Patents by Inventor Haretaro Hidaka
Haretaro Hidaka has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Publication number: 20150259971Abstract: A door part of a platform door apparatus includes: a panel member that has two metal plates and a honeycomb member sandwiched between the two metal plates; and a transparent member that has a transparent polycarbonate plate and a transparent glass plate thinner than the polycarbonate plate and entirely bonded to the polycarbonate plate and that is set in an opening formed in the panel member.Type: ApplicationFiled: March 13, 2015Publication date: September 17, 2015Inventors: Haretaro HIDAKA, Kazuma YOSHIMOTO
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Publication number: 20120297685Abstract: Provided is a platform screen door device capable of reducing total weight of the whole device and securing sufficient strength and durability thereof. The platform screen door device includes a door case provided on a platform; and a sliding door moving in and out of the door case. At least one of the door case and the sliding door includes a frame formed by integrating horizontal door case frame members and vertical door case frame members disposed orthogonally relative to each other, or by integrating horizontal door frame members and vertical door case frame members disposed orthogonally relative to each other, through fastening members using bolts and fixing members using adhesive or the like, supplemental for joint strength of the fastening members using the bolts.Type: ApplicationFiled: May 22, 2012Publication date: November 29, 2012Applicant: Mitsubishi Heavy Industries Transportation Equipment Engineering & Service Co., Ltd.Inventors: Makoto KAWAMOTO, Haretaro HIDAKA
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Patent number: 7640948Abstract: A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both surfaces of the integrated piping plate, and the instrument and the component, or the instrument, or the component are or is connected by fluid channel grooves formed in joining surfaces of the plates, and communication holes formed in the plates. The machining method welds the joining surfaces of the plates around the entire periphery of the fluid channel grooves, for example, by an FSW welding machine, to join the plates. Compared with joining of the plates by an adhesive, the machining method can increase the durability of the plate joining portion and increase pressure resistance. Also, the method can increase work efficiency and further downsize the integrated piping plate.Type: GrantFiled: August 28, 2007Date of Patent: January 5, 2010Assignee: Mitsubishi Heavy Industries, Ltd.Inventors: Haretaro Hidaka, Michio Tsukamoto
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Publication number: 20090126814Abstract: A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both surfaces of the integrated piping plate, and the instrument and the component, or the instrument, or the component are or is connected by fluid channel grooves formed in joining surfaces of the plates, and communication holes formed in the plates. The machining method welds the joining surfaces of the plates around the entire periphery of the fluid channel grooves, for example, by an FSW welding machine, to join the plates. Compared with joining of the plates by an adhesive, the machining method can increase the durability of the plate joining portion and increase pressure resistance. Also, the method can increase work efficiency and further downsize the integrated piping plate.Type: ApplicationFiled: January 14, 2009Publication date: May 21, 2009Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Haretaro Hidaka, Michio Tsukamoto
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Patent number: 7434598Abstract: A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both surfaces of the integrated piping plate, and the instrument and the component, or the instrument, or the component are or is connected by fluid channel grooves formed in joining surfaces of the plates, and communication holes formed in the plates. The machining method welds the joining surfaces of the plates around the entire periphery of the fluid channel grooves, for example, by an FSW welding machine, to join the plates. Compared with joining of the plates by an adhesive, the machining method can increase the durability of the plate joining portion and increase pressure resistance. Also, the method can increase work efficiency and further downsize the integrated piping plate.Type: GrantFiled: August 28, 2007Date of Patent: October 14, 2008Assignee: Mitsubishi Heavy Industries, Ltd.Inventors: Haretaro Hidaka, Michio Tsukamoto
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Publication number: 20080245516Abstract: In a heat exchanger plate, machine time required for processing can be shortened, production costs can be reduced, and a penetration bead of a weld can be prevented from intruding into a flow channel, thereby preventing the weld from deforming a cover section. The heat exchanger plate comprises: a flat main body on a surface of which is formed at least one first groove having a rectangular cross-sectional shape; and a cover which has substantially the same shape as the first groove in plan view and which is formed such that when embedded in the first groove, a rear face thereof contacts a bottom of the first groove and opposite side faces thereof contact opposite side faces of the first groove, and a surface thereof is substantially flush with that of the main body, wherein there is provided a second groove formed extending along the opposite side faces at a center of the rear face, and the cover is joined to the main body by friction stir welding.Type: ApplicationFiled: September 20, 2007Publication date: October 9, 2008Inventors: Soichiro Ishikawa, Haretaro Hidaka, Seiji Matsushima
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Publication number: 20080245517Abstract: In a heat exchanger plate freedom of design of the flow channel is improved. A flat main body on a surface of which is formed at least one first groove having a rectangular cross-sectional shape, and a second groove having a rectangular cross-sectional shape that is narrower than the first groove, and that is formed following along opposite side faces of the first groove at a center of a bottom face of the first groove; and a flat cover which covers an entire surface of the main body, and on a rear face of which is formed a protrusion whose top face contacts a bottom face of the first groove and whose opposite side faces contact opposite side faces of the first groove, when the cover is superposed on the surface of the main body, and which forms a flow channel by means of a top face thereof and the second groove, are joined by friction stir welding.Type: ApplicationFiled: September 20, 2007Publication date: October 9, 2008Inventors: Soichiro Ishikawa, Haretaro Hidaka, Seiji Matsushima
