Patents by Inventor HARLAN CRAIG HEFFNER

HARLAN CRAIG HEFFNER has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Immersion cooling temperature control method, system, and apparatus
    Patent number: 10438867
    Abstract: An apparatus for providing immersion cooling in a circuit card environment includes a circuit card having first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, respectively, which are different from one another. A thermal energy transfer device is operatively connected to an area of the circuit card correlated with a selected one of the first and second circuit card subassemblies. The thermal energy transfer device at least partially induces the respective one of the first and second operating temperatures to the selected circuit card subassembly. The thermal energy transfer device transversely overlies at least a supermajority of the selected circuit card subassembly and is laterally spaced from the other circuit card subassembly. A system and method for providing immersion cooling are also provided.
    Type: Grant
    Filed: March 8, 2018
    Date of Patent: October 8, 2019
    Assignee: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: Martin Brokner Christiansen, Leonard George Chorosinski, Harlan Craig Heffner, Stanley Katsuyoshi Wakamiya, Keith R. Kirkwood
  • IMMERSION COOLING TEMPERATURE CONTROL METHOD, SYSTEM, AND APPARATUS
    Publication number: 20190279916
    Abstract: An apparatus for providing immersion cooling in a circuit card environment includes a circuit card having first and second longitudinally spaced circuit card subassemblies, connected together into a single circuit card oriented substantially in a lateral-longitudinal plane. The first and second circuit card subassemblies have first and second operating temperatures, respectively, which are different from one another. A thermal energy transfer device is operatively connected to an area of the circuit card correlated with a selected one of the first and second circuit card subassemblies. The thermal energy transfer device at least partially induces the respective one of the first and second operating temperatures to the selected circuit card subassembly. The thermal energy transfer device transversely overlies at least a supermajority of the selected circuit card subassembly and is laterally spaced from the other circuit card subassembly. A system and method for providing immersion cooling are also provided.
    Type: Application
    Filed: March 8, 2018
    Publication date: September 12, 2019
    Applicant: NORTHROP GRUMMAN SYSTEMS CORPORATION
    Inventors: MARTIN BROKNER CHRISTIANSEN, LEONARD GEORGE CHOROSINSKI, HARLAN CRAIG HEFFNER, STANLEY KATSUYOSHI WAKAMIYA, KEITH R. KIRKWOOD