Abstract: A nonlinear terahertz (THz) spectroscopy technique uses a sample illuminated by two THz pulses separately. The illumination generates two signals BA and BB, corresponding to the first and second THz pulse, respectively, after interaction with the sample. The interaction includes excitation of at least one ESR transition in the sample. The sample is also illuminated by the two THz pulses together, with an inter-pulse delay ?, generating a third signal BAB. A nonlinear signal BNL is then derived via BNL=BAB?BA?BB. This nonlinear signal BNL can be then processed (e.g., Fourier transform) to study the properties of the sample.

Abstract: A nonlinear terahertz (THz) spectroscopy technique uses a sample illuminated by two THz pulses separately. The illumination generates two signals BA and BB, corresponding to the first and second THz pulse, respectively, after interaction with the sample. The interaction includes excitation of at least one ESR transition in the sample. The sample is also illuminated by the two THz pulses together, with an inter-pulse delay ?, generating a third signal BAB. A nonlinear signal BNL is then derived via BNL=BAB?BA?BB. This nonlinear signal BNL can be then processed (e.g., Fourier transform) to study the properties of the sample.

Abstract: A nonlinear terahertz (THz) spectroscopy technique uses a sample illuminated by two THz pulses separately. The illumination generates two signals BA and BB, corresponding to the first and second THz pulse, respectively, after interaction with the sample. The interaction includes excitation of at least one ESR transition in the sample. The sample is also illuminated by the two THz pulses together, with an inter-pulse delay ?, generating a third signal BAB. A nonlinear signal BNL is then derived via BNL=BAB?BA?BB. This nonlinear signal BNL can be then processed (e.g., Fourier transform) to study the properties of the sample.

Abstract: A radiation detection technique employs field enhancing structures and electroluminescent materials to converts incident Terahertz (THz) radiation into visible light and/or infrared light. In this technique, the field-enhancing structures, such as split ring resonators or micro-slits, enhances the electric field of incoming THz light within a local area, where the electroluminescent material is applied. The enhanced electric field then induces the electroluminescent material to emit visible and/or infrared light via electroluminescent process. A detector such as avalanche photodiode can detect and measure the emitted light. This technique allows cost-effective detection of THz radiation at room temperatures.

Abstract: A nonlinear terahertz (THz) spectroscopy technique uses a sample illuminated by two THz pulses separately. The illumination generates two signals BA and BB, corresponding to the first and second THz pulse, respectively, after interaction with the sample. The interaction includes excitation of at least one ESR transition in the sample. The sample is also illuminated by the two THz pulses together, with an inter-pulse delay ?, generating a third signal BAB. A nonlinear signal BNL is then derived via BNL=BAB?BA?BB. This nonlinear signal BNL can be then processed (e.g., Fourier transform) to study the properties of the sample.

Abstract: A radiation detection technique employs field enhancing structures and electroluminescent materials to converts incident Terahertz (THz) radiation into visible light and/or infrared light. In this technique, the field-enhancing structures, such as split ring resonators or micro-slits, enhances the electric field of incoming THz light within a local area, where the electroluminescent material is applied. The enhanced electric field then induces the electroluminescent material to emit visible and/or infrared light via electroluminescent process. A detector such as avalanche photodiode can detect and measure the emitted light. This technique allows cost-effective detection of THz radiation at room temperatures.

Abstract: One example embodiment includes an optical subassembly (OSA). The OSA includes a flex circuit, an optical port, and an active optical component subassembly. The flex circuit is constructed of at least one electrically-conductive layer and at least one electrical insulator layer. The optical port defines a barrel cavity and is mechanically coupled to the flex circuit at a flex connection. The active optical component subassembly is positioned within the barrel cavity and electrically coupled to the flex circuit.

Abstract: One example embodiment includes an optical subassembly (OSA). The OSA includes a flex circuit, an optical port, and an active optical component subassembly. The flex circuit is constructed of at least one electrically-conductive layer and at least one electrical insulator layer. The optical port defines a barrel cavity and is mechanically coupled to the flex circuit at a flex connection. The active optical component subassembly is positioned within the barrel cavity and electrically coupled to the flex circuit.

Abstract: A radiation detection technique employs field enhancing structures and electroluminescent materials to converts incident Terahertz (THz) radiation into visible light and/or infrared light. In this technique, the field-enhancing structures, such as split ring resonators or micro-slits, enhances the electric field of incoming THz light within a local area, where the electroluminescent material is applied. The enhanced electric field then induces the electroluminescent material to emit visible and/or infrared light via electroluminescent process. A detector such as avalanche photodiode can detect and measure the emitted light. This technique allows cost-effective detection of THz radiation at room temperatures.

Abstract: One example embodiment includes an optical subassembly (OSA). The OSA includes a flex circuit, an optical port, and an active optical component subassembly. The flex circuit is constructed of at least one electrically-conductive layer and at least one electrical insulator layer. The optical port defines a barrel cavity and is mechanically coupled to the flex circuit at a flex connection. The active optical component subassembly is positioned within the barrel cavity and electrically coupled to the flex circuit.

