Patents by Inventor Harold Gaudette

Harold Gaudette has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • MULTI-PART FLEXIBLE ENCAPSULATION HOUSING FOR ELECTRONIC DEVICES
    Publication number: 20200281082
    Abstract: Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal IC device is disclosed which includes a flexible substrate, electronic circuitry attached to the flexible substrate, and a flexible multi-part encapsulation housing encasing therein the electronic circuitry and flexible substrate. The multi-part housing includes first and second encapsulation housing components. The first encapsulation housing component has recessed regions for seating therein the electronic circuitry, while the second encapsulation housing component has recessed regions for seating therein the flexible substrate. First encapsulation housing component optionally includes a recessed region for seating therein the flexible substrate.
    Type: Application
    Filed: October 11, 2019
    Publication date: September 3, 2020
    Inventors: Brian Elolampi, David G. Garlock, Harold Gaudette, Steven Fastert, Adam Standley, Yung-Yu Hsu
  • Multi-part flexible encapsulation housing for electronic devices and methods of making the same
    Patent number: 10485118
    Abstract: Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal IC device is disclosed which includes a flexible substrate, electronic circuitry attached to the flexible substrate, and a flexible multi-part encapsulation housing encasing therein the electronic circuitry and flexible substrate. The multi-part housing includes first and second encapsulation housing components. The first encapsulation housing component has recessed regions for seating therein the electronic circuitry, while the second encapsulation housing component has recessed regions for seating therein the flexible substrate. First encapsulation housing component optionally includes a recessed region for seating therein the flexible substrate.
    Type: Grant
    Filed: March 4, 2015
    Date of Patent: November 19, 2019
    Assignee: MC10, Inc.
    Inventors: Brian Elolampi, David G. Garlock, Harold Gaudette, Steven Fastert, Adam Standley, Yung-Yu Hsu
  • MULTI-PART FLEXIBLE ENCAPSULATION HOUSING FOR ELECTRONIC DEVICES
    Publication number: 20170223846
    Abstract: Encapsulated conformal electronic devices, encapsulated conformal integrated circuit (IC) systems, and methods of making and using encapsulated conformal electronic devices are presented herein. A conformal IC device is disclosed which includes a flexible substrate, electronic circuitry attached to the flexible substrate, and a flexible multi-part encapsulation housing encasing therein the electronic circuitry and flexible substrate. The multi-part housing includes first and second encapsulation housing components. The first encapsulation housing component has recessed regions for seating therein the electronic circuitry, while the second encapsulation housing component has recessed regions for seating therein the flexible substrate. First encapsulation housing component optionally includes a recessed region for seating therein the flexible substrate.
    Type: Application
    Filed: March 4, 2015
    Publication date: August 3, 2017
    Inventors: Brian Elolampi, David G. Garlock, Harold Gaudette, Steven Fastert, Adam Standley, Yung-Yu Hsu