Patents by Inventor Harold Lake

Harold Lake has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7337256
    Abstract: A field controller for use in a distributed control system including an area controller and at least one field controller. The field controller manages at least one controlled device in an industrial process operation. The field controller comprises a processor module segment through which it can control a selected number of devices, and it may also include one or more expansion module segments to enable it to control a larger number of controlled devices. The processor module segment includes a processor module and at least one local interface module for interfacing to a controlled device, and the expansion module segment includes interface modules for interfacing to other controlled devices. In the processor module segment, the processor module and said local interface module are interconnected by a bus segment, which is also connected to an upstream off-module connector.
    Type: Grant
    Filed: November 25, 2003
    Date of Patent: February 26, 2008
    Assignee: Invensys Systems, Inc.
    Inventors: Simon Korowitz, Harris D. Kagan, Harold Lake
  • Publication number: 20040158666
    Abstract: A field controller for use in a distributed control system including an area controller and at least one field controller. The field controller manages at least one controlled device in an industrial process operation. The field controller comprises a processor module segment through which it can control a selected number of devices, and it may also include one or more expansion module segments to enable it to control a larger number of controlled devices. The processor module segment includes a processor module and at least one local interface module for interfacing to a controlled device, and the expansion module segment includes interface modules for interfacing to other controlled devices. In the processor module segment, the processor module and said local interface module are interconnected by a bus segment, which is also connected to an upstream off-module connector.
    Type: Application
    Filed: November 25, 2003
    Publication date: August 12, 2004
    Inventors: Simon Korowitz, Harris D. Kagan, Harold Lake
  • Patent number: 6671763
    Abstract: A field controller for use in a distributed control system including an area controller and at least one field controller. The field controller manages at least one controlled device in an industrial process operation. The field controller comprises a processor module segment through which it can control a selected number of devices, and it may also include one or more expansion module segments to enable it to control a larger number of controlled devices. The processor module segment includes a processor module and at least one local interface module for interfacing to a controlled device, and the expansion module segment includes interface modules for interfacing to other controlled devices. In the processor module segment, the processor module and said local interface module are interconnected by a bus segment, which is also connected to an upstream off-module connector.
    Type: Grant
    Filed: March 17, 2000
    Date of Patent: December 30, 2003
    Assignee: EKMS, Inc.
    Inventors: Simon Korowitz, Harris D. Kagan, Harold Lake
  • Patent number: 6496892
    Abstract: An I/O device in the form of an internal dongle includes a body having connective structure being arranged to removably attach the body to a housing of an electronic device. The dongle also includes a circuit assembly that has an exterior connector on the body for electrically connecting to a second electronic device, a dongle circuit being electrically coupled to the external connector through the body, an electronic cable having a first end electrically coupled to the dongle circuit, and a second end being structured and arranged to connect to an electronic component of the first mentioned electronic device within the housing.
    Type: Grant
    Filed: June 12, 2000
    Date of Patent: December 17, 2002
    Assignee: The Foxboro Company
    Inventors: Harold Lake, Charles Piper, David P. Prentice, Simon Korowitz
  • Patent number: 6418499
    Abstract: A field controller for use in a distributed control system including an area controller and at least one field controller. The field controller manages at least one controlled device in an industrial process operation. The field controller comprises a processor module segment through which it can control a selected number of devices, and it may also include one or more expansion module segments to enable it to control a larger number of controlled devices. The processor module segment includes a processor module and at least one local interface module for interfacing to a controlled device, and the expansion module segment includes interface modules for interfacing to other controlled devices. In the processor module segment, the processor module and said local interface module are interconnected by a bus segment, which is also connected to an upstream off-module connector.
    Type: Grant
    Filed: June 12, 2000
    Date of Patent: July 9, 2002
    Assignee: The Foxboro Company
    Inventors: Simon Korowitz, Harris D. Kagan, Harold Lake
  • Patent number: 6324607
    Abstract: A field controller for use in a distributed control system including an area controller and at least one field controller. The field controller manages at least one controlled device in an industrial process operation. The field controller comprises a processor module segment through which it can control a selected number of devices, and it may also include one or more expansion module segments to enable it to control a larger number of controlled devices. The processor module segment includes a processor module and at least one local interface module for interfacing to a controlled device, and the expansion module segment includes interface modules for interfacing to other controlled devices. In the processor module segment, the processor module and said local interface module are interconnected by a bus segment, which is also connected to an upstream off-module connector.
