Patents by Inventor Harold Hasely Ball

Harold Hasely Ball has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Method for providing secure and trusted ASICs using 3D integration
    Patent number: 7783994
    Abstract: A system and a method for providing secure and trusted application specific integrated circuits (ASICs) using three-dimensional (3D) integrated circuit (IC) integration. The method includes fabricating a plurality of sub-circuits and assembling an overall 3D ASIC device from the plurality of sub-circuits. Each sub-circuit includes a plurality of input-output (IO) pads, is fabricated with a orientation point that indicates a compass orientation of the sub-circuit, and is rotationally symmetrical. The assembling includes determining the designed sub-circuit integration order, determining the designed orientation for each sub-circuit, stacking each sub-circuit per the determined integration order, and orienting each sub-circuit per the determined orientation, and wherein function and operation of the overall 3D ASIC device is determinable only from the assembled 3D ASIC stack and not the sub-circuits.
    Type: Grant
    Filed: December 14, 2006
    Date of Patent: August 24, 2010
    Assignee: Northrop Grumman Systems Corporation
    Inventors: Harold Hasely Ball, Michael Robert Lucas, Anastasios P. Goutzoulis
  • Method for providing secure and trusted ASICs using 3D integration
    Publication number: 20080148073
    Abstract: A system and a method for providing secure and trusted application specific integrated circuits (ASICs) using three-dimensional (3D) integrated circuit (IC) integration. The method includes fabricating a plurality of sub-circuits and assembling an overall 3D ASIC device from the plurality of sub-circuits. Each sub-circuit includes a plurality of input-output (IO) pads, is fabricated with a orientation point that indicates a compass orientation of the sub-circuit, and is rotationally symmetrical. The assembling includes determining the designed sub-circuit integration order, determining the designed orientation for each sub-circuit, stacking each sub-circuit per the determined integration order, and orienting each sub-circuit per the determined orientation, and wherein function and operation of the overall 3D ASIC device is determinable only from the assembled 3D ASIC stack and not the sub-circuits.
    Type: Application
    Filed: December 14, 2006
    Publication date: June 19, 2008
    Inventors: Harold Hasely Ball, Michael Robert Lucas, Anastasios P. Goutzoulis