Patents by Inventor Harish Jagadish
Harish Jagadish has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11755080Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.Type: GrantFiled: December 23, 2021Date of Patent: September 12, 2023Assignee: Intel CorporationInventors: Prakash Kurma Raju, Babu Triplicane Gopikrishnan, Bijendra Singh, Prasanna Pichumani, Raghavendra Doddi, Harish Jagadish, Gopinath Kandasamy, David Pidwerbecki
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Patent number: 11649993Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a hybrid thermal management system. The hybrid thermal management system can include a heat source, an air mover, a heat sink coupled to the air mover, a thermal electric cooling device (TEC), and a heat pipe. The heat pipe can couple the heat source to the heat sink and to the TEC and transfer heat from the heat source to the heat sink and to the TEC.Type: GrantFiled: June 28, 2019Date of Patent: May 16, 2023Assignee: Intel CorporationInventors: Gavin Sung, Gerry Juan, Harish Jagadish, Ivan By Wang, Jason Y. Jiang, Sammi Wy Liu, Tim Liu, Jeff Ku
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Publication number: 20220113759Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.Type: ApplicationFiled: December 23, 2021Publication date: April 14, 2022Applicant: Intel CorporationInventors: Prakash Kurma Raju, Babu Triplicane Gopikrishnan, Bijendra Singh, Prasanna Pichumani, Raghavendra Doddi, Harish Jagadish, Gopinath Kandasamy, David Pidwerbecki
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Patent number: 11231757Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.Type: GrantFiled: August 1, 2018Date of Patent: January 25, 2022Assignee: Intel CorporationInventors: Prakash Kurma Raju, Babu Triplicane Gopikrishnan, Bijendra Singh, Prasanna Pichumani, Raghavendra Doddi, Harish Jagadish, Gopinath Kandasamy, David Pidwerbecki
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Patent number: 10712779Abstract: Embodiments are generally directed to a unified chassis construction for an all in one computer. An embodiment of a computer system includes a computer sub-system to provide computer operation; a display sub-system to provide display operation; a unified plate, components installed in the unified plate including at least one or more computer sub-system components and one or more display sub-system components; and a display screen coupled with the unified plate.Type: GrantFiled: December 7, 2015Date of Patent: July 14, 2020Assignee: INTEL CORPORATIONInventors: Anand V. Reddy, Guru Prakash, Harish Jagadish, Arvind Sundaram
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Publication number: 20190383528Abstract: Particular embodiments described herein provide for an electronic device that can be configured to include a hybrid thermal management system. The hybrid thermal management system can include a heat source, an air mover, a heat sink coupled to the air mover, a thermal electric cooling device (TEC), and a heat pipe. The heat pipe can couple the heat source to the heat sink and to the TEC and transfer heat from the heat source to the heat sink and to the TEC.Type: ApplicationFiled: June 28, 2019Publication date: December 19, 2019Inventors: Gavin Sung, Gerry Juan, Harish Jagadish, Ivan By Wang, Jason Y. Jiang, Sammi Wy Liu, Tim Liu, Jeff Ku
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Publication number: 20190041922Abstract: There is disclosed a computing apparatus, including: a first chassis including primary operational circuitry of the computing apparatus; a second chassis hingeably coupled to the second chassis, the second chassis having substantially less operational circuitry than the first chassis whereby the operational circuitry of the second chassis generates substantially less heat than the operational circuitry of the first chassis; and a heat spreader between the first chassis and second chassis and disposed to dissipate generated heat from the first chassis into the second chassis.Type: ApplicationFiled: August 1, 2018Publication date: February 7, 2019Applicant: Intel CorporationInventors: Prakash Kurma Raju, Babu Triplicane Gopikrishnan, Bijendra Singh, Prasanna Pichumani, Doddi Raghavendra, Harish Jagadish, Gopinath Kandasamy, David Pidwerbecki
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Publication number: 20170255233Abstract: Embodiments are generally directed to a unified chassis construction for an all in one computer. An embodiment of a computer system includes a computer sub-system to provide computer operation; a display sub-system to provide display operation; a unified plate, components installed in the unified plate including at least one or more computer sub-system components and one or more display sub-system components; and a display screen coupled with the unified plate.Type: ApplicationFiled: December 7, 2015Publication date: September 7, 2017Inventors: ANAND V. REDDY, GURU PRAKASH, HARISH JAGADISH, ARVIND SUNDARAM
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Patent number: 9727102Abstract: Techniques for providing airflow through an electronic device are described herein. An example of an electronic device includes an integrated display and a circuit board comprising a processor, a memory, and a driver circuit coupled to the integrated display. A housing encloses the integrated display and the circuit board, wherein the housing is comprised of at least two panels wherein at least one of the panels is formed from a porous material configured to allow air flow through the panel.Type: GrantFiled: July 9, 2013Date of Patent: August 8, 2017Assignee: Intel CorporationInventors: Paul Gwin, Harish Jagadish, Narasimha Shastri, Madhukar Patil
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Patent number: 9551177Abstract: Techniques related to a hinge in a computing device are described herein. The techniques may include forming a shaft to move rotationally, and forming a sliding component to move translationally as a result of rotational movement of the shaft.Type: GrantFiled: December 26, 2013Date of Patent: January 24, 2017Assignee: Intel CorporationInventors: Krishnakumar Varadarajan, Harish Jagadish, Anand V. Reddy, Madhukar Patil, James Panakkal, Guru Prakash
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Patent number: 9313875Abstract: Examples are disclosed for a conformal coating molded around power source circuitry, electrical components or at least portions of a display for a computing device. The conformal coating to include embedded microencapsulated thermal energy storage material to absorb heat generated by the electrical components.Type: GrantFiled: December 11, 2012Date of Patent: April 12, 2016Assignee: INTEL CORPORATIONInventors: Jered H. Wikander, Mark MacDonald, Shawn S. McEuen, Harish Jagadish, David Pidwerbecki
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Publication number: 20150184438Abstract: Techniques related to a hinge in a computing device are described herein. The techniques may include forming a shaft to move rotationally, and forming a sliding component to move translationally as a result of rotational movement of the shaft.Type: ApplicationFiled: December 26, 2013Publication date: July 2, 2015Inventors: Krishnakumar Varadarajan, Harish Jagadish, Anand V. Reddy, Madhukar Patil, James Panakkal, Guru Prakash
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Publication number: 20140285967Abstract: Examples are disclosed for a conformal coating molded around power source circuitry, electrical components or at least portions of a display for a computing device. The conformal coating to include embedded microencapsulated thermal energy storage material to absorb heat generated by the electrical components.Type: ApplicationFiled: December 11, 2012Publication date: September 25, 2014Inventors: Jered H. Wikander, Mark MacDonald, Shawn S. McEuen, Harish Jagadish, David Pidwerbecki
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Patent number: D737824Type: GrantFiled: August 30, 2013Date of Patent: September 1, 2015Assignee: Intel CorporationInventors: Harish Jagadish, Gokul Subramaniam, Madhukar Patil
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Patent number: D924810Type: GrantFiled: January 4, 2019Date of Patent: July 13, 2021Assignee: Intel CorporationInventors: Samantha Rao, Harish Jagadish, Arvind S
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Patent number: D1023975Type: GrantFiled: July 12, 2021Date of Patent: April 23, 2024Assignee: Intel CorporationInventors: Samantha Rao, Harish Jagadish, Arvind S