Patents by Inventor Hari Shanker Thakur

Hari Shanker Thakur has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • AEROGEL INCLUDING LOW THERMAL CONDUCTIVITY GASES AND RELATED APPARATUS AND METHODS
    Publication number: 20240351892
    Abstract: Aerogel including low thermal conductivity gases and related apparatus and methods are disclosed. An example aerogel disclosed herein includes a framework including a plurality of pores and a gas in at least one of the plurality of pores, the gas having a lower thermal conductivity than air.
    Type: Application
    Filed: June 28, 2024
    Publication date: October 24, 2024
    Applicant: Intel Corporation
    Inventors: Krishnendu Saha, Chethan Holla, Hari Shanker Thakur
  • Heat pipe with in-plane heat spreader and loading mechanism
    Patent number: 12114466
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, one or more heat sources over the substrate, one or more heat pipes thermally coupled to the one or more heat sources, a heat spreader coupled to the one or more heat pipes, where the heat spreader is in-plane with the heat pipe, and one or more loading mechanisms coupled to at least a portion of the one or more heat pipes and to the substrate. The one or more loading mechanisms are in-plane with the spreader and the one or more heat pipes.
    Type: Grant
    Filed: December 23, 2020
    Date of Patent: October 8, 2024
    Assignee: Intel Corporation
    Inventors: Penchala Pratap Binni Boyina, Kathiravan D, Babu Triplicane Gopikrishnan, Prakash Kurma Raju, Deepak Sekar, Hari Shanker Thakur
  • Vapor chambers
    Patent number: 11930620
    Abstract: There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension d2 of the rectangular form factor is at least approximately twice a first dimension d1 of the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second d1 edges of the planar vapor chamber, further disposed to conduct heat from the first and second d1 edges to the first and second fan respectively.
    Type: Grant
    Filed: June 27, 2020
    Date of Patent: March 12, 2024
    Assignee: Intel Corporation
    Inventors: Jeff Ku, Cora Nien, Gavin Sung, Tim Liu, Lance Lin, Wan Yu Liu, Gerry Juan, Jason Y. Jiang, Justin M. Huttula, Evan Piotr Kuklinski, Juha Tapani Paavola, Arnab Sen, Hari Shanker Thakur, Prakash Kurma Raju
  • COOLING SYSTEMS, COOLING STRUCTURES AND ELECTRONIC DEVICES AND METHODS FOR MANUFACTURING OR OPERATING COOLING SYS-TEMS, COOLING STRUCTURES AND ELECTRONIC DEVICES
    Publication number: 20230337406
    Abstract: An electronic device comprises a heat source and a heat distribution structure coupled to the heat source to distribute heat generated by the heat source during operation of the electronic device.
    Type: Application
    Filed: December 23, 2020
    Publication date: October 19, 2023
    Inventors: Ritu BAWA, Ruander CARDENAS, Kathiravan D, Jia Yan GO, Chin Kung GOH, Jeff KU, Prakash Kurma RAJU, Baomin LIU, Twan Sing LOO, Mikko MAKINEN, Columbia MISHRA, Juha PAAVOLA, Prasanna PICHUMANI, Daniel RAGLAND, Kannan RAJA, Khai Ern SEE, Javed SHAIKH, Gokul SUBRAMANIAM, George Baoci SUN, Xiyong TIAN, Hua YANG, Mark CARBONE, Vivek PARANJAPE, Nehakausar PINJARI, Hari Shanker THAKUR, Christopher MOORE, Gustavo FRICKE, Justin HUTTULA, Gavin SUNG, Sammi WY LIU, Arnab SEN, Chun-Ting LIU, Jason Y. JIANG, Gerry JUAN, Shih Wei NIEN, Lance LIN, Evan KUKLINSKI
  • Vapor chamber and means of attachment
    Patent number: 11573055
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a vapor chamber and means of attachment for the vapor chamber. The vapor chamber can include one or more columns, where at least a portion of the columns include fiber braids and one or more wicks. At least one of the wicks can also include the fiber braids. The columns can be braised to a top plate or a bottom plate of the vapor chamber. The vapor chamber can be secured over a heat source using a vapor chamber securing means that can include spring arms. The spring arms can bend, flex, rotate, etc. to absorb some of the force when vapor chamber is secured over the heat source.
