Patents by Inventor Harold L. Rhodenizer

Harold L. Rhodenizer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Catalyst solutions for activating non-conductive substrates and electroless plating process
    Patent number: 4863758
    Abstract: Disclosed are an improved activation composition for preparing substrates for metallization in an electroless plating bath. Also disclosed is an improved process for activating substrates prior to metallization and an improved process for metallizing employing the improved activating process.Electroless deposition, which involves chemically reducing ions of the metal to be plated from a plating bath and onto an activated substrate surface, is improved by employing an organic acid in the activating bath which activates the substrate surface. Preferred activating baths contain palladium halide ions to provide a catalytic surface on the substrate, stannous halide ions to provide a protective sol, a source of additional halide ions, and an organic acid such as citric or tartaric acids.
    Type: Grant
    Filed: May 13, 1987
    Date of Patent: September 5, 1989
    Assignee: MacDermid, Incorporated
    Inventor: Harold L. Rhodenizer
  • Process for preparing printed circuit board thru-holes
    Patent number: 4756930
    Abstract: The thru-holes of a multilayer printed circuit board, comprised of a laminate of epoxy resin and metal innerlayers, are provided with a conductive metal coating by a process in which the holes are first subjected to a desmearing process to remove smear from the copper innerlayers, followed by treatment of the hole surfaces with a solvent for the resin, treatment of the hole surfaces with a highly alkaline permanganate solution, and deposition of a conductive metal layer on the hole surfaces.
    Type: Grant
    Filed: June 23, 1986
    Date of Patent: July 12, 1988
    Assignee: MacDermid, Incorporated
    Inventors: Peter E. Kukanskis, Harold L. Rhodenizer
  • Process for preparing printed circuit board thru-holes
    Patent number: 4597988
    Abstract: The thru-holes of a multilayer printed circuit board, comprised of a laminate of epoxy resin and metal innerlayers, are provided with a conductive metal coating by a process in which the holes are first subjected to a desmearing process to remove smear from the copper innerlayers, followed by treatment of the hole surfaces with a solvent for the resin, treatment of the hole surfaces with a highly alkaline permanganate solution, and deposition of a conductive metal layer on the hole surfaces.
    Type: Grant
    Filed: July 26, 1985
    Date of Patent: July 1, 1986
    Assignee: MacDermid, Incorporated
    Inventors: Peter E. Kukanskis, Harold L. Rhodenizer
  • Process of preparing thermoset resin substrates to improve adherence of electrolessly plated metal deposits
    Patent number: 4110147
    Abstract: A process is disclosed comprising laminating an anodically treated aluminum surface against a thermoset plastic substrate, whereby the surface of the substrate after chemically removing the aluminum has an improved affinity for the adherence thereon of electrolessly deposited metal films.
    Type: Grant
    Filed: January 3, 1977
    Date of Patent: August 29, 1978
    Assignee: MacDermid Incorporated
    Inventors: John J. Grunwald, Eugene D. D'Ottavio, Harold L. Rhodenizer, Michael S. Lombardo