Patents by Inventor Harold L. Sexson

Harold L. Sexson has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Conductive adhesive for use in a circuit board
    Patent number: 5432303
    Abstract: A double-sided printed circuit board and a method for making the circuit board. The circuit board includes a metal support that functions as both a heat sink and a ground plane. The circuit board contains a dielectric having first and second conductive foil platings on opposing sides of the dielectric. Prior to bonding the first foil plating to the metal support with a conductive adhesive, a standard protective coating on the first foil plating, which typically remains on the foil plating in conventional practice, is removed in order to expose a bare surface of the first foil plating. The exposed bare surface of the first foil plating is then bonded to the metal support before any substantial oxidation or a build up of impurities on the first foil plating surface can occur.
    Type: Grant
    Filed: August 25, 1994
    Date of Patent: July 11, 1995
    Assignee: Poly Circuits, Inc.
    Inventors: Joseph A. Turek, Joel S. Dryer, Harold L. Sexson
  • Circuit board having a bonded metal support
    Patent number: 5366027
    Abstract: A double-sided printed circuit board and a method for making the circuit board. The circuit board includes a metal support that functions as both a heat sink and a ground plane. The circuit board contains a dielectric having first and second conductive foil platings on opposing sides of the dielectric. Prior to bonding the first foil plating to the metal support with a conductive adhesive, a standard protective coating on the first foil plating, which typically remains on the foil plating in conventional practice, is removed in order to expose a bare surface of the first foil plating. The exposed bare surface of the first foil plating is then bonded to the metal support before any substantial oxidation or a build up of impurities on the first foil plating surface can occur.
    Type: Grant
    Filed: February 10, 1993
    Date of Patent: November 22, 1994
    Assignee: Poly Circuits, Inc.
    Inventors: Joseph A. Turek, Joel S. Dryer, Harold L. Sexson
  • Method for making circuit board having a metal support
    Patent number: 5210941
    Abstract: A double-sided printed circuit board and a method for making the circuit board. The circuit board includes a metal support that functions as both a heat sink and a ground plane. The circuit board contains a dielectric having first and second conductive foil platings on opposing sides of the dielectric. Prior to bonding the first foil plating to the metal support with a conductive adhesive, a standard protective coating on the first foil plating, which typically remains on the foil plating in conventional practice, is removed in order to expose a bare surface of the first foil plating. The exposed bare surface of the first foil plating is then bonded to the metal support before any substantial oxidation or a build up of impurities on the first foil plating surface can occur.
    Type: Grant
    Filed: July 19, 1991
    Date of Patent: May 18, 1993
    Assignee: Poly Circuits, Inc.
    Inventors: Joseph A. Turek, Joel S. Dryer, Harold L. Sexson