Patents by Inventor Harlan C. Heffner

Harlan C. Heffner has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Computing system with superconducting and non-superconducting components located on a common substrate
    Patent number: 10165667
    Abstract: A computing system including a common substrate having both superconducting components and non-superconducting components is provided. The superconducting components may be attached towards a first end of the common substrate and the non-superconducting components may be attached towards a second end, opposite to the first end, of the common substrate. The common substrate may include circuit traces for interconnecting the superconducting components with the non-superconducting components. A heat-shield may thermally separate the first end from the second end of the common substrate such that the superconducting components are configured to operate in a temperature range between 2 Kelvin to 77 Kelvin and the non-superconducting components are configured to operate in a temperature range between 200 Kelvin to 400 Kelvin.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: December 25, 2018
    Assignee: Microsoft Technologies Licensing, LLC
    Inventors: Martin B. Christiansen, Stanley K. Wakamiya, Leonard G. Chorosinski, Harlan C. Heffner