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Patent number: 7367360Abstract: A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both surfaces of the integrated piping plate, and the instrument and the component, or the instrument, or the component are or is connected by fluid channel grooves formed in joining surfaces of the plates, and communication holes formed in the plates. The machining method welds the joining surfaces of the plates around the entire periphery of the fluid channel grooves, for example, by an FSW welding machine, to join the plates. Compared with joining of the plates by an adhesive, the machining method can increase the durability of the plate joining portion and increase pressure resistance. Also, the method can increase work efficiency and further downsize the integrated piping plate.Type: GrantFiled: August 28, 2007Date of Patent: May 6, 2008Assignee: Mitsubishi Heavy Industries, Ltd.Inventors: Haretaro Hidaka, Michio Tsukamoto
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Publication number: 20080011374Abstract: A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both surfaces of the integrated piping plate, and the instrument and the component, or the instrument, or the component are or is connected by fluid channel grooves formed in joining surfaces of the plates, and communication holes formed in the plates. The machining method welds the joining surfaces of the plates around the entire periphery of the fluid channel grooves, for example, by an FSW welding machine, to join the plates. Compared with joining of the plates by an adhesive, the machining method can increase the durability of the plate joining portion and increase pressure resistance. Also, the method can increase work efficiency and further downsize the integrated piping plate.Type: ApplicationFiled: August 28, 2007Publication date: January 17, 2008Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Haretaro Hidaka, Michio Tsukamoto
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Publication number: 20080011367Abstract: A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both surfaces of the integrated piping plate, and the instrument and the component, or the instrument, or the component are or is connected by fluid channel grooves formed in joining surfaces of the plates, and communication holes formed in the plates. The machining method welds the joining surfaces of the plates around the entire periphery of the fluid channel grooves, for example, by an FSW welding machine, to join the plates. Compared with joining of the plates by an adhesive, the machining method can increase the durability of the plate joining portion and increase pressure resistance. Also, the method can increase work efficiency and further downsize the integrated piping plate.Type: ApplicationFiled: August 28, 2007Publication date: January 17, 2008Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Haretaro Hidaka, Michio Tsukamoto
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Publication number: 20080000945Abstract: A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both surfaces of the integrated piping plate, and the instrument and the component, or the instrument, or the component are or is connected by fluid channel grooves formed in joining surfaces of the plates, and communication holes formed in the plates. The machining method welds the joining surfaces of the plates around the entire periphery of the fluid channel grooves, for example, by an FSW welding machine, to join the plates. Compared with joining of the plates by an adhesive, the machining method can increase the durability of the plate joining portion and increase pressure resistance. Also, the method can increase work efficiency and further downsize the integrated piping plate.Type: ApplicationFiled: August 28, 2007Publication date: January 3, 2008Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Haretaro Hidaka, Michio Tsukamoto
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Publication number: 20080000621Abstract: A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both surfaces of the integrated piping plate, and the instrument and the component, or the instrument, or the component are or is connected by fluid channel grooves formed in joining surfaces of the plates, and communication holes formed in the plates. The machining method welds the joining surfaces of the plates around the entire periphery of the fluid channel grooves, for example, by an FSW welding machine, to join the plates. Compared with joining of the plates by an adhesive, the machining method can increase the durability of the plate joining portion and increase pressure resistance. Also, the method can increase work efficiency and further downsize the integrated piping plate.Type: ApplicationFiled: August 28, 2007Publication date: January 3, 2008Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Haretaro Hidaka, Michio Tsukamoto
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Patent number: 7156277Abstract: A friction stir welding (FSW) method and apparatus are provided by which power needed for FSW is reduced and a compact FSW tool can be used. In the FSW method, metal members are lapped one on another and a rotating probe of an FSW tool is inserted into a contact portion of the metal members. The contact portion is softened by frictional heat and stirred by the probe so that the metal members are welded together. A portion of the metal members surrounding the probe is heated by a heater.Type: GrantFiled: August 23, 2005Date of Patent: January 2, 2007Assignee: Mitsubishi Heavy Industries, Ltd.Inventors: Soichiro Ishikawa, Haretaro Hidaka
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Publication number: 20060065698Abstract: Friction stir welding (FSW) method and apparatus are provided by which power needed for the FSW is reduced and a compact FSW tool can be used. In the FSW method comprising the steps of lapping metal members one on another and inserting a rotating probe of a FSW tool into a contact portion of the metal members making contact with the probe so that the contact portion is softened by frictional heat and stirred by the probe and the metal members are welded together, a portion of the metal members surrounding the probe is heated by a heating means.Type: ApplicationFiled: August 23, 2005Publication date: March 30, 2006Inventors: Soichiro Ishikawa, Haretaro Hidaka
