Patents by Inventor Harold Fenger

Harold Fenger has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit board assembly and method of attaching a chip to a circuit board
    Publication number: 20050151215
    Abstract: An antenna array is assembled by direct attaching a flip chip transmit/receive (T/R) module to an antenna circuit board. A fillet bond is applied to the circuit board and the flip chip T/R module around at least a portion of the periphery of the flip chip T/R module.
    Type: Application
    Filed: January 13, 2004
    Publication date: July 14, 2005
    Inventors: Mark Hauhe, Kevin Rolston, Clifton Quan, Harold Fenger, Tse Wong