    Type: Grant
    Filed: December 27, 2019
    Date of Patent: February 7, 2023
    Assignee: Intel Corporation
    Inventors: Juha Tapani Paavola, Mark Carbone, Vivek Paranjape, Prakash Kurma Raju, Mikko Antero Makinen, Christopher M. Moore, Gustavo Fricke, Kathiravan D, Ritu Bawa, Nehakausar Shaikh Ramjan Pinjari, Hari Shanker Thakur
  • Variable area ejector
    Patent number: 11293375
    Abstract: An ejector assembly includes a primary nozzle in fluid communication with a primary fluid inlet, a secondary nozzle in fluid communication with a secondary fluid inlet, the primary nozzle being oriented concentrically within the secondary nozzle and the secondary nozzle having a venturi downstream of the primary nozzle, and the primary nozzle having a variable cross-sectional area.
    Type: Grant
    Filed: February 12, 2020
    Date of Patent: April 5, 2022
    Assignee: General Electric Company
    Inventors: Arvind Namadevan, Hari Shanker Thakur, Jeffrey Douglas Rambo, Arnab Sen, Siddhartha Pal
  • VARIABLE AREA EJECTOR
    Publication number: 20210246849
    Abstract: An ejector assembly includes a primary nozzle in fluid communication with a primary fluid inlet, a secondary nozzle in fluid communication with a secondary fluid inlet, the primary nozzle being oriented concentrically within the secondary nozzle and the secondary nozzle having a venturi downstream of the primary nozzle, and the primary nozzle having a variable cross-sectional area.
    Type: Application
    Filed: February 12, 2020
    Publication date: August 12, 2021
    Inventors: Arvind Namadevan, Hari Shanker Thakur, Jeffrey Douglas Rambo, Arnab Sen, Siddhartha Pal
  • HEAT PIPE WITH IN-PLANE HEAT SPREADER AND LOADING MECHANISM
    Publication number: 20210112684
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a substrate, one or more heat sources over the substrate, one or more heat pipes thermally coupled to the one or more heat sources, a heat spreader coupled to the one or more heat pipes, where the heat spreader is in-plane with the heat pipe, and one or more loading mechanisms coupled to at least a portion of the one or more heat pipes and to the substrate. The one or more loading mechanisms are in-plane with the spreader and the one or more heat pipes.
    Type: Application
    Filed: December 23, 2020
    Publication date: April 15, 2021
    Applicant: Intel Corporation
    Inventors: Penchala Pratap Binni Boyina, Kathiravan D, Babu Triplicane Gopikrishnan, Prakash Kurma Raju, Deepak Sekar, Hari Shanker Thakur
  • VAPOR CHAMBERS
    Publication number: 20200396864
    Abstract: There is disclosed in one example a heat dissipator for an electronic apparatus, including: a planar vapor chamber having a substantially rectangular form factor, wherein a second dimension d2 of the rectangular form factor is at least approximately twice a first dimension d1 of the rectangular form factor; a first fan and second fan; and a first heat pipe and second heat pipe discrete from the planar vapor chamber and disposed along first and second d1 edges of the planar vapor chamber, further disposed to conduct heat from the first and second d1 edges to the first and second fan respectively.
    Type: Application
    Filed: June 27, 2020
    Publication date: December 17, 2020
    Applicant: Intel Corporation
    Inventors: Jeff Ku, Cora Nien, Gavin Sung, Tim Liu, Lance Lin, Wan Yu Liu, Gerry Juan, Jason Y. Jiang, Justin M. Huttula, Evan Piotr Kuklinski, Juha Tapani Paavola, Arnab Sen, Hari Shanker Thakur, Prakash Kurma Raju
  • VAPOR CHAMBER AND MEANS OF ATTACHMENT
    Publication number: 20200132391
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a vapor chamber and means of attachment for the vapor chamber. The vapor chamber can include one or more columns, where at least a portion of the columns include fiber braids and one or more wicks. At least one of the wicks can also include the fiber braids. The columns can be braised to a top plate or a bottom plate of the vapor chamber. The vapor chamber can be secured over a heat source using a vapor chamber securing means that can include spring arms. The spring arms can bend, flex, rotate, etc. to absorb some of the force when vapor chamber is secured over the heat source.
    Type: Application
    Filed: December 27, 2019
    Publication date: April 30, 2020
    Applicant: Intel Corporation
    Inventors: Juha Tapani Paavola, Mark Carbone, Vivek Paranjape, Prakash Kurma Raju, Mikko Antero Makinen, Christopher M. Moore, Gustavo Fricke, Kathiravan D, Ritu Bawa, Nehakausar Shaikh Ramjan Pinjari, Hari Shanker Thakur