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Patent number: 7017792Abstract: A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both surfaces of the integrated piping plate, and the instrument and the component, or the instrument, or the component are or is connected by fluid channel grooves formed in joining surfaces of the plates, and communication holes formed in the plates. The machining method welds the joining surfaces of the plates around the entire periphery of the fluid channel grooves, for example, by an FSW welding machine, to join the plates. Compared with joining of the plates by an adhesive, the machining method can increase the durability of the plate joining portion and increase pressure resistance. Also, the method can increase work efficiency and further downsize the integrated piping plate.Type: GrantFiled: January 29, 2002Date of Patent: March 28, 2006Assignee: Mitsubishi Heavy Industries, Ltd.Inventors: Haretaro Hidaka, Michio Tsukamoto
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Publication number: 20060019144Abstract: A channel-incorporating pedestal comprising a first plate and a second plate joined together, incorporating a groove, which is formed on a joining surface of the first plate, as a channel for a fluid, and bringing the groove into communication with an instrument, which is placed on a surface of the first plate, via a communication hole formed in the first plate, and wherein the first plate comprises an anticorrosive material, the second plate comprises a metallic material, and the fist plate and the second plate are bonded together by an adhesive protective sheet interposed between the first plate and the second plate, the adhesive protective sheet having a lower melting point than melting points of the first plate and the second plate, and being thermoplastic and anticorrosive.Type: ApplicationFiled: July 6, 2005Publication date: January 26, 2006Inventors: Haretaro Hidaka, Michio Tsukamoto
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Publication number: 20050035174Abstract: A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both surfaces of the integrated piping plate, and the instrument and the component, or the instrument, or the component are or is connected by fluid channel grooves formed in joining surfaces of the plates, and communication holes formed in the plates. The machining method welds the joining surfaces of the plates around the entire periphery of the fluid channel grooves, for example, by an FSW welding machine, to join the plates. Compared with joining of the plates by an adhesive, the machining method can increase the durability of the plate joining portion and increase pressure resistance.Type: ApplicationFiled: July 6, 2004Publication date: February 17, 2005Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Haretaro Hidaka, Michio Tsukamoto
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Publication number: 20040232206Abstract: A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both surfaces of the integrated piping plate, and the instrument and the component, or the instrument, or the component are or is connected by fluid channel grooves formed in joining surfaces of the plates, and communication holes formed in the plates. The machining method welds the joining surfaces of the plates around the entire periphery of the fluid channel grooves, for example, by an FSW welding machine, to join the plates. Compared with joining of the plates by an adhesive, the machining method can increase the durability of the plate joining portion and increase pressure resistance. Also, the method can increase work efficiency and further downsize the integrated piping plate.Type: ApplicationFiled: June 25, 2004Publication date: November 25, 2004Applicant: MITSUBISHI HEAVY INDUSTRIES, LTD.Inventors: Haretaro Hidaka, Michio Tsukamoto
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Publication number: 20020108740Abstract: A machining method for an integrated piping plate, for example, composed of a plurality of plates joined together, and in which an instrument and a component constituting an apparatus, or the instrument, or the component are or is disposed on one surface or both surfaces of the integrated piping plate, and the instrument and the component, or the instrument, or the component are or is connected by fluid channel grooves formed in joining surfaces of the plates, and communication holes formed in the plates. The machining method welds the joining surfaces of the plates around the entire periphery of the fluid channel grooves, for example, by an FSW welding machine, to join the plates. Compared with joining of the plates by an adhesive, the machining method can increase the durability of the plate joining portion and increase pressure resistance. Also, the method can increase work efficiency and further downsize the integrated piping plate.Type: ApplicationFiled: January 29, 2002Publication date: August 15, 2002Inventors: Haretaro Hidaka, Michio Tsukamoto
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Patent number: 5248236Abstract: A transfer system includes an air table, and a linear motor cooperating with the air table to float and move a pallet. The transfer system is designed to allow for a small radius of curvature for each turning section of the air table. Ball valves of the air table are openable upon contact with a pallet to apply air under pressure to a pallet. A linear motor is adapted to move the floating pallet, and guides are provided to guide the moving floating pallet. The pallet includes a pallet body made of a light material, and an external load part made of metal. The external load part has a lower surface projecting slightly from the lower surface of the pallet body. Guides are mounted to the outer periphery of the pallet body. A linear motor secondary conductor is mounted to the lower surface of the pallet body.Type: GrantFiled: August 1, 1991Date of Patent: September 28, 1993Assignees: Mitsubishi Jukogyo Kabushiki Kaisha, Asahi Glass Company Ltd.Inventors: Tadayoshi Ooshima, Haretaro Hidaka, Yoshihiro Tsuchimoto, Naoya Shimizu