Patents by Inventor Harold E. Kline

Harold E. Kline has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Submicron contact fill using a CVD TiN barrier and high temperature PVD aluminum alloy deposition
    Patent number: 7226858
    Abstract: A submicron contact opening fill using a chemical vapor deposition (CVD) TiN liner/barrier and a high temperature, e.g., greater than about 385° C., physical vapor deposition (PVD) aluminum alloy layer that substantially fills the submicron contact.
    Type: Grant
    Filed: January 6, 2005
    Date of Patent: June 5, 2007
    Assignee: Microchip Technology Incorporated
    Inventors: Jacob Lee Williams, Harold E. Kline