Abstract: There are provided superplastic alloys formed by electrodeposition of the alloy onto a cathode from an electrolyte containing a first metal ion, which is iron, nickel or cobalt, and a second constituent different from the first, which is iron, nickel, cobalt, tungsten or molybdenum, or a colloidal dispersoid. The products formed are fine-grain deposits free of intergranular embrittling films, and exhibit grain boundary flow at a superplastic temperature below a recrystallization temperature of the deposit. Nickel-cobalt alloys are preferred, and are deposited from halide-free sulfamate baths, with care being taken to eliminate all anode oxides from the system. In a complex structure, the approximate initial hardware contour is formed by electrodeposition, and the final structure formed by superplastic forming.