    Type: Grant
    Filed: November 19, 1999
    Date of Patent: November 27, 2001
    Assignee: The Foxboro Company
    Inventors: Simon Korowitz, Harris D. Kagan, Harold Lake
  • Patent number: 6183289
    Abstract: An article adapted to pass a cable through a housing includes a substantially solid body, including front and rear ends. A side surface of the body provides a groove extending into the body from the front to the rear end. The groove is sized to carry a selected size electric cable. The body also includes connective structure adapted to removably connect the body to the housing. The article also includes a sheet of nonconductive material extending across the groove at the front end of the body. The sheet provides a circular opening sized to allow the cable to pass therethrough. The sheet also has a slit extending from the side surface to the circular opening. The sheet is fabricated of a resilient material and is structured to allow the cable to be inserted through the slit and into the circular opening such that the cable extends along the groove and extends into the housing from the rear end of the body when the body is connected to the housing.
    Type: Grant
    Filed: May 24, 1999
    Date of Patent: February 6, 2001
    Assignee: The Foxboro Company
    Inventors: Harold Lake, Charles Piper, David P. Prentice, Simon Korowitz
  • Patent number: 6076124
    Abstract: A field controller for use in a distributed control system including an area controller and at least one field controller. The field controller manages at least one controlled device in an industrial process operation. The field controller comprises a processor module segment through which it can control a selected number of devices, and it may also include one or more expansion module segments to enable it to control a larger number of controlled devices. The processor module segment includes a processor module and at least one local interface module for interfacing to a controlled device, and the expansion module segment includes interface modules for interfacing to other controlled devices. In the processor module segment, the processor module and said local interface module are interconnected by a bus segment, which is also connected to an upstream off-module connector.
    Type: Grant
    Filed: November 20, 1995
    Date of Patent: June 13, 2000
    Assignee: The Foxboro Company
    Inventors: Simon Korowitz, Harris D. Kagan, Harold Lake
  • Patent number: 6033257
    Abstract: An I/O device in the form of an internal dongle includes a body having connective structure being arranged to removably attach the body to a housing of an electronic device. The dongle also includes a circuit assembly that has an exterior connector on the body for electrically connecting to a second electronic device, a dongle circuit being electrically coupled to the external connector through the body, an electronic cable having a first end electrically coupled to the dongle circuit, and a second end being structured and arranged to connect to an electronic component of the first mentioned electronic device within the housing.
    Type: Grant
    Filed: October 4, 1996
    Date of Patent: March 7, 2000
    Assignee: The Foxboro Company
    Inventors: Harold Lake, Charles Piper, David P. Prentice, Simon Korowitz
  • Patent number: 6008985
    Abstract: An industrial computing device includes a field mountable primary housing having a removable side cover to facilitate expansion. Within the primary housing there is a head board having a processor on one side. On the opposite side, there is an expansion connector adapted to receive an expansion board and at least one peripheral connector, which is coupled to the processor within the housing. The peripheral connector receives at least one PCMCIA card such that the PCMCIA card is also within the housing when plugged into the peripheral connector. The expansion board includes at least one more peripheral connector to receive at least one more PCMCIA card. The peripheral connector, the expansion connector and the side cover are oriented orthogonal to a mounting plane of the computing device. The primary housing can also include a removable front cover, which together with a top or bottom portion of the primary housing, provides an aperture for flush-mounting an I/O device in the form of an internal dongle.
    Type: Grant
    Filed: October 4, 1996
    Date of Patent: December 28, 1999
    Assignee: The Foxboro Company
    Inventors: Harold Lake, David P. Prentice, John Greenup, Charles Piper, Simon Korowitz
  • Patent number: 5354593
    Abstract: A microporous, photoprocessable, moderately hydrophilic material on which metal can be deposited directly using electroless plating techniques, and its use in preparing printed wiring boards and circuit components.
    Type: Grant
    Filed: November 10, 1992
    Date of Patent: October 11, 1994
    Assignee: The Foxboro Company
    Inventors: Paul E. Grandmont, Harold Lake, Richard A. Anderson
  • Patent number: 5302494
    Abstract: A microporous, photoprocessable, moderately hydrophilic material on which metal can be deposited directly using electroless plating techniques, and its use in preparing printed wiring boards and circuit components.
