase the durability of the plate joining portion and increase pressure resistance. Also, the method can increase work efficiency and further downsize the integrated piping plate.
    Type: Application
    Filed: August 28, 2007
    Publication date: January 17, 2008
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Haretaro Hidaka, Michio Tsukamoto
  • Publication number: 20080011367
    Abstract: A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both surfaces of the integrated piping plate, and the instrument and the component, or the instrument, or the component are or is connected by fluid channel grooves formed in joining surfaces of the plates, and communication holes formed in the plates. The machining method welds the joining surfaces of the plates around the entire periphery of the fluid channel grooves, for example, by an FSW welding machine, to join the plates. Compared with joining of the plates by an adhesive, the machining method can increase the durability of the plate joining portion and increase pressure resistance. Also, the method can increase work efficiency and further downsize the integrated piping plate.
    Type: Application
    Filed: August 28, 2007
    Publication date: January 17, 2008
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Haretaro Hidaka, Michio Tsukamoto
  • Publication number: 20080000945
    Abstract: A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both surfaces of the integrated piping plate, and the instrument and the component, or the instrument, or the component are or is connected by fluid channel grooves formed in joining surfaces of the plates, and communication holes formed in the plates. The machining method welds the joining surfaces of the plates around the entire periphery of the fluid channel grooves, for example, by an FSW welding machine, to join the plates. Compared with joining of the plates by an adhesive, the machining method can increase the durability of the plate joining portion and increase pressure resistance. Also, the method can increase work efficiency and further downsize the integrated piping plate.
    Type: Application
    Filed: August 28, 2007
    Publication date: January 3, 2008
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Haretaro Hidaka, Michio Tsukamoto
  • Publication number: 20080000621
    Abstract: A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both surfaces of the integrated piping plate, and the instrument and the component, or the instrument, or the component are or is connected by fluid channel grooves formed in joining surfaces of the plates, and communication holes formed in the plates. The machining method welds the joining surfaces of the plates around the entire periphery of the fluid channel grooves, for example, by an FSW welding machine, to join the plates. Compared with joining of the plates by an adhesive, the machining method can increase the durability of the plate joining portion and increase pressure resistance. Also, the method can increase work efficiency and further downsize the integrated piping plate.
    Type: Application
    Filed: August 28, 2007
    Publication date: January 3, 2008
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Haretaro Hidaka, Michio Tsukamoto
  • Patent number: 7156277
    Abstract: A friction stir welding (FSW) method and apparatus are provided by which power needed for FSW is reduced and a compact FSW tool can be used. In the FSW method, metal members are lapped one on another and a rotating probe of an FSW tool is inserted into a contact portion of the metal members. The contact portion is softened by frictional heat and stirred by the probe so that the metal members are welded together. A portion of the metal members surrounding the probe is heated by a heater.
    Type: Grant
    Filed: August 23, 2005
    Date of Patent: January 2, 2007
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Soichiro Ishikawa, Haretaro Hidaka
  • Publication number: 20060065698
    Abstract: Friction stir welding (FSW) method and apparatus are provided by which power needed for the FSW is reduced and a compact FSW tool can be used. In the FSW method comprising the steps of lapping metal members one on another and inserting a rotating probe of a FSW tool into a contact portion of the metal members making contact with the probe so that the contact portion is softened by frictional heat and stirred by the probe and the metal members are welded together, a portion of the metal members surrounding the probe is heated by a heating means.
    Type: Application
    Filed: August 23, 2005
    Publication date: March 30, 2006
    Inventors: Soichiro Ishikawa, Haretaro Hidaka
  • Patent number: 7017792
    Abstract: A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both surfaces of the integrated piping plate, and the instrument and the component, or the instrument, or the component are or is connected by fluid channel grooves formed in joining surfaces of the plates, and communication holes formed in the plates. The machining method welds the joining surfaces of the plates around the entire periphery of the fluid channel grooves, for example, by an FSW welding machine, to join the plates. Compared with joining of the plates by an adhesive, the machining method can increase the durability of the plate joining portion and increase pressure resistance. Also, the method can increase work efficiency and further downsize the integrated piping plate.
