Abstract: A system may include multiple memory cells to store logical data, age tracking circuitry to track a time since a previous access of a particular memory cell, and control circuitry to access the memory cell. Such access may include a read operation of the memory cell, a write operation to the memory cell, or both. The control circuitry may determine an electrical parameter of the memory cell based at least in part on the tracked time since the previous access of the memory cell.

Abstract: An architecture of the memory device may leverage a transmission path resistance compensation scheme for memory cells to reduce the effect of parasitic loads in accessing a memory cell. A memory cell of such a memory device may experience a total resistance including a transmission path resistance associated with the respective access lines of the memory cell and an added compensatory resistance. The foregoing memory device may leverage a spike mitigation scheme to mitigate the harmful effect of a voltage and/or rush current to the near memory cells of the memory device. In addition, spike mitigation circuitry may include coupling a resistor on access lines near the respective decoders. Further, spike mitigation circuitry may include coupling a resistor between the decoders.

Abstract: The present disclosure includes apparatuses, methods, and systems for memory cell programming that cancels threshold voltage drift. An embodiment includes a memory having a plurality of memory cells, and circuitry configured to program a memory cell of the plurality of memory cells to one of two possible data states by applying a first voltage pulse to the memory cell, wherein the first voltage pulse has a first polarity and a first magnitude, and applying a second voltage pulse to the memory cell, wherein the second voltage pulse has a second polarity that is opposite the first polarity and a second magnitude that can be greater than the first magnitude.

Abstract: Memory device systems and methods for using methods include multiple access lines arranged in a grid. Multiple memory cells are located at intersections of the access lines in the grid. Multiple drivers are included with each configured to transmit a corresponding signal to respective memory cells of the multiple memory cells. Remapping circuitry is configured to remap a near memory cell of the multiple memory cells to a far memory cell of the multiple memory cells. The near memory cell is relatively nearer to a respective driver of the multiple drivers than the far memory cell is to a respective driver of the multiple drivers.

Abstract: An architecture of the memory device may leverage a transmission path resistance compensation scheme for memory cells to reduce the effect of parasitic loads in accessing a memory cell. A memory cell of such a memory device may experience a total resistance including a transmission path resistance associated with the respective access lines of the memory cell and an added compensatory resistance. The foregoing memory device may leverage a spike mitigation scheme to mitigate the harmful effect of a voltage and/or rush current to the near memory cells of the memory device. In addition, spike mitigation circuitry may include coupling a resistor on access lines near the respective decoders. Further, spike mitigation circuitry may include coupling a resistor between the decoders.

Abstract: Methods and systems include memory devices with multiple access lines arranged in an array to form a multiple intersections. Memory cells are located at the intersections of the multiple access lines. Decoders are configured to drive the multiple memory cells via the multiple access lines. Variable biasing circuitry may bias a voltage on an access line of the multiple access lines to change a variable ramp rate of the voltage on the access line. A control circuit is configured to determine a memory cell of the multiple memory cells to be activated. Based at least in part on a distance from the memory cell to a corresponding decoder, the control circuit may set the variable ramp rate of the biasing circuitry.

Abstract: An architecture of the memory device may leverage a transmission path resistance compensation scheme for memory cells to reduce the effect of parasitic loads in accessing a memory cell. A memory cell of such a memory device may experience a total resistance including a transmission path resistance associated with the respective access lines of the memory cell and an added compensatory resistance. The foregoing memory device may leverage a spike mitigation scheme to mitigate the harmful effect of a voltage and/or rush current to the near memory cells of the memory device. In addition, spike mitigation circuitry may include coupling a resistor on access lines near the respective decoders. Further, spike mitigation circuitry may include coupling a resistor between the decoders.

Abstract: An integrated circuit memory device having: a memory cell; and a voltage driver of depletion type connected to the memory cell. In a first polarity, the voltage driver is powered by a negative voltage relative to ground to drive a negative selection voltage or a first de-selection voltage; In a second polarity, the voltage driver is powered by a positive voltage relative to ground to drive a positive selection voltage or a second de-selection voltage. The voltage driver is configured to transition between the first polarity and the second polarity. During the transition, the voltage driver is configured to have a control voltage swing for outputting de-selection voltages smaller than a control voltage swing for output selection voltages.

Abstract: Methods, systems, and devices for varying-polarity read operations for polarity-written memory cells are described. Memory cells may be programmed to store different logic values based on applying write voltages of different polarities to the memory cells. A memory device may read the logic values based on applying read voltages to the memory cells, and the polarity of the read voltages may vary such that at least some read voltages have one polarity and at least some read voltages have another polarity. The read voltage polarity may vary randomly or according to a pattern and may be controlled by the memory device or by a host device for the memory device.

Abstract: An integrated circuit memory device having: a memory cell; and a voltage driver of depletion type connected to the memory cell. In a first polarity, the voltage driver is powered by a negative voltage relative to ground to drive a negative selection voltage or a first de-selection voltage; In a second polarity, the voltage driver is powered by a positive voltage relative to ground to drive a positive selection voltage or a second de-selection voltage. The voltage driver is configured to transition between the first polarity and the second polarity. During the transition, the voltage driver is configured to have a control voltage swing for outputting de-selection voltages smaller than a control voltage swing for output selection voltages.