    Type: Grant
    Filed: July 17, 1992
    Date of Patent: April 12, 1994
    Assignee: The Foxboro Company
    Inventors: Paul E. Grandmont, Harold Lake, Richard A. Anderson
  • Patent number: 5254435
    Abstract: A CAD driven photoplotter selectively exposes a photographic imaging layer without affecting the underlying UV sensitive resist on a substrate to make a printed wiring board, for example. The image layer is developed on the board and used as an in situ mask for the underlying UV resist during exposure to UV. After UV exposure, the image layer is peeled off to allow conventional processing of the resist. The in situ mask is preferably applied in the form of a baseless, high contrast, high gamma emulsion layer bonded to the protective cover sheet over the uncured resist. To facilitate application, the emulsion layer is carried by a release paper which is removed before photoplotting. After UV exposure, the cover sheet and emulsion layer are integrally peeled from the resist.
    Type: Grant
    Filed: September 16, 1992
    Date of Patent: October 19, 1993
    Assignee: The Foxboro Company
    Inventors: Paul E. Grandmont, Harold Lake
  • Patent number: 5015553
    Abstract: A CAD driven photoplotter selectively exposes a photographic imaging layer without affecting the underlying UV sensitive resist on a substrate to make a printed wiring board, for example. The image layer is developed on the board and used as an in situ mask for the underlying UV resist during exposure to UV. After UV exposure, the image layer is peeled off to allow conventional processing of the resist. The in situ mask is preferably applied in the form of a baseless, high contrast, high gamma emulsion layer bonded to the protective cover sheet over the uncured resist. To facilitate application, the emulsion layer is carried by a release paper which is removed before photoplotting. After UV exposure, the cover sheet and emulsion layer are integrally peeled from the resist.
    Type: Grant
    Filed: March 5, 1990
    Date of Patent: May 14, 1991
    Assignee: The Foxboro Company
    Inventors: Paul E. Grandmont, Harold Lake
  • Patent number: 4915983
    Abstract: A process for making additive multilayer circuit boards uses separately designed and fabricated composite structures each consisting of a patterned conductive metal foil supported by a photo-processible insulating film. The composite is bonded foil pattern side down to the substrate or pre-existing multilayer structure and selected areas of the insulating film are removed down to underlying metal sites for electroless plating. All of the apertures in the insulating film are then electrolessly plated full of metal flush to the upper surface. Additional patterned composites are applied and plated up as desired to create blind vias and new conductor patterns layer by layer. In an alternate process a foil clad composite is bonded to an existing substrate foil side up. The insulating layer is selectively etched through windows photoetched in the foil layer. The voids in the insulator layer expose copper sites on the underlying composite.
    Type: Grant
    Filed: June 10, 1985
    Date of Patent: April 10, 1990
    Assignee: The Foxboro Company
    Inventors: Harold Lake, Paul E. Grandmont
  • Patent number: 4666818
    Abstract: A method for patterning a photoresist or insulating layer on a printed wiring board utilizes two photoreactive coatings comprising a photoprocessable ultraviolet (UV) sensitive layer overlaid with a thin, unexposed, undeveloped strip base silver film. A white light x-y plotter, preferably employing an octagonal aperture, is driven directly from a CAD system to expose the film on the board in the desired pattern without affecting the underlying UV sensitive layer. The film is then developed on the board and employed as an in situ mask for the underlying UV layer during exposure of the board to a UV flood lamp. After UV exposure the film is peeled off to allow conventional processing of the selectively polymerized layer. This technique produces high resolution, inspectable onboard masks in full registration using reliable low energy plotters.
    Type: Grant
    Filed: June 10, 1985
    Date of Patent: May 19, 1987
    Assignee: The Foxboro Company
    Inventors: Harold Lake, Paul E. Grandmont
  • Patent number: 4527271
    Abstract: A process control system includes redundant digital controllers and a plurality of input/output (I/O) modules for interfacing with remote field sensors and actuators. Bi-directional communication between controllers and I/O modules is achieved by a parallel-wired, process I/O bus. Failures within the system, including the bus structure itself, that continually keep the bus active (i.e., in a low state) are isolated by a combination of software diagnostic routines for performing bus checkout and a unique quick disconnect feature that readily isolates the fault condition first between the I/O module nest area and the controllers, then, if necessary, to individual I/O modules. During fault isolation procedures, individual I/O modules may be disconnected from the bus while the values of field signals are simultaneously maintained to provide minimum process upset.
    Type: Grant
    Filed: August 17, 1982
    Date of Patent: July 2, 1985
    Assignee: The Foxboro Company
    Inventors: Donald O. Hallee, Harold Lake, Kenneth L. Johansson, Thomas B. Graves
  • Patent number: D394842
    Type: Grant
    Filed: October 20, 1995
    Date of Patent: June 2, 1998
    Assignee: The Foxboro Company
    Inventors: Charles W. Kellstedt, Jr., Simon Korowitz, Harris D. Kagan, Harold Lake