Abstract: Phase change memory material stacks having a metal oxide liner for memory integrated circuits, related systems, and methods of fabrication are disclosed. Such phase change memory material stacks include a phase change material and a switching device and the sidewalls of the phase change memory material stacks are lined with a metal oxide to protect the material stacks during manufacture and use and to provide isolation between the material stacks.

Abstract: A semiconductor fabrication method, a semiconductor device and a semiconductor module. The method comprises: providing a stack on a substrate, the stack including a plurality of device layers comprising electrically conductive layers; patterning the stack using an etch to form trenches extending therethrough and pillars between the trenches; providing an a-Si-containing liner on sidewalls of the pillars; filling spaces between the pillars with one or more materials; and electrically coupling contact lines to the electrically conductive layers to form the semiconductor device. The a-Si-containing liner may include a liner made substantially of amorphous silicon, or a liner including a non-uniform distribution of a-Si and silicon nitride.

Abstract: A process for the manufacture of rubber process aids from blends of vulcanized rubber powders, virgin polymers and thermoplastic resins. The process is carried out in a single stage using an extruder. The extruder is fed in three sections with feed hoppers. Vulcanized rubber powder of selected origin is fed into the hopper in the first section with part of the thermoplastic resin and oxidizing agents. The balance of the thermoplastic resin is fed in the second section. Virgin polymer is fed into the hopper in the third section. The temperature of the extruder is controlled and dwell time of the material passing through each of the extruder's sections is adjusted to ensure adequate mixing of all the polymers whereby a reactive rubber process aid in free flowing particulates is produced that acts as an excellent process aid in rubber processing.

Abstract: A synthesis route to grow textured thin film of gallium nitride on amorphous quartz substrates and on single crystalline substrates such as c-sapphire and polycrystalline substrates such as pyrolytic boron nitride (PBN), alumina and quartz using the dissolution of atomic nitrogen rather than molecular nitrogen to allow for growth at subatmospheric pressure.

Abstract: A process of synthesizing metal and metal nitride nanowires, the steps comprising of: forming a catalytic metal (such as gallium, and indium) on a substrate (such as fused silica quartz, pyrolytic boron nitride, alumina, and sapphire), heating the combination in a pressure chamber, adding gaseous reactant and/or solid metal source, applying sufficient microwave energy (or current in hot filament reactor) to activate the metal of interest (such as gold, copper, tungsten, and bismuth) and continuing the process until nanowires of the desired length are formed. The substrate may be fused silica quartz, the catalytic metal a gallium or indium metal, the gaseous reactant is nitrogen and/or hydrogen and the nanowires are tungsten nitride and/or tungsten.

Abstract: A process is provided to produce bulk quantities of nanowires in a variety of semiconductor materials. Thin films and droplets of low-melting metals such as gallium, indium, bismuth, and aluminum are used to dissolve and to produce nanowires. The dissolution of solutes can be achieved by using a solid source of solute and low-melting metal, or using a vapor phase source of solute and low-melting metal. The resulting nanowires range in size from 1 nanometer up to 1 micron in diameter and lengths ranging from 1 nanometer to several hundred nanometers or microns. This process does not require the use of metals such as gold and iron in the form of clusters whose size determines the resulting nanowire size. In addition, the process allows for a lower growth temperature, better control over size and size distribution, and better control over the composition and purity of the nanowire produced therefrom.

Abstract: A synthesis route to grow textured thin film of gallium nitride on amorphous quartz substrates and on single crystalline substrates such as c-sapphire and polycrystalline substrates such as pyrolytic boron nitride (PBN), alumina and quartz using the dissolution of atomic nitrogen rather than molecular nitrogen to allow for growth at subatmospheric pressure.

Abstract: A synthesis route to grow textured thin film of gallium nitride on amorphous quartz substrates and on single crystalline substrates such as c-sapphire and polycrystalline substrates such as pyrolytic boron nitride (PBN), alumina and quartz using the dissolution of atomic nitrogen rather than molecular nitrogen to allow for growth at subatmospheric pressure.

Abstract: A process is provided to produce bulk quantities of nanowires in a variety of semiconductor materials. Thin films and droplets of low-melting metals such as gallium, indium, bismuth, and aluminum are used to dissolve and to produce nanowires. The dissolution of solutes can be achieved by using a solid source of solute and low-melting metal, or using a vapor phase source of solute and low-melting metal. The resulting nanowires range in size from 1 nanometer up to 1 micron in diameter and lengths ranging from 1 nanometer to several hundred nanometers or microns. This process does not require the use of metals such as gold and iron in the form of clusters whose size determines the resulting nanowire size. In addition, the process allows for a lower growth temperature, better control over size and size distribution, and better control over the composition and purity of the nanowire produced therefrom.

Abstract: A process of synthesizing metal and metal nitride nanowires, the steps comprising of: forming a catalytic metal (such as gallium, and indium) on a substrate (such as fused silica quartz, pyrolytic boron nitride, alumina, and sapphire), heating the combination in a pressure chamber, adding gaseous reactant and/or solid metal source, applying sufficient microwave energy (or current in hot filament reactor) to activate the metal of interest (such as gold, copper, tungsten, and bismuth) and continuing the process until nanowires of the desired length are formed. The substrate may be fused silica quartz, the catalytic metal a gallium or indium metal, the gaseous reactant is nitrogen and/or hydrogen and the nanowires are tungsten nitride and/or tungsten.