Abstract: Charge coupled devices (CCDs) can be placed next to each in a tiled array to reproduce a larger image. The seams between the CCDs in a tiled CCD array can be reduced by placing fiber optic arrays on top of each CCD in the CCD array. The fiber optic arrays have numerous optical fibers that are tilted with respect to the plane of the CCDs. The optical fibers can retrieve electromagnetic radiation falling in gaps between the tiled CCDs. The optical fiber arrays substantially reduce the seams that appear in the image. Electronic pixel binning configurations can be adjusted to accommodate the placement of the optical fibers. The fiber optic arrays can have beveled edges near the gaps between adjacent CCDs to image light in the gaps. Techniques for reducing the dead zone between CCDs in a tiled array and for forming fiber optic arrays on a common plane are also provided.

Abstract: A process for bonding silicon die to a package. This process comprises the following steps: (a) providing to the back surface of the die an adhesion layer of material which exhibits superior adhesion to both the silicon die and a subsequently applied barrier layer; (b) providing to the adhesion layer a barrier layer which is impervious to silicon; (c) providing to the barrier layer a bonding layer; and (d) bonding the die to the package by activating a binder composition disposed at the interface of the package and the bonding layer. The barrier layer prevents the migration of silicon to the bonding layer, both at the time of application of the bonding layer to the die and at the time of bonding the die to the package. The adhesion layer enhances the adhesion of the barrier layer material to the back surface of the die. Titanium is the preferred adhesion layer material while tungsten is the preferred barrier layer material.