Patents by Inventor Harold J. Hileman

Harold J. Hileman has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor wafer polishing appartus and method
    Patent number: 5605487
    Abstract: Apparatus for polishing semiconductor wafers comprises a housing, a mounting apparatus within the housing for wax mounting a first face of a semiconductor wafer to a first face of a polishing block, and a first semiconductor wafer polisher within the housing for polishing a second face of the semiconductor wafer. The second face of the semiconductor wafer is opposite the first face of the semiconductor wafer. A first transfer mechanism is within the housing for delivering the polishing block and semiconductor wafer from the mounting apparatus to adjacent the first semiconductor wafer polisher. A controller controls operation of the mounting apparatus, the first semiconductor wafer polisher, and the first transfer mechanism.
    Type: Grant
    Filed: May 13, 1994
    Date of Patent: February 25, 1997
    Assignee: MEMC Electric Materials, Inc.
    Inventors: Harold J. Hileman, Robert J. Walsh, Thomas A. Walsh