Abstract: Microphone sub-assemblies for direct mounting on a telephone handset inner substrate comprise a tubular housing containing a microphone having terminal pins electrically connected within the tubular housing to leads extending through the housing tubular wall. The leads provide contact springs for spring biased contact with conductive lands on the substrate. In one embodiment, the contact springs comprise coiled springs and, in another embodiment, the contact springs comprise leaf springs terminating in arcuate cam surfaces.

Abstract: Acoustic component sub-assemblies for direct mounting on a telephone handset inner substrate comprise a tubular housing containing a component having terminal pins electrically connected within the tubular housing to coil springs extending outwardly through an open end of the tubular housing. The coil springs serve as component terminals for spring biased contact with conductive lands on the substrate. The tubular housing is press fitted within a seat on the substrate and contacted by the handset outer housing for being tightly clamped within the substrate seat.

Abstract: Microphone sub-assemblies for direct mounting on a telephone handset inner substrate comprise a tubular wall containing a microphone comprising a cylindrical can and elongated terminal pins extending from the can. The tubular wall is formed from a strip of an elastomeric material wrapped around and adhered to the microphone with the microphone terminal pins extending directly through the wall, in hermetic fit therewith, and radially from the wall. The sub-assembly is mounted in a telephone internal substrate by inserting the microphone terminal pins into a connector on the substrate. Both the sub-assembly and the substrate are firmly secured within a telephone housing with an open end of the tubular housing aligned with a sound admitting port through the telephone housing.