Abstract: A compact planar balun formed on a substrate including a hairpin-shaped conductive microstrip and a single-ended contact. The hairpin-shaped conductive microstrip includes first and second linear segments integrally formed with a U-shaped segment, and a single-ended contact is conductively coupled at a location along the first linear segment. The first and second linear segments each have a first characteristic impedance and are in parallel with each other having a first end forming first and second differential contacts and having a second end. The U-shaped segment has a second characteristic impedance that is less than the first characteristic impedance in order to achieve proper scatter parameter alignment. The U-shaped segment may be generally formed thicker or wider than the linear segments to achieve a reduced characteristic impedance. In the alternative or in addition, co-planer ground metal is formed closer to the U-shaped segment to achieve a reduced characteristic impedance.

Abstract: A compact planar balun formed on a substrate including a hairpin-shaped conductive microstrip and a single-ended contact. The hairpin-shaped conductive microstrip includes first and second linear segments integrally formed with a U-shaped segment, and a single-ended contact is conductively coupled at a location along the first linear segment. The first and second linear segments each have a first characteristic impedance and are in parallel with each other having a first end forming first and second differential contacts and having a second end. The U-shaped segment has a second characteristic impedance that is less than the first characteristic impedance in order to achieve proper scatter parameter alignment. The U-shaped segment may be generally formed thicker or wider than the linear segments to achieve a reduced characteristic impedance. In the alternative or in addition, co-planer ground metal is formed closer to the U-shaped segment to achieve a reduced characteristic impedance.

Abstract: An integrated circuit device includes an integrated circuit device die and a substrate. The integrated circuit device die includes a plurality of first contact pads. The first contact pads include a pair of first signal contact pads configured to provide a differential signal port of the integrated circuit device die. The differential signal port is configured to operate at a predetermined frequency. The substrate includes a plurality of second contact pads on a first surface of the substrate. The second contact pads are configured to be soldered to a printed circuit board, and include a pair of second signal contact pads. The integrated circuit device die is affixed to a second surface of the substrate via the first contact pads. The substrate includes a pair of circuit paths that each couple one of the first signal contact pads to an associated one of the second signal contact pads.