Abstract: An opto-isolator is disclosed that include a vertical cavity surface emitting laser (VCSEL), a photodetector and a package enclosing the VCSEL and the photodetector. The photodetector is optically coupled to the VCSEL and configured to receive an output optical signal generated by the VCSEL.

Abstract: Monolithic opto-isolators and arrays of monolithic opto-isolators are disclosed. The monolithic opto-isolators are manufactured in a single semiconductor wafer where they may be tested at the wafer level before each opto-isolator is singulated from the wafer. The monolithic opto-isolators include a VCSEL monolithically produced adjacent to a photodiode where an axis of optical signal transmission of the VCSEL is substantially parallel to an axis of optical signal reception by the photodiode.

Abstract: An opto-isolator is disclosed that include a vertical cavity surface emitting laser (VCSEL), a photodetector and a package enclosing the VCSEL and the photodetector. The photodetector is optically coupled to the VCSEL and configured to receive an output optical signal generated by the VCSEL.

Abstract: The present invention relates to opto-isolators. Opto-isolators are disclosed that include a transmitter package and a vertical VCSEL disposed within the transmitter package. The opto-isolators further include a receiver package and a photodetector disposed within the receiver package. The photodetector is optically coupled to the VCSEL and configured to receive an output optical signal generated by the VCSEL. The opto-isolators further include an alignment package configured to receive the transmitter package and the receiver package. In another embodiment, opto-isolators include a VCSEL and a photodetector optically coupled to the VCSEL and configured to receive an output optical signal generated by the VCSEL. The opto-isolators further include a package enclosing both the VCSEL and the photodetector.

Abstract: The present invention relates to opto-isolators. Opto-isolators are disclosed that include a transmitter package and a vertical VCSEL disposed within the transmitter package. The opto-isolators further include a receiver package and a photodetector disposed within the receiver package. The photodetector is optically coupled to the VCSEL and configured to receive an output optical signal generated by the VCSEL. The opto-isolators further include an alignment package configured to receive the transmitter package and the receiver package. In another embodiment, opto-isolators include a VCSEL and a photodetector optically coupled to the VCSEL and configured to receive an output optical signal generated by the VCSEL. The opto-isolators further include a package enclosing both the VCSEL and the photodetector.

Abstract: The present invention relates to opto-isolators. Opto-isolators are disclosed that include a transmitter package and a vertical VCSEL disposed within the transmitter package. The opto-isolators further include a receiver package and a photodetector disposed within the receiver package. The photodetector is optically coupled to the VCSEL and configured to receive an output optical signal generated by the VCSEL. The opto-isolators further include an alignment package configured to receive the transmitter package and the receiver package. In another embodiment, opto-isolators include a VCSEL and a photodetector optically coupled to the VCSEL and configured to receive an output optical signal generated by the VCSEL. The opto-isolators further include a package enclosing both the VCSEL and the photodetector.

Abstract: Monolithic opto-isolators and arrays of monolithic opto-isolators are disclosed. The monolithic opto-isolators are manufactured in a single semiconductor wafer where they may be tested at the wafer level before each opto-isolator is singulated from the wafer. The monolithic opto-isolators include a VCSEL monolithically produced adjacent to a photodiode where an axis of optical signal transmission of the VCSEL is substantially parallel to an axis of optical signal reception by the photodiode.

Abstract: The present invention relates to opto-isolators. Opto-isolators are disclosed that include a transmitter package and a vertical VCSEL disposed within the transmitter package. The opto-isolators further include a receiver package and a photodetector disposed within the receiver package. The photodetector is optically coupled to the VCSEL and configured to receive an output optical signal generated by the VCSEL. The opto-isolators further include an alignment package configured to receive the transmitter package and the receiver package. In another embodiment, opto-isolators include a VCSEL and a photodetector optically coupled to the VCSEL and configured to receive an output optical signal generated by the VCSEL. The opto-isolators further include a package enclosing both the VCSEL and the photodetector.

Abstract: Reducing transmission of electromagnetic waves through a barrel portion of an optical module. A barrel for optically coupling an optical device to an optical fiber within a fiber optic cable can include a plastic portion and a metallic shielding portion for reducing transmission through the barrel. An optical device can be coupled to the plastic portion. The metallic shielding portion can be coupled to the plastic portion and surround at least a portion of the plastic portion. The metallic shielding portion can be shaped and configured so as to reduce transmission of electromagnetic radiation through the barrel.

Abstract: A versatile optical sensor method and assembly (200) is disclosed, providing cost-effective and readily adaptable optical sensor packaging while minimizing product variance, and comprising an integrally molded or single foundation piece (202) formed with a light source housing (302), a lens alignment feature (304) surrounding the light source housing, a mounting alignment feature (210), a sensor housing (206), and a barrier feature (204), further comprising a light source member (300) mounted to the foundation piece within the light source housing, a single lens member (214) enclosing the light source member and formed to engage with the lens alignment feature, and a detector member (208) mounted to the foundation piece within the sensor housing.