Patents by Inventor Hari K. Rajeev

Hari K. Rajeev has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10107860
    Abstract: According to an embodiment of the present invention, a computer-implemented method for testing a microelectronic chip is described. The method may include dividing, via a processor running a scanning engine, a plurality of sections of the microelectronic chip. Each of the plurality of sections includes at least two latch sets in at least one scan chain. The method may further include determining, via the processor, based on the dividing, whether each of the plurality of sections fail a data test. The determining comprises interleaving the plurality of sections by scanning, via the processor, an alternating latch set from each scan chain in a first section, and scanning an alternating latch set from each scan chain in a second section.
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: October 23, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Todd L. Cohen, Mary P. Kusko, Hari K. Rajeev, Timothy C. Taylor
  • Patent number: 10067183
    Abstract: Embodiments include methods, and processing system, and computer program products providing portion isolation design to a chip design to facilitate partial-good portion isolation test of the chip. Aspects include: retrieving a chip design file of a chip, the chip design file having pin related information from a chip design database, generating, via a pin group utility module, a pin group file according to the pin related information retrieved, combining, via a portion wrapper insertion utility module, the pin group file with one or more portion netlists to form one or more localized portion wrapper segments, stitching, via the portion wrapper insertion utility module, the one or more localized portion wrapper segments to form a portion boundary wrapper chain, and inserting, via the portion wrapper insertion utility module, the portion boundary wrapper chain into the chip design file to facilitate partial-good portion isolation test.
    Type: Grant
    Filed: June 21, 2016
    Date of Patent: September 4, 2018
    Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
    Inventors: Steven M. Douskey, Raghu G. Gaurav, Mary P. Kusko, Hari K. Rajeev
  • Publication number: 20170363684
    Abstract: According to an embodiment of the present invention, a computer-implemented method for testing a microelectronic chip is described. The method may include dividing, via a processor running a scanning engine, a plurality of sections of the microelectronic chip. Each of the plurality of sections includes at least two latch sets in at least one scan chain. The method may further include determining, via the processor, based on the dividing, whether each of the plurality of sections fail a data test. The determining comprises interleaving the plurality of sections by scanning, via the processor, an alternating latch set from each scan chain in a first section, and scanning an alternating latch set from each scan chain in a second section.
    Type: Application
    Filed: June 21, 2016
    Publication date: December 21, 2017
    Inventors: Todd L. Cohen, Mary P. Kusko, Hari K. Rajeev, Timothy C. Taylor
  • Publication number: 20170363683
    Abstract: Embodiments include methods, and processing system, and computer program products providing portion isolation design to a chip design to facilitate partial-good portion isolation test of the chip. Aspects include: retrieving a chip design file of a chip, the chip design file having pin related information from a chip design database, generating, via a pin group utility module, a pin group file according to the pin related information retrieved, combining, via a portion wrapper insertion utility module, the pin group file with one or more portion netlists to form one or more localized portion wrapper segments, stitching, via the portion wrapper insertion utility module, the one or more localized portion wrapper segments to form a portion boundary wrapper chain, and inserting, via the portion wrapper insertion utility module, the portion boundary wrapper chain into the chip design file to facilitate partial-good portion isolation test.
    Type: Application
    Filed: June 21, 2016
    Publication date: December 21, 2017
    Inventors: Steven M. Douskey, Raghu G. Gaurav, Mary P. Kusko, Hari K. Rajeev