Abstract: Methods, systems, and devices for power management of a memory device are described. An apparatus may include a substrate and an input/output (I/O) interface and memory device coupled with the substrate. The I/O interface may communicate with a host device and the memory device may store data associated with the host device. The apparatus may include a power management component for providing one or more supply voltages to the memory device. The power management component may receive input voltages associated with the substrate and provide the supply voltages to the memory device based on the input voltages. The power management component may include a first portion integrated with the memory device and a second portion coupled with the substrate. The first portion may include control circuitry for the power management component and the second portion may include passive components for the power management component.

Abstract: Systems and methods of memory operation involving charge pump circuitry located on a die and coupled to external pump capacitors are disclosed. In one embodiment, an exemplary system may comprise a memory die containing a memory array and charge pump circuitry configured to generate a pump voltage supplied to the memory array, and one or more pump capacitors located external to the die and configured to hold stored charge that is used to generate the pump voltage. Some embodiments may include a tank capacitor, also located off-die, to condition the charge provided from the pump capacitor. According to further embodiments, the charge pump circuitry may include one or both of max current control circuitry and/or switch resistance control circuitry that may be utilized, for example, to adjust peak current.

Abstract: An integrated circuit memory device having: a memory cell; and a voltage driver of depletion type connected to the memory cell. In a first polarity, the voltage driver is powered by a negative voltage relative to ground to drive a negative selection voltage or a first de-selection voltage; In a second polarity, the voltage driver is powered by a positive voltage relative to ground to drive a positive selection voltage or a second de-selection voltage. The voltage driver is configured to transition between the first polarity and the second polarity. During the transition, the voltage driver is configured to have a control voltage swing for outputting de-selection voltages smaller than a control voltage swing for output selection voltages.

Abstract: Methods, systems, and devices for shifting voltage levels of electrical signals and more specifically for boosted high-speed level shifting are described. A boosted level shifter may include a driver circuit that generates a drive signal having a greater voltage swing than an input signal, and the drive signal may drive the gate of a pull-up transistor within the boosted level shifter. The lower bound of the drive signal may in some cases be a negative voltage. Driving the pull-up transistor with a drive signal having a greater voltage swing than the input signal may improve the operational speed and current-sourcing capability of the pull-up transistor, which may provide speed and efficiency benefits.

Abstract: Systems and methods of memory operation involving charge pump circuitry located on a die and coupled to external pump capacitors are disclosed. In one embodiment, an exemplary system may comprise a memory die containing a memory array and charge pump circuitry configured to generate a pump voltage supplied to the memory array, and one or more pump capacitors located external to the die and configured to hold stored charge that is used to generate the pump voltage. Some embodiments may include a tank capacitor, also located off-die, to condition the charge provided from the pump capacitor. According to further embodiments, the charge pump circuitry may include one or both of max current control circuitry and/or switch resistance control circuitry that may be utilized, for example, to adjust peak current.

Abstract: Methods, systems, and devices for shifting voltage levels of electrical signals and more specifically for boosted high-speed level shifting are described. A boosted level shifter may include a driver circuit that generates a drive signal having a greater voltage swing than an input signal, and the drive signal may drive the gate of a pull-up transistor within the boosted level shifter. The lower bound of the drive signal may in some cases be a negative voltage. Driving the pull-up transistor with a drive signal having a greater voltage swing than the input signal may improve the operational speed and current-sourcing capability of the pull-up transistor, which may provide speed and efficiency benefits.

Abstract: Apparatuses and methods for limiting current in threshold switching memories are disclosed. An example apparatus may include a plurality of first decoder circuits, a plurality of second decoder circuits, an array of memory cells, and a control circuit. Each memory cell of the array of memory cells may be cells coupled to a pair of first decoder circuits of the plurality of first decoder circuits, and further coupled to a pair of second decoder circuits of the plurality of second decoder circuits.

Abstract: Methods, systems, and devices for shifting voltage levels of electrical signals and more specifically for boosted high-speed level shifting are described. A boosted level shifter may include a driver circuit that generates a drive signal having a greater voltage swing than an input signal, and the drive signal may drive the gate of a pull-up transistor within the boosted level shifter. The lower bound of the drive signal may in some cases be a negative voltage. Driving the pull-up transistor with a drive signal having a greater voltage swing than the input signal may improve the operational speed and current-sourcing capability of the pull-up transistor, which may provide speed and efficiency benefits.

Abstract: Apparatuses and methods for limiting current in threshold switching memories are disclosed. All example apparatus, may include a plurality of first decoder circuits, a plurality of second decoder circuits, an array of memory cells, and a control circuit. Each memory cell of the array of memory cells may be cells coupled to a pair of first decoder circuits of the plurality of first decoder circuits, and further coupled to a pair of second decoder circuits of the plurality of second decoder circuits.

Abstract: Apparatuses and methods for limiting current in threshold switching memories are disclosed. An example apparatus may include a plurality of first decoder circuits, a plurality of second decoder circuits, an array of memory cells, and a control circuit. Each memory cell of the array of memory cells may be cells coupled to a pair of first decoder circuits of the plurality of first decoder circuits, and further coupled to a pair of second decoder circuits of the plurality of second decoder circuits.