Abstract: A field controller for use in a distributed control system including an area controller and at least one field controller. The field controller manages at least one controlled device in an industrial process operation. The field controller comprises a processor module segment through which it can control a selected number of devices, and it may also include one or more expansion module segments to enable it to control a larger number of controlled devices. The processor module segment includes a processor module and at least one local interface module for interfacing to a controlled device, and the expansion module segment includes interface modules for interfacing to other controlled devices. In the processor module segment, the processor module and said local interface module are interconnected by a bus segment, which is also connected to an upstream off-module connector.

Abstract: A field controller for use in a distributed control system including an area controller and at least one field controller. The field controller manages at least one controlled device in an industrial process operation. The field controller comprises a processor module segment through which it can control a selected number of devices, and it may also include one or more expansion module segments to enable it to control a larger number of controlled devices. The processor module segment includes a processor module and at least one local interface module for interfacing to a controlled device, and the expansion module segment includes interface modules for interfacing to other controlled devices. In the processor module segment, the processor module and said local interface module are interconnected by a bus segment, which is also connected to an upstream off-module connector.

Abstract: A field controller for use in a distributed control system including an area controller and at least one field controller. The field controller manages at least one controlled device in an industrial process operation. The field controller comprises a processor module segment through which it can control a selected number of devices, and it may also include one or more expansion module segments to enable it to control a larger number of controlled devices. The processor module segment includes a processor module and at least one local interface module for interfacing to a controlled device, and the expansion module segment includes interface modules for interfacing to other controlled devices. In the processor module segment, the processor module and said local interface module are interconnected by a bus segment, which is also connected to an upstream off-module connector.

Abstract: An I/O device in the form of an internal dongle includes a body having connective structure being arranged to removably attach the body to a housing of an electronic device. The dongle also includes a circuit assembly that has an exterior connector on the body for electrically connecting to a second electronic device, a dongle circuit being electrically coupled to the external connector through the body, an electronic cable having a first end electrically coupled to the dongle circuit, and a second end being structured and arranged to connect to an electronic component of the first mentioned electronic device within the housing.

Abstract: A field controller for use in a distributed control system including an area controller and at least one field controller. The field controller manages at least one controlled device in an industrial process operation. The field controller comprises a processor module segment through which it can control a selected number of devices, and it may also include one or more expansion module segments to enable it to control a larger number of controlled devices. The processor module segment includes a processor module and at least one local interface module for interfacing to a controlled device, and the expansion module segment includes interface modules for interfacing to other controlled devices. In the processor module segment, the processor module and said local interface module are interconnected by a bus segment, which is also connected to an upstream off-module connector.

Abstract: A field controller for use in a distributed control system including an area controller and at least one field controller. The field controller manages at least one controlled device in an industrial process operation. The field controller comprises a processor module segment through which it can control a selected number of devices, and it may also include one or more expansion module segments to enable it to control a larger number of controlled devices. The processor module segment includes a processor module and at least one local interface module for interfacing to a controlled device, and the expansion module segment includes interface modules for interfacing to other controlled devices. In the processor module segment, the processor module and said local interface module are interconnected by a bus segment, which is also connected to an upstream off-module connector.

Abstract: An article adapted to pass a cable through a housing includes a substantially solid body, including front and rear ends. A side surface of the body provides a groove extending into the body from the front to the rear end. The groove is sized to carry a selected size electric cable. The body also includes connective structure adapted to removably connect the body to the housing. The article also includes a sheet of nonconductive material extending across the groove at the front end of the body. The sheet provides a circular opening sized to allow the cable to pass therethrough. The sheet also has a slit extending from the side surface to the circular opening. The sheet is fabricated of a resilient material and is structured to allow the cable to be inserted through the slit and into the circular opening such that the cable extends along the groove and extends into the housing from the rear end of the body when the body is connected to the housing.

Abstract: A field controller for use in a distributed control system including an area controller and at least one field controller. The field controller manages at least one controlled device in an industrial process operation. The field controller comprises a processor module segment through which it can control a selected number of devices, and it may also include one or more expansion module segments to enable it to control a larger number of controlled devices. The processor module segment includes a processor module and at least one local interface module for interfacing to a controlled device, and the expansion module segment includes interface modules for interfacing to other controlled devices. In the processor module segment, the processor module and said local interface module are interconnected by a bus segment, which is also connected to an upstream off-module connector.

