Patents by Inventor Ha Rim Kim

Ha Rim Kim has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240128930
    Abstract: The present disclosure relates to an offset elimination operation of an internal operational amplifier of a data driving circuit and relates to a technique that applies different offset elimination methods for each position of an operational amplifier.
    Type: Application
    Filed: October 13, 2023
    Publication date: April 18, 2024
    Applicant: LX SEMICON CO., LTD.
    Inventors: Yong Sung AHN, Ji Won KIM, Hyo Joong KIM, Kyung Min SHIN, Kyu Tae LEE, Ha Rim CHOI
  • Patent number: 10955957
    Abstract: An electronic device is provided. The electronic device may include a display including a front surface area and a side surface area disposed in at least one side of the front surface area, a first sensor included under the side surface area and configured to sense pressure applied to the side surface area; and a processor operatively connected with the display and the first sensor. The processor may be configured to determine a position of at least one point of the side surface area corresponding to the sensed pressure, if the sensed pressure using the first sensor is within a first specified range, and to display at least one graphic object on an area corresponding to the determined position.
    Type: Grant
    Filed: January 24, 2018
    Date of Patent: March 23, 2021
    Assignee: Samsung Electronics Co., Ltd.
    Inventors: Min Sung Lee, Na Young Kim, Ha Rim Kim, Na Kyoung Lee, Hyun Soo Kim, Dong Hyun Yeom, Chang Ryong Heo
  • Publication number: 20180224963
    Abstract: An electronic device is provided. The electronic device may include a display including a front surface area and a side surface area disposed in at least one side of the front surface area, a first sensor included under the side surface area and configured to sense pressure applied to the side surface area; and a processor operatively connected with the display and the first sensor. The processor may be configured to determine a position of at least one point of the side surface area corresponding to the sensed pressure, if the sensed pressure using the first sensor is within a first specified range, and to display at least one graphic object on an area corresponding to the determined position.
    Type: Application
    Filed: January 24, 2018
    Publication date: August 9, 2018
    Inventors: Min Sung LEE, Na Young KIM, Ha Rim KIM, Na Kyoung LEE, Hyun Soo KIM, Dong Hyun YEOM, Chang Ryong HEO
  • Patent number: 9285125
    Abstract: A prefabricated heat-insulation panel has two hot water flow paths installed separately inside a panel, with primary and secondary connection parts provided in the panel and connected to a boiler or allowing hot water to circulate to adjacent panels. A polybutene layer with rosin as an activator is formed on the inner surface of the hot water supply pipe made of thermoplastic elastomer, and reduces the diameter and the length of the hot water supply pipes installed in the panel and the panel thickness and minimizes the boiler load.
    Type: Grant
    Filed: September 21, 2009
    Date of Patent: March 15, 2016
    Inventors: Hi Gon Lee, Ha Rim Kim
  • Publication number: 20110168794
    Abstract: The present invention relates to a prefabricated heat-insulation panel with two hot water flow paths. The prefabricated heat-insulation panel comprises a panel; primary and secondary hot water supply pipes which are installed separately inside the panel to provide at least two hot water flow paths; and primary and secondary connection parts which are provided in the panel and connected to a boiler or primary and secondary hot water supply pipes installed in another panel to allow hot water to circulate in the primary and secondary hot water supply pipes.
    Type: Application
    Filed: September 21, 2009
    Publication date: July 14, 2011
    Inventors: Hi Gon Lee, Ha Rim Kim