Abstract: The present invention discloses a laser scribing device that produces optimal scribing lines within a target substrate based on its thickness. This is accomplished by generating multiple or an optimum number of focal points, and dynamically adjusting the focal lengths of the focal points to create optimal distances between the scribing lines. The resulting scribing lines are efficient in breaking the target substrate. The position of the focal points and the distance between them are determined based on the thickness of the target substrate, and the distance between focal points or scribing lines can be dynamically adjusted by modifying the focal lengths of the focal points.

Abstract: Provided is a laser scribing device including: a laser light source for outputting a laser beam; a splitter for dividing the laser beam into a first laser beam and a second laser beam; a beam expander telescope for adjusting a divergent angle on a path of the first laser beam or a path of the second laser beam; a beam combiner for combining the first laser beam and the second laser beam; and a light-collecting lens for light-collecting the first and second laser beams that are combined by the beam combiner, wherein the first laser beam and the second laser beam have different focal distances.

Abstract: The present disclosure relates to laser processing and a laser processing apparatus for processing materials using laser. Processing performed after loading a wafer on a work stage and a laser processing apparatus for implementing such processing, among others, are disclosed. The laser processing includes loading a wafer on a work stage; determining the number of chips formed on the wafer loaded on the work stage, performing chip defect inspection and aligning the wafer while moving the work stage; measuring a height of a surface of the wafer loaded on the work stage using a displacement sensor; monitoring output power of a processing laser using a power meter; and shifting the work stage while irradiating a laser beam on the wafer to process the wafer.

Abstract: The present disclosure relates to laser processing and a laser processing apparatus for processing materials using laser. Processing performed after loading a wafer on a work stage and a laser processing apparatus for implementing such processing, among others, are disclosed. The laser processing includes loading a wafer on a work stage; determining the number of chips formed on the wafer loaded on the work stage, performing chip defect inspection and aligning the wafer while moving the work stage; measuring a height of a surface of the wafer loaded on the work stage using a displacement sensor; monitoring output power of a processing laser using a power meter; and shifting the work stage while irradiating a laser beam on the wafer to process the wafer.