Abstract: In accordance with one or more embodiments of the present invention, a technique fabricating a magnetoresistive memory device, where the magnetoresistive memory device has a magnetic memory element and a plurality of conductors for at least one of reading and writing the magnetic memory element. The plurality of conductors include a first conductor at least partially located at a first side of the magnetic memory element for reading the magnetic memory element, a second conductor at least partially located at a second side of the magnetic memory element for reading the magnetic memory element, a third conductor at least partially located at the second side of the magnetic memory element for writing the magnetic memory element, and a fourth conductor at least partially located at the first side of the magnetic memory element for writing the magnetic memory element. The first conductor is formed before the fourth conductor.

Abstract: In accordance with one or more embodiments of the present invention, a technique fabricating a magnetoresistive memory device, where the magnetoresistive memory device has a magnetic memory element and a plurality of conductors for at least one of reading and writing the magnetic memory element. The plurality of conductors include a first conductor at least partially located at a first side of the magnetic memory element for reading the magnetic memory element, a second conductor at least partially located at a second side of the magnetic memory element for reading the magnetic memory element, a third conductor at least partially located at the second side of the magnetic memory element for writing the magnetic memory element, and a fourth conductor at least partially located at the first side of the magnetic memory element for writing the magnetic memory element. The first conductor is formed before the fourth conductor.

Abstract: A process for configuring a thin film resonator to advantageously shape a desired acoustic mode of the resonator such that the electrical and acoustic performance of the resonator is enhanced. As a result of the contouring or shaping, a minimum amount of acoustic energy occurs near the edge of the resonator, from which energy may leak or at which undesired waves may be created by a desired mode. The process is used during batch-fabrication of thin-film resonators which are used in high frequency RF filtering or frequency control applications. Utilizing photolithography, the shaping can be achieved in a manner derived from the known methods used to manufacture lens arrays. Using the process, the lateral motion of acoustic waves within the resonator may be controlled and the acoustic energy of the sound wave positioned at a desired location within the resonator.

Abstract: A process for configuring a thin film resonator to advantageously shape a desired acoustic mode of the resonator such that the electrical and acoustic performance of the resonator is enhanced. As a result of the contouring or shaping, a minimum amount of acoustic energy occurs near the edge of the resonator, from which energy may leak or at which undesired waves may be created by a desired mode. The process is used during batch-fabrication of thin-film resonators which are used in high frequency RF filtering or frequency control applications. Utilizing photolithography, the shaping can be achieved in a manner derived from the known methods used to manufacture lens arrays. Using the process, the lateral motion of acoustic waves within the resonator may be controlled and the acoustic energy of the sound wave positioned at a desired location within the resonator.

Abstract: Thick double heterostructure (Al,Ga)As wafers comprising layers of gallium arsenide and gallium aluminum arsenide on a metallized n-GaAs substrate are separated into individual devices for use as diode lasers. In contrast to prior art techniques employed with thinner wafers of mechanically cleaving the wafer in mutually orthogonal directions, the wafer is first separated into bars of diodes by a process which comprises (a) forming channels of substantially parallel sidewalls about 1 to 4 mils deep into the surface of the n-GaAs substrate (b) etching into the n-GaAs substrate with an anisotropic etchant to a depth sufficient to form V-grooves in the bottom of the channels and (c) mechanically cleaving into bars of diodes. The cleaving may be done by prior art techniques using a knife, razor blade or tweezer edge or by attaching the side of the wafer opposite to the V-grooves to a flexible adhesive tape and rolling the assembly in a manner such as over a tool of small radius.

Abstract: Double heterostructure (Al,Ga)As wafer comprising layers of gallium arsenide and aluminum gallium arsenide on a metallized n-GaAs substrate are separated into individual devices for use as diode lasers. In contrast to prior art techniques of mechanically cleaving the wafer in mutually orthogonal directions, the wafer is first separated into bars of diodes by a process which comprises (a) forming an array of exposed lines on the n-side by photolithography to define the lasing ends of the diodes, (b) etching through the exposed metallized portion to expose portions of the underlying n-GaAs, (c) etching into the n-GaAs substrate with a V-groove etchant to a distance of about 1 to 2 mils less than the total thickness of the wafer and (d) mechanically cleaving into bars of diodes.