Patents by Inventor Harold A. Haldren

Harold A. Haldren has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for the evaluation of adhesive bond strength via swept-frequency ultrasonic phase measurements
    Patent number: 11519881
    Abstract: A method and system for ultrasonic testing of adhesion within a sample, which provides ultrasonic bursts of different frequencies to the sample and maintains a predetermined phase difference between echoes returned from the sample and representative reference signals of the bursts supplied to the sample until a spectrum of the phase differences versus frequency is obtained and from which properties of the adhesion at an interface reflecting the echoes are derivable.
    Type: Grant
    Filed: March 23, 2021
    Date of Patent: December 6, 2022
    Assignee: UNITED STATES OF AMERICA AS REPRESENTED BY THE ADMINISTRATOR OF NASA
    Inventors: Harold A. Haldren, Daniel F. Perey, William T. Yost, K. Elliott Cramer, Mool C. Gupta
  • Method for the Evaluation of Adhesive Bond Strength Via Swept-Frequency Ultrasonic Phase Measurements
    Publication number: 20210302380
    Abstract: A method and system for ultrasonic testing of adhesion within a sample, which provides ultrasonic bursts of different frequencies to the sample and maintains a predetermined phase difference between echoes returned from the sample and representative reference signals of the bursts supplied to the sample until a spectrum of the phase differences versus frequency is obtained and from which properties of the adhesion at an interface reflecting the echoes are derivable.
    Type: Application
    Filed: March 23, 2021
    Publication date: September 30, 2021
    Inventors: Harold A. Haldren, Daniel F. Perey, William T. Yost, K. Elliott Cramer, Mool C. Gupta