Abstract: A process for surface activation or depassivation of an article, in particular an alloy, by immersion of the alloy in an aqueous acid solution. The surface activation methods of the present invention can be performed during a relatively short period of time and achieve reductions in production costs and provide environmental friendliness as compared to prior art processes. In a further embodiment, after surface activation, the article is immersed in a second liquid that prevents re-formation of a passivating oxide layer on the surface of the article. In a further embodiment the surface-activated alloys are subjected to surface engineering by a process that infuses carbon or nitrogen through the surface at a temperature sufficiently low to suppress precipitation of carbides or nitrides.

Abstract: A process for surface activation or depassivation of an article, in particular an alloy, by immersion of the alloy in an aqueous acid solution. The surface activation methods of the present invention can be performed during a relatively short period of time and achieve reductions in production costs and provide environmental friendliness as compared to prior art processes. In a further embodiment, after surface activation, the article is immersed in a second liquid that prevents re-formation of a passivating oxide layer on the surface of the article. In a further embodiment the surface-activated alloys are subjected to surface engineering by a process that infuses carbon or nitrogen through the surface at a temperature sufficiently low to suppress precipitation of carbides or nitrides.

Abstract: A process for surface activation or depassivation of an article, in particular an alloy, by immersion of the alloy in an aqueous acid solution. The surface activation methods of the present invention can be performed during a relatively short period of time and achieve reductions in production costs and provide environmental friendliness as compared to prior art processes. In a further embodiment, after surface activation, the article is immersed in a second liquid that prevents re-formation of a passivating oxide layer on the surface of the article. In a further embodiment the surface-activated alloys are subjected to surface engineering by a process that infuses carbon or nitrogen through the surface at a temperature sufficiently low to suppress precipitation of carbides or nitrides.

Abstract: A sheet jam access assembly in combination with a finisher transport assembly having a main transport cover, is used with a digital printer. First and second axles with idler nip rollers are mounted on the transport assembly for movement away from the process path. First and second drive nip rollers are mounted for driven rotation on the transport assembly. A jam access cover pivots on the main transport cover from a closed to an open position. First and second hinges each have a first outer leaf on the jam access cover connected by a hinge pin to an inner leaf which translates transverse to the process direction. The hinge axis is spaced apart from the cover axis. A cam plate base portion translates parallel to the process direction. First and second ramps adjacent the axles extend away from the base portion at an angle to the process direction. A slot extends through the first inner leaf at an angle to the process direction.

Abstract: A sheet jam access assembly is used with a digital printer having a finisher transport assembly with a main transport cover. First and second axles with idler nip rollers are mounted on the transport for movement away from the process path. First and second drive nip rollers are mounted for driven rotation on the transport. A jam access cover pivots on the main transport cover from a closed to an open position. First and second hinges each has a first outer leaf on the jam access cover connected by a hinge pin to an inner leaf which translates transverse to the process direction. The hinge axis is spaced apart from the cover axis. A cam plate base portion translates parallel to the process direction. First and second ramps adjacent the axles extend away from the base portion at an angle to the process direction. A slot extends through the first inner leaf at an angle to the process direction.

Abstract: Multi-layer assemblies of polysilicon thin films having predetermined stress characteristics and techniques for forming such assemblies are disclosed. In particular, a multi-layer assembly of polysilicon thin films may be produced that has a stress level of zero, or substantially so. The multi-layer assemblies comprise at least one constituent thin film having a tensile stress and at least one constituent thin film having a compressive stress. The thin films forming the multi-layer assemblies may be disposed immediately adjacent to one another without the use of intermediate layers between the thin films. Multi-layer assemblies exhibiting selectively determinable overall bending moments are also disclosed. Selective production of overall bending moments in microstructures enables manufacture of such structures with a wide array of geometrical configurations.

Abstract: Multi-layer assemblies of polysilicon thin films having predetermined stress characteristics and techniques for forming such assemblies are disclosed. In particular, a multi-layer assembly of polysilicon thin films may be produced that has a stress level of zero, or substantially so. The multi-layer assemblies comprise at least one constituent thin film having a tensile stress and at least one constituent thin film having a compressive stress. The thin films forming the multi-layer assemblies may be disposed immediately adjacent to one another without the use of intermediate layers between the thin films. Multi-layer assemblies exhibiting selectively determinable overall bending moments are also disclosed. Selective production of overall bending moments in microstructures enables manufacture of such structures with a wide array of geometrical configurations.

Abstract: Multi-layer assemblies of polysilicon thin films having predetermined stress characteristics and techniques for forming such assemblies are disclosed. In particular, a multi-layer assembly of polysilicon thin film may be produced that has a stress level of zero, or substantially so. The multi-layer assemblies comprise at least one constituent thin film having a tensile stress and at least one constituent thin film having a compressive stress. The thin films forming the multi-layer assemblies may be disposed immediately adjacent to one another without the use of intermediate layers between the thin films.

Abstract: Multi-layer assemblies of polysilicon thin films having predetermined stress characteristics and techniques for forming such assemblies are disclosed. In particular, a multi-layer assembly of polysilicon thin film may be produced that has a stress level of zero, or substantially so. The multi-layer assemblies comprise at least one constituent thin film having a tensile stress and at least one constituent thin film having a compressive stress. The thin films forming the multi-layer assemblies may be disposed immediately adjacent to one another without the use of intermediate layers between the thin films.

Abstract: A head immobilizer apparatus includes a base plate having mounting members on outer edges which are releasably engagable through apertures to a spine board. In one aspect, the mounting members are cantilevered clips include a first leg projecting downward from the plane of the base plate and an outwardly and upwardly extending second leg. Alternately, a pair of clips may be formed on each opposed side edge and one additional clip formed on one end edge of the base plate. A flange is disposed adjacent to at least one side edge of each clip and is unitarily formed as part of the base plate. Each flange extends outward for substantially the same length as the adjacent clip to sandwich an outer edge of the spine board therebetween under spring force generated by the resilient, cantilever clips.