Abstract: A boat used in a chemical vapor deposition (CVD) furnace is configured to hold one or more complex three-dimensional (3D) structures when performing a coating. A platform wafer is placed horizontally in the boat to support the complex 3D structures and a mount is positioned to secure the complex 3D structures on the platform wafer during the CVD process. One or more “witness” wafers may also be placed in the boat for analyzing the thin-film coating. The platform wafer may be positioned between or bracketed by the vertical wafers. Parts with coatings manufactured using LPCVD are further disclosed.

Abstract: Methods of forming a monolayer of nanoparticles are described. The method may include forming an activated surface on a substrate. Methods may also include contacting the activated surface with a fluid including nanoparticles. Methods may further include forming a plurality of monolayers in the liquid on the activated surface. The plurality of nanoparticles may include a first monolayer of nanoparticles bonded to the activated surface. The plurality of nanoparticles may include a second monolayer of nanoparticles bonded to the first monolayer of nanoparticles. The bond strengths between a nanoparticle and the underlying substrate, between adjacent nanoparticles, and between nanoparticles of adjacent monolayers may be related by a specific relationship. The method may also include removing monolayers of the plurality of monolayers while retaining the first monolayer to form the substrate with the first monolayer. Systems for performing the methods and substrates resulting from the methods are also described.

Abstract: A method for processing a surface, comprising obtaining a substrate comprising an epitaxially grown semiconductor; reacting a surface of the semiconductor and/or a surface of a dielectric layer on the semiconductor, with a reactant comprising a gas or a plasma, to form a reactive layer on the dielectric layer and/or the semiconductor, wherein the reactive layer comprises a chemical compound including the reactant and elements of the dielectric layer or the semiconductor; and processing (e.g.

Abstract: A method for etching a surface including obtaining a structure comprising a plurality of nanowires on or above a substrate and a dielectric layer on or above the nanowires, wherein the dielectric layer comprises protrusions formed by the underlying nanowires; reacting a surface of the dielectric layer with a reactant, comprising a gas or a plasma, to form a reactive layer on the dielectric layer, wherein the reactive layer comprises a chemical compound including the reactant and elements of the dielectric layer and the reactive layer comprises sidewalls defined by the protrusions; and selectively etching the reactive layer, wherein the etching etches the protrusions laterally through the sidewalls so as to planarize the surface and remove or shrink the protrusions.

Abstract: Methods described herein allow for a smoothing of a particular material on a substrate independently of smoothing a different material on the substrate. Both materials may be exposed to the same reactant but form different skins (e.g., reactive layers). One skin may allow for smoothing of one material, while the other skin may protect or preserve the underlying material. Removing one of the skins may result in a smoother underlying material. The skins may be formed by a dry process and removed by a wet process, or the skins may be formed by a wet process and removed by a dry process. The change of the reaction medium between wet and dry for reaction and removal may allow for highly selective chemistries to result in smoothing one material while not affecting the underlying substrate or other materials at the surface. Substrates produced by these methods are described herein.

Abstract: Disclosed herein is a method of producing an infrared detector. In certain embodiments, the method includes: forming a planar multi-layer structure including an absorber including a superlattice structure; patterning the planar multi-layer structure; etching the planar multi-layer structure to define a plurality of pixels, the sidewalls of the plurality of pixels includes a sidewall roughness and multiple types of surface oxides; and performing a surface treatment process to the plurality of pixels in order to reduce the sidewall roughness and replace the surface oxides with a chlorinated surface morphology. The surface treatment process may reduce surface current of the infrared detector which may decrease the dark current in the infrared detector.

Abstract: Methods of forming a monolayer of nanoparticles are described. The method may include forming an activated surface on a substrate. Methods may also include contacting the activated surface with a fluid including nanoparticles. Methods may further include forming a plurality of monolayers in the liquid on the activated surface. The plurality of nanoparticles may include a first monolayer of nanoparticles bonded to the activated surface. The plurality of nanoparticles may include a second monolayer of nanoparticles bonded to the first monolayer of nanoparticles. The bond strengths between a nanoparticle and the underlying substrate, between adjacent nanoparticles, and between nanoparticles of adjacent monolayers may be related by a specific relationship. The method may also include removing monolayers of the plurality of monolayers while retaining the first monolayer to form the substrate with the first monolayer. Systems for performing the methods and substrates resulting from the methods are also described.

Abstract: A method for etching a surface including obtaining a structure comprising a plurality of nanowires on or above a substrate and a dielectric layer on or above the nanowires, wherein the dielectric layer comprises protrusions formed by the underlying nanowires; reacting a surface of the dielectric layer with a reactant, comprising a gas or a plasma, to form a reactive layer on the dielectric layer, wherein the reactive layer comprises a chemical compound including the reactant and elements of the dielectric layer and the reactive layer comprises sidewalls defined by the protrusions; and selectively etching the reactive layer, wherein the etching etches the protrusions laterally through the sidewalls so as to planarize the surface and remove or shrink the protrusions.

