Patents by Inventor Harold H. Roosen

Harold H. Roosen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Microscopic structure packaging method and device with packaged microscopic structure
    Patent number: 8330238
    Abstract: A method of packaging a micro electro-mechanical structure comprises forming said structure on a substrate; depositing a sacrificial layer over said structure; patterning the sacrificial layer; depositing a SIPOS (semi-insulating polycrystalline silicon) layer over the patterned sacrificial layer; treating the SIPOS layer with an etchant to convert the SIPOS layer into a porous SIPOS layer, removing the patterned sacrificial layer through the porous layer SIPOS to form a cavity including said structure; and sealing the porous SIPOS layer. A device including such a packaged micro electro-mechanical structure is also disclosed.
    Type: Grant
    Filed: November 23, 2010
    Date of Patent: December 11, 2012
    Assignee: NXP B.V.
    Inventors: Johannes van Wingerden, Wim van den Einden, Harold H. Roosen, Greja Johanna Adriana Maria Verheijden, Gerhard Koops, Didem Ernur, Jozef Thomas Martinus van Beek
  • MICROSCOPIC STRUCTURE PACKAGING METHOD AND DEVICE WITH PACKAGED MICROSCOPIC STRUCTURE
    Publication number: 20110175178
    Abstract: A method of packaging a micro electro-mechanical structure comprises forming said structure on a substrate; depositing a sacrificial layer over said structure; patterning the sacrificial layer; depositing a SIPOS (semi-insulating polycrystalline silicon) layer over the patterned sacrificial layer; treating the SIPOS layer with an etchant to convert the SIPOS layer into a porous SIPOS layer, removing the patterned sacrificial layer through the porous layer SIPOS to form a cavity including said structure; and sealing the porous SIPOS layer. A device including such a packaged micro electro-mechanical structure is also disclosed.
    Type: Application
    Filed: November 23, 2010
    Publication date: July 21, 2011
    Applicant: NXP B.V.
    Inventors: Johannes van WINGERDEN, Wim van den EINDEN, Harold H. ROOSEN, Greja Johanna Adriana Maria VERHEIJDEN, Gerhard KOOPS, Didem ERNUR, Jozef Thomas Martinus van BEEK