Patents by Inventor Harjashan Singh

Harjashan Singh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor device including dual pad wire bond interconnection
    Patent number: 10483239
    Abstract: A semiconductor device is disclosed including semiconductor die formed with a row of functional die bond pads and an adjacent row of dummy die bond pads. The functional die bond pads may be electrically connected to the integrated circuits formed within the semiconductor die. The dummy die bond pads may be formed in the scribe area of a semiconductor wafer from which the semiconductor die are formed, and are provided for wire bonding the semiconductor die within the semiconductor device.
    Type: Grant
    Filed: February 28, 2018
    Date of Patent: November 19, 2019
    Assignee: SanDisk Semiconductor (Shanghai) Co. Ltd.
    Inventors: Junrong Yan, Xiaofeng Di, Harjashan Singh, Gokul Kumar, Chee Keong Chin, Ming Xia Wu, Jian Bin Gu
  • SEMICONDUCTOR DEVICE INCLUDING DUAL PAD WIRE BOND INTERCONNECTION
    Publication number: 20180190621
    Abstract: A semiconductor device is disclosed including semiconductor die formed with a row of functional die bond pads and an adjacent row of dummy die bond pads. The functional die bond pads may be electrically connected to the integrated circuits formed within the semiconductor die. The dummy die bond pads may be formed in the scribe area of a semiconductor wafer from which the semiconductor die are formed, and are provided for wire bonding the semiconductor die within the semiconductor device.
    Type: Application
    Filed: February 28, 2018
    Publication date: July 5, 2018
    Applicant: SANDISK SEMICONDUCTOR (SHANGHAI) CO., LTD.
    Inventors: Junrong Yan, Xiaofeng Di, Harjashan Singh, Gokul Kumar, Chee Keong Chin, Ming Xia Wu, Jian Bin Gu