Abstract: A method for etching a surface including obtaining a substrate comprising a material; reacting a surface of a substrate with a reactant, comprising a gas or a plasma, to form a reactive layer on the substrate, the reactive layer comprising a chemical compound including the reactant and the material; and wet etching or dissolving the reactive layer with a liquid wet etchant of solvent that selectively etches or dissolves the reactive layer but not the substrate.

Abstract: An atmospheric water generation system with high efficiency is based on a counter flowing heat exchanger including multiple cold channels, each cold channel surrounded by multiple hot channels. The hot and warm gases flow in opposite directions, allowing the cool dry air to contribute to cooling the warm humid air to the dew point. Thermoelectric or passive cooling of the warm humid air, and hydrophobic surfaces in a cyclone structure also contribute in increasing the efficiency of the water generation system.

Abstract: The physical and chemical properties of surfaces can be controlled by bonding nanoparticles, microspheres, or nanotextures to the surface via inorganic precursors. Surfaces can acquire a variety of desirable properties such as antireflection, antifogging, antifrosting, UV blocking, and IR absorption, while maintaining transparency to visible light. Micro or nanomaterials can also be used as etching masks to texture a surface and control its physical and chemical properties via its micro or nanotexture.

Abstract: The physical and chemical properties of surfaces can be controlled by bonding nanoparticles, microspheres, or nanotextures to the surface via inorganic precursors. Surfaces can acquire a variety of desirable properties such as antireflection or reflection, antifogging, antifrosting, UV blocking, and IR absorption, while maintaining transparency to visible light. Micro or nanomaterials can also be used as etching masks to texture a surface and control its physical and chemical properties via its micro or nanotexture.

Abstract: The physical and chemical properties of surfaces can be controlled by bonding nanoparticles, microspheres, or nanotextures to the surface via inorganic precursors. Surfaces can acquire a variety of desirable properties such as antireflection or reflection, antifogging, antifrosting, UV blocking, and IR absorption, while maintaining transparency to visible light. Micro or nanomaterials can also be used as etching masks to texture a surface and control its physical and chemical properties via its micro or nanotexture.

Abstract: The optical scattering response of a textured substrate is altered by the addition of one or more layers of nanoparticles and/or coatings. The nanoparticles and/or coatings have a refractive index that is comparable, or higher, than the refractive index of the substrate. The scattering cross section of the substrate is reduced by partially or completely filling gaps in the substrate. A material having a hazy appearance to visible light is therefore rendered more transparent by the addition of nanoparticles.

Abstract: The physical and chemical properties of surfaces can be controlled by bonding nanoparticles, microspheres, or nanotextures to the surface via inorganic precursors. Surfaces can acquire a variety of desirable properties such as antireflection or reflection, antifogging, antifrosting, UV blocking, and IR absorption, while maintaining transparency to visible light. Micro or nanomaterials can also be used as etching masks to texture a surface and control its physical and chemical properties via its micro or nanotexture.

Abstract: The physical and chemical properties of surfaces can be controlled by bonding nanoparticles, microspheres, or nanotextures to the surface via inorganic precursors. Surfaces can acquire a variety of desirable properties such as antireflection, antifogging, antifrosting, UV blocking, and IR absorption, while maintaining transparency to visible light. Micro or nanomaterials can also be used as etching masks to texture a surface and control its physical and chemical properties via its micro or nanotexture.

Abstract: The physical and chemical properties of surfaces can be controlled by bonding nanoparticles, microspheres, or nanotextures to the surface via inorganic precursors. Surfaces can acquire a variety of desirable properties such as antireflection, antifogging, antifrosting, UV blocking, and IR absorption, while maintaining transparency to visible light. Micro or nanomaterials can also be used as etching masks to texture a surface and control its physical and chemical properties via its micro or nanotexture.

Abstract: The physical and chemical properties of surfaces can be controlled by bonding nanoparticles, microspheres, or nanotextures to the surface via inorganic precursors. Surfaces can acquire a variety of desirable properties such as antireflection, antifogging, antifrosting, UV blocking, and IR absorption, while maintaining transparency to visible light. Micro or nanomaterials can also be used as etching masks to texture a surface and control its physical and chemical properties via its micro or nanotexture.

Abstract: The physical and chemical properties of surfaces can be controlled by bonding nanoparticles, microspheres, or nanotextures to the surface via inorganic precursors. Surfaces can acquire a variety of desirable properties such as antireflection or reflection, antifogging, antifrosting, UV blocking, and IR absorption, while maintaining transparency to visible light. Micro or nanomaterials can also be used as etching masks to texture a surface and control its physical and chemical properties via its micro or nanotexture.

Abstract: The physical and chemical properties of surfaces can be controlled by bonding nanoparticles, microspheres, or nanotextures to the surface via inorganic precursors. Surfaces can acquire a variety of desirable properties such as antireflection, antifogging, antifrosting, UV blocking, and IR absorption, while maintaining transparency to visible light. Micro or nanomaterials can also be used as etching masks to texture a surface and control its physical and chemical properties via its micro or nanotexture.