Abstract: A method for forming a memory device includes the steps of providing a substrate, forming an isolation structure in the substrate to define a plurality of active regions in the substrate, the active regions respectively comprising two terminal portions and a central portion between the terminal portions, forming a plurality of island features on the substrate, wherein each of the island features covers two of the terminals portions respectively belonging to two of the active regions, performing a first etching process, using the island features as an etching mask to etch the substrate to define a plurality of island structures and a first recessed region surrounding the island structures on the substrate, and removing the island features to expose the island structures.

Abstract: A method for forming a memory device includes the steps of providing a substrate, forming an isolation structure in the substrate to define a plurality of active regions in the substrate, the active regions respectively comprising two terminal portions and a central portion between the terminal portions, forming a plurality of island features on the substrate, wherein each of the island features covers two of the terminals portions respectively belonging to two of the active regions, performing a first etching process, using the island features as an etching mask to etch the substrate to define a plurality of island structures and a first recessed region surrounding the island structures on the substrate, and removing the island features to expose the island structures.

Abstract: A method for forming a memory device is disclosed, including providing a substrate, forming an isolation structure and plural active regions in the substrate, forming a plurality of island features on the substrate respectively covering two of the terminal portions of the active regions, using the island features as an etching mask to etch the substrate to perform a first etching process to define a first recessed region and plural island structures on the substrate. The island structures respectively comprise the two terminal portions of the active regions and the first recessed region comprises the central portions of the active regions.

Abstract: A method for forming patterns is provided in the present invention. The process includes the steps of using a first mask to perform a first exposure process to a photoresist, using a second mask to perform a second exposure process to the photoresist, wherein the corners of the second opening patterns in the second mask and the corners of the first opening patterns in the first mask overlap each other, and performing a development process to remove the unexposed portions of the photoresist in the two exposure processes to form staggered hole patterns therein.

Abstract: A method for forming patterns is provided in the present invention. The process includes the steps of using a first mask to perform a first exposure process to a photoresist, using a second mask to perform a second exposure process to the photoresist, wherein the corners of the second opening patterns in the second mask and the corners of the first opening patterns in the first mask overlap each other, and performing a development process to remove the unexposed portions of the photoresist in the two exposure processes to form staggered hole patterns therein.

Abstract: A method for forming a memory device is disclosed, including providing a substrate, forming an isolation structure and plural active regions in the substrate, forming a plurality of island features on the substrate respectively covering two of the terminal portions of the active regions, using the island features as an etching mask to etch the substrate to perform a first etching process to define a first recessed region and plural island structures on the substrate. The island structures respectively comprise the two terminal portions of the active regions and the first recessed region comprises the central portions of the active regions.

Abstract: A semiconductor device and a manufacturing method thereof are provided. The semiconductor device includes a substrate, a plurality of active areas, and an isolation structure. The substrate has a device region and a peripheral region surrounding the device region. The active areas are located in the substrate in the device region. When viewed from above, the edges of the ends of the active areas adjacent to the boundary of the device region are aligned with each other, and the width of the ends of the active areas adjacent to the boundary of the device region is greater than the width of the other portions of the active areas. The isolation structure is disposed in the substrate and surrounds the active areas and is located in the peripheral region.

Abstract: A method for generating a layout pattern includes following steps. A basic layout pattern including a plurality of first stripe patterns in a first cluster region is provided. Each first stripe pattern extends in a first direction, and the first stripe patterns have equal pitches in a second direction. A plurality of anchor bar patterns are generated. Each anchor bar pattern extends in the first direction, and the anchor bar patterns have equal pitches in the second direction. Edges of at least one of the anchor bar patterns in the second direction are aligned with edges of two adjacent first stripe patterns respectively. At least one of the anchor bar patterns overlaps a first space between two adjacent first stripe patterns. At least one first mandrel pattern is generated at the first space overlapped by the anchor bar pattern, and the first mandrel pattern is outputted to a photomask.

Abstract: A method of decomposing pattern layout for generating patterns on photomasks is disclosed. The method includes decomposing features of an integrated circuit layout into discrete patterns based on the relation between these features. The features include first features and second features. The first features are then classified into a first feature pattern and a second feature pattern, and the second features are classified into third, fourth, fifth and sixth feature patterns. The spacings of the second features in the fifth and sixth feature patterns are greater than a minimum exposure limits. Finally, the first feature pattern is outputted to a first photomask, the second feature pattern is outputted to a second photomask, the third and fifth feature patterns are outputted to a third photomask, and the fourth and sixth feature patterns are outputted to a fourth photomask.

Abstract: A method of forming trenches is provided. A first layer, a second layer and a third layer are formed on the substrate. A patterned third layer with a plurality of third trenches is formed. A spacer is formed on sidewalls of the third trenches, following by removing a portion of the patterned third layer between the third trenches. By using the spacer and the patterned third layer as a mask, a patterned second layer with a plurality of second trenches is formed. Next, the patterned third layer and the spacer are completely removed, and a block layer is formed on the patterned second layer, filling into the at least one second trench to separate said second trench into at least two parts. The first layer is patterned by using the patterned second layer and the block layer as a mask to form a patterned first layer with first trenches.

Abstract: A method of forming trenches is provided. A first layer, a second layer and a third layer are formed on the substrate. A patterned third layer with a plurality of third trenches is formed. A spacer is formed on sidewalls of the third trenches, following by removing a portion of the patterned third layer between the third trenches. By using the spacer and the patterned third layer as a mask, a patterned second layer with a plurality of second trenches is formed. Next, the patterned third layer and the spacer are completely removed, and a block layer is formed on the patterned second layer, filling into the at least one second trench to separate said second trench into at least two parts. The first layer is patterned by using the patterned second layer and the block layer as a mask to form a patterned first layer with first trenches.

Abstract: A method of decomposing pattern layout for generating patterns on photomasks is disclosed. The method includes decomposing features of an integrated circuit layout into discrete patterns based on the relation between these features. The features include first features and second features. The first features are then classified into a first feature pattern and a second feature pattern, and the second features are classified into third, fourth, fifth and sixth feature patterns. The spacings of the second features in the fifth and sixth feature patterns are greater than a minimum exposure limits. Finally, the first feature pattern is outputted to a first photomask, the second feature pattern is outputted to a second photomask, the third and fifth feature patterns are outputted to a third photomask, and the fourth and sixth feature patterns are outputted to a fourth photomask.

Abstract: A method for generating a layout pattern includes following steps. A basic layout pattern including a plurality of first stripe patterns in a first cluster region is provided. Each first stripe pattern extends in a first direction, and the first stripe patterns have equal pitches in a second direction. A plurality of anchor bar patterns are generated. Each anchor bar pattern extends in the first direction, and the anchor bar patterns have equal pitches in the second direction. Edges of at least one of the anchor bar patterns in the second direction are aligned with edges of two adjacent first stripe patterns respectively. At least one of the anchor bar patterns overlaps a first space between two adjacent first stripe patterns. At least one first mandrel pattern is generated at the first space overlapped by the anchor bar pattern, and the first mandrel pattern is outputted to a photomask.