Abstract: A process of forming an electronic device includes providing a wire comprising a first ball at an end thereof, operating on the first ball to modify a surface of the first ball to form a modified surface, moving the first ball to a first location on a die, and bonding the first ball along the modified surface to the first location of the die. In an embodiment, the process further includes moving a bonding tool including the wire away from the die while the wire remains bonded to the die.

Abstract: A process of forming an electronic device includes providing a wire comprising a first ball at an end thereof, operating on the first ball to modify a surface of the first ball to form a modified surface, moving the first ball to a first location on a die, and bonding the first ball along the modified surface to the first location of the die. In an embodiment, the process further includes moving a bonding tool including the wire away from the die while the wire remains bonded to the die.

Abstract: A semiconductor device (10) is made by mounting the bottom surfaces (31, 44, 54) of a semiconductor die (14) and a lead (15, 17) on a tape (12) and over a hole (19) in the tape. A vacuum is drawn through the hole to secure the die in place when the lead's top surface (43) is wirebonded to a top surface (32) of the semiconductor die. A molding material (49) is formed to encapsulate the top surface of the semiconductor die and to expose its bottom surface.

Abstract: In one embodiment, a semiconductor package is formed by adding a layer of particles to desired portions of a packing substrate. The layer of particles forms a matrix of crevices that provides a micro-lock feature for mechanically locking or engaging encapsulating materials.

Abstract: A flexible shelf (12) and a method for coupling a semiconductor chip (33) to a leadframe (23) using the flexible shelf (12). The flexible shelf (12) has a mounting portion (16), a flexible portion (17), and a leadframe support portion (18). The flexible shelf (12) is used in a wire bonding support assembly (10) to provide support for the leadframe (23) during wire bonding. The flexible portion (17) of the flexible shelf (12) flexes to increase thermal conductivity between a heater block (29) and the leadframe (23) during wire bonding.

Abstract: A simplified lamp mount structure is disclosed in which one end of the filament is attached to the apex of a loop with the free ends of the loop embedded in glass. The other end of the filament is attached to a conventional inner lead wire.

Abstract: An improved gas mixer is described in which combustible or explosive mixtures of gases are formed in a confined area on the outside surface of the mixer.

Abstract: An improved lead wire forming apparatus is described comprising wire flattening apparatus, a three jaw hook former, and clamping dies for fastening the lead wire about a filament.BACKGROUND OF THE INVENTIONThis invention relates to the manufacture of incandescent lamps and, in particular, to apparatus for fastening lead wires to incandescent filaments, especially coiled filaments.In the prior art, lead wires were flattened, given an initial bend with clamping jaws, received a filament while in the clamping jaws, and then clamped around the filament using the filament as an anvil in the same clamping jaws.While the connection provided in this manner is adequate initially, the connection has a tendency to deteriorate in use, particularly where the use requires a large number of on-off cycles as in signal lamps. This deterioration causes early and unpredictable failure of the lamp.The deterioration is believed due to a number of factors which revolve around the way the connection is made.