Abstract: An apparatus comprises an electrostatic chuck including a plate electrode and a column structure coupled with the plate electrode. A disk is coupled with the electrostatic chuck where the disk includes a first hole in a center of the disk and a second hole and a third hole distributed through the disk, where a portion of the column structure extends through the first hole. The apparatus further includes retention structures, wherein the retention structures individually include a shaft and a nut coupled with the shaft and the disk. The shaft extends through the second hole or the third hole and couples with a surface of the plate electrode.

Abstract: Disclosed are various systems that allow for plasma delivery from a central location in a multi-station processing chamber to be redirected to different processing stations within the chamber. Such systems may include a deflector plate that is mounted to a wafer indexer such that the deflector plate is centered on the wafer indexer. In other implementations, such systems may include a deflector plate that is mounted in a fixed relationship with a ceiling of the processing chamber. The deflector plate may have a body having a top surface and an underside surface that are on opposite sides of the body. A plurality of recesses may be arranged across the top surface in a radial pattern around a center axis.

Abstract: Disclosed are various systems that allow for plasma delivery from a central location in a multi-station processing chamber to be redirected to different processing stations within the chamber. Such systems may include a deflector plate that is mounted to a wafer indexer such that the deflector plate is centered on the wafer indexer. In other implementations, such systems may include a deflector plate that is mounted in a fixed relationship with a ceiling of the processing chamber.