Patents by Inventor Harish Lnu

Harish Lnu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10119494
    Abstract: The multi-layer gasket assembly includes a plurality of metal gasket layers which have at least one set of axially aligned openings. The plurality of gasket layers includes at least two functional layers which are arranged in a stacked relationship with one another. Each functional layer has at least one full embossment bead that is spaced radially from and surrounds the at least one opening. The functional layers are also arranged such that the full embossment beads are in a nested relationship with one another. At least one stopper is positioned adjacent the nested full embossment beads for preventing full flattening of the full embossment beads.
    Type: Grant
    Filed: July 28, 2015
    Date of Patent: November 6, 2018
    Assignee: Tenneco Inc.
    Inventors: Harish Lnu, Jake Hu, Takashi Okano
  • Publication number: 20170030293
    Abstract: The multi-layer gasket assembly includes a plurality of metal gasket layers which have at least one set of axially aligned openings. The plurality of gasket layers includes at least two functional layers which are arranged in a stacked relationship with one another. Each functional layer has at least one full embossment bead that is spaced radially from and surrounds the at least one opening. The functional layers are also arranged such that the full embossment beads are in a nested relationship with one another. At least one stopper is positioned adjacent the nested full embossment beads for preventing full flattening of the full embossment beads.
    Type: Application
    Filed: July 28, 2015
    Publication date: February 2, 2017
    Inventors: Harish Lnu, Jake Hu, Takashi Okano