Patents by Inventor Harish Jagadish

Harish Jagadish has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11755080
    Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
    Type: Grant
    Filed: December 23, 2021
    Date of Patent: September 12, 2023
    Assignee: Intel Corporation
    Inventors: Prakash Kurma Raju, Babu Triplicane Gopikrishnan, Bijendra Singh, Prasanna Pichumani, Raghavendra Doddi, Harish Jagadish, Gopinath Kandasamy, David Pidwerbecki
  • Patent number: 11649993
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a hybrid thermal management system. The hybrid thermal management system can include a heat source, an air mover, a heat sink coupled to the air mover, a thermal electric cooling device (TEC), and a heat pipe. The heat pipe can couple the heat source to the heat sink and to the TEC and transfer heat from the heat source to the heat sink and to the TEC.
    Type: Grant
    Filed: June 28, 2019
    Date of Patent: May 16, 2023
    Assignee: Intel Corporation
    Inventors: Gavin Sung, Gerry Juan, Harish Jagadish, Ivan By Wang, Jason Y. Jiang, Sammi Wy Liu, Tim Liu, Jeff Ku
  • Publication number: 20220113759
    Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
    Type: Application
    Filed: December 23, 2021
    Publication date: April 14, 2022
    Applicant: Intel Corporation
    Inventors: Prakash Kurma Raju, Babu Triplicane Gopikrishnan, Bijendra Singh, Prasanna Pichumani, Raghavendra Doddi, Harish Jagadish, Gopinath Kandasamy, David Pidwerbecki
  • Patent number: 11231757
    Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
    Type: Grant
    Filed: August 1, 2018
    Date of Patent: January 25, 2022
    Assignee: Intel Corporation
    Inventors: Prakash Kurma Raju, Babu Triplicane Gopikrishnan, Bijendra Singh, Prasanna Pichumani, Raghavendra Doddi, Harish Jagadish, Gopinath Kandasamy, David Pidwerbecki
  • Patent number: 10712779
    Abstract: Embodiments are generally directed to a unified chassis construction for an all in one computer. An embodiment of a computer system includes a computer sub-system to provide computer operation; a display sub-system to provide display operation; a unified plate, components installed in the unified plate including at least one or more computer sub-system components and one or more display sub-system components; and a display screen coupled with the unified plate.
    Type: Grant
    Filed: December 7, 2015
    Date of Patent: July 14, 2020
    Assignee: INTEL CORPORATION
    Inventors: Anand V. Reddy, Guru Prakash, Harish Jagadish, Arvind Sundaram
  • Publication number: 20190383528
    Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a hybrid thermal management system. The hybrid thermal management system can include a heat source, an air mover, a heat sink coupled to the air mover, a thermal electric cooling device (TEC), and a heat pipe. The heat pipe can couple the heat source to the heat sink and to the TEC and transfer heat from the heat source to the heat sink and to the TEC.
    Type: Application
    Filed: June 28, 2019
    Publication date: December 19, 2019
    Inventors: Gavin Sung, Gerry Juan, Harish Jagadish, Ivan By Wang, Jason Y. Jiang, Sammi Wy Liu, Tim Liu, Jeff Ku
  • Publication number: 20190041922
    Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.
    Type: Application
    Filed: August 1, 2018
    Publication date: February 7, 2019
    Applicant: Intel Corporation
    Inventors: Prakash Kurma Raju, Babu Triplicane Gopikrishnan, Bijendra Singh, Prasanna Pichumani, Doddi Raghavendra, Harish Jagadish, Gopinath Kandasamy, David Pidwerbecki
  • Publication number: 20170255233
    Abstract: Embodiments are generally directed to a unified chassis construction for an all in one computer. An embodiment of a computer system includes a computer sub-system to provide computer operation; a display sub-system to provide display operation; a unified plate, components installed in the unified plate including at least one or more computer sub-system components and one or more display sub-system components; and a display screen coupled with the unified plate.
    Type: Application
    Filed: December 7, 2015
    Publication date: September 7, 2017
    Inventors: ANAND V. REDDY, GURU PRAKASH, HARISH JAGADISH, ARVIND SUNDARAM
  • Patent number: 9727102
    Abstract: Techniques for providing airflow through an electronic device are described herein. An example of an electronic device includes an integrated display and a circuit board comprising a processor, a memory, and a driver circuit coupled to the integrated display. A housing encloses the integrated display and the circuit board, wherein the housing is comprised of at least two panels wherein at least one of the panels is formed from a porous material configured to allow air flow through the panel.
    Type: Grant
    Filed: July 9, 2013
    Date of Patent: August 8, 2017
    Assignee: Intel Corporation
    Inventors: Paul Gwin, Harish Jagadish, Narasimha Shastri, Madhukar Patil
  • Patent number: 9551177
    Abstract: Techniques related to a hinge in a computing device are described herein. The techniques may include forming a shaft to move rotationally, and forming a sliding component to move translationally as a result of rotational movement of the shaft.
    Type: Grant
    Filed: December 26, 2013
    Date of Patent: January 24, 2017
    Assignee: Intel Corporation
    Inventors: Krishnakumar Varadarajan, Harish Jagadish, Anand V. Reddy, Madhukar Patil, James Panakkal, Guru Prakash
  • Patent number: 9313875
    Abstract: Examples are disclosed for a conformal coating molded around power source circuitry, electrical components or at least portions of a display for a computing device. The conformal coating to include embedded microencapsulated thermal energy storage material to absorb heat generated by the electrical components.
    Type: Grant
    Filed: December 11, 2012
    Date of Patent: April 12, 2016
    Assignee: INTEL CORPORATION
    Inventors: Jered H. Wikander, Mark MacDonald, Shawn S. McEuen, Harish Jagadish, David Pidwerbecki
  • Publication number: 20150184438
    Abstract: Techniques related to a hinge in a computing device are described herein. The techniques may include forming a shaft to move rotationally, and forming a sliding component to move translationally as a result of rotational movement of the shaft.
    Type: Application
    Filed: December 26, 2013
    Publication date: July 2, 2015
    Inventors: Krishnakumar Varadarajan, Harish Jagadish, Anand V. Reddy, Madhukar Patil, James Panakkal, Guru Prakash
  • Publication number: 20140285967
    Abstract: Examples are disclosed for a conformal coating molded around power source circuitry, electrical components or at least portions of a display for a computing device. The conformal coating to include embedded microencapsulated thermal energy storage material to absorb heat generated by the electrical components.
    Type: Application
    Filed: December 11, 2012
    Publication date: September 25, 2014
    Inventors: Jered H. Wikander, Mark MacDonald, Shawn S. McEuen, Harish Jagadish, David Pidwerbecki
  • Patent number: D737824
    Type: Grant
    Filed: August 30, 2013
    Date of Patent: September 1, 2015
    Assignee: Intel Corporation
    Inventors: Harish Jagadish, Gokul Subramaniam, Madhukar Patil
  • Patent number: D924810
    Type: Grant
    Filed: January 4, 2019
    Date of Patent: July 13, 2021
    Assignee: Intel Corporation
    Inventors: Samantha Rao, Harish Jagadish, Arvind S