    Type: Grant
    Filed: January 29, 2002
    Date of Patent: March 28, 2006
    Assignee: Mitsubishi Heavy Industries, Ltd.
    Inventors: Haretaro Hidaka, Michio Tsukamoto
  • Publication number: 20060019144
    Abstract: A channel-incorporating pedestal comprising a first plate and a second plate joined together, incorporating a groove, which is formed on a joining surface of the first plate, as a channel for a fluid, and bringing the groove into communication with an instrument, which is placed on a surface of the first plate, via a communication hole formed in the first plate, and wherein the first plate comprises an anticorrosive material, the second plate comprises a metallic material, and the fist plate and the second plate are bonded together by an adhesive protective sheet interposed between the first plate and the second plate, the adhesive protective sheet having a lower melting point than melting points of the first plate and the second plate, and being thermoplastic and anticorrosive.
    Type: Application
    Filed: July 6, 2005
    Publication date: January 26, 2006
    Inventors: Haretaro Hidaka, Michio Tsukamoto
  • Publication number: 20050035174
    Abstract: A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both surfaces of the integrated piping plate, and the instrument and the component, or the instrument, or the component are or is connected by fluid channel grooves formed in joining surfaces of the plates, and communication holes formed in the plates. The machining method welds the joining surfaces of the plates around the entire periphery of the fluid channel grooves, for example, by an FSW welding machine, to join the plates. Compared with joining of the plates by an adhesive, the machining method can increase the durability of the plate joining portion and increase pressure resistance.
    Type: Application
    Filed: July 6, 2004
    Publication date: February 17, 2005
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Haretaro Hidaka, Michio Tsukamoto
  • Publication number: 20040232206
    Abstract: A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both surfaces of the integrated piping plate, and the instrument and the component, or the instrument, or the component are or is connected by fluid channel grooves formed in joining surfaces of the plates, and communication holes formed in the plates. The machining method welds the joining surfaces of the plates around the entire periphery of the fluid channel grooves, for example, by an FSW welding machine, to join the plates. Compared with joining of the plates by an adhesive, the machining method can increase the durability of the plate joining portion and increase pressure resistance. Also, the method can increase work efficiency and further downsize the integrated piping plate.
    Type: Application
    Filed: June 25, 2004
    Publication date: November 25, 2004
    Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Haretaro Hidaka, Michio Tsukamoto
  • Publication number: 20020108740
    Abstract: A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both surfaces of the integrated piping plate, and the instrument and the component, or the instrument, or the component are or is connected by fluid channel grooves formed in joining surfaces of the plates, and communication holes formed in the plates. The machining method welds the joining surfaces of the plates around the entire periphery of the fluid channel grooves, for example, by an FSW welding machine, to join the plates. Compared with joining of the plates by an adhesive, the machining method can increase the durability of the plate joining portion and increase pressure resistance. Also, the method can increase work efficiency and further downsize the integrated piping plate.
    Type: Application
    Filed: January 29, 2002
    Publication date: August 15, 2002
    Inventors: Haretaro Hidaka, Michio Tsukamoto
  • Patent number: 5248236
    Abstract: A transfer system includes an air table, and a linear motor cooperating with the air table to float and move a pallet. The transfer system is designed to allow for a small radius of curvature for each turning section of the air table. Ball valves of the air table are openable upon contact with a pallet to apply air under pressure to a pallet. A linear motor is adapted to move the floating pallet, and guides are provided to guide the moving floating pallet. The pallet includes a pallet body made of a light material, and an external load part made of metal. The external load part has a lower surface projecting slightly from the lower surface of the pallet body. Guides are mounted to the outer periphery of the pallet body. A linear motor secondary conductor is mounted to the lower surface of the pallet body.
    Type: Grant
    Filed: August 1, 1991
    Date of Patent: September 28, 1993
    Assignees: Mitsubishi Jukogyo Kabushiki Kaisha, Asahi Glass Company Ltd.
    Inventors: Tadayoshi Ooshima, Haretaro Hidaka, Yoshihiro Tsuchimoto, Naoya Shimizu