Abstract: An I/O device in the form of an internal dongle includes a body having connective structure being arranged to removably attach the body to a housing of an electronic device. The dongle also includes a circuit assembly that has an exterior connector on the body for electrically connecting to a second electronic device, a dongle circuit being electrically coupled to the external connector through the body, an electronic cable having a first end electrically coupled to the dongle circuit, and a second end being structured and arranged to connect to an electronic component of the first mentioned electronic device within the housing.

Abstract: An industrial computing device includes a field mountable primary housing having a removable side cover to facilitate expansion. Within the primary housing there is a head board having a processor on one side. On the opposite side, there is an expansion connector adapted to receive an expansion board and at least one peripheral connector, which is coupled to the processor within the housing. The peripheral connector receives at least one PCMCIA card such that the PCMCIA card is also within the housing when plugged into the peripheral connector. The expansion board includes at least one more peripheral connector to receive at least one more PCMCIA card. The peripheral connector, the expansion connector and the side cover are oriented orthogonal to a mounting plane of the computing device. The primary housing can also include a removable front cover, which together with a top or bottom portion of the primary housing, provides an aperture for flush-mounting an I/O device in the form of an internal dongle.

Abstract: A microporous, photoprocessable, moderately hydrophilic material on which metal can be deposited directly using electroless plating techniques, and its use in preparing printed wiring boards and circuit components.

Abstract: A microporous, photoprocessable, moderately hydrophilic material on which metal can be deposited directly using electroless plating techniques, and its use in preparing printed wiring boards and circuit components.

Abstract: A CAD driven photoplotter selectively exposes a photographic imaging layer without affecting the underlying UV sensitive resist on a substrate to make a printed wiring board, for example. The image layer is developed on the board and used as an in situ mask for the underlying UV resist during exposure to UV. After UV exposure, the image layer is peeled off to allow conventional processing of the resist. The in situ mask is preferably applied in the form of a baseless, high contrast, high gamma emulsion layer bonded to the protective cover sheet over the uncured resist. To facilitate application, the emulsion layer is carried by a release paper which is removed before photoplotting. After UV exposure, the cover sheet and emulsion layer are integrally peeled from the resist.

Abstract: A CAD driven photoplotter selectively exposes a photographic imaging layer without affecting the underlying UV sensitive resist on a substrate to make a printed wiring board, for example. The image layer is developed on the board and used as an in situ mask for the underlying UV resist during exposure to UV. After UV exposure, the image layer is peeled off to allow conventional processing of the resist. The in situ mask is preferably applied in the form of a baseless, high contrast, high gamma emulsion layer bonded to the protective cover sheet over the uncured resist. To facilitate application, the emulsion layer is carried by a release paper which is removed before photoplotting. After UV exposure, the cover sheet and emulsion layer are integrally peeled from the resist.

Abstract: A process for making additive multilayer circuit boards uses separately designed and fabricated composite structures each consisting of a patterned conductive metal foil supported by a photo-processible insulating film. The composite is bonded foil pattern side down to the substrate or pre-existing multilayer structure and selected areas of the insulating film are removed down to underlying metal sites for electroless plating. All of the apertures in the insulating film are then electrolessly plated full of metal flush to the upper surface. Additional patterned composites are applied and plated up as desired to create blind vias and new conductor patterns layer by layer. In an alternate process a foil clad composite is bonded to an existing substrate foil side up. The insulating layer is selectively etched through windows photoetched in the foil layer. The voids in the insulator layer expose copper sites on the underlying composite.

Abstract: A method for patterning a photoresist or insulating layer on a printed wiring board utilizes two photoreactive coatings comprising a photoprocessable ultraviolet (UV) sensitive layer overlaid with a thin, unexposed, undeveloped strip base silver film. A white light x-y plotter, preferably employing an octagonal aperture, is driven directly from a CAD system to expose the film on the board in the desired pattern without affecting the underlying UV sensitive layer. The film is then developed on the board and employed as an in situ mask for the underlying UV layer during exposure of the board to a UV flood lamp. After UV exposure the film is peeled off to allow conventional processing of the selectively polymerized layer. This technique produces high resolution, inspectable onboard masks in full registration using reliable low energy plotters.

Abstract: A process control system includes redundant digital controllers and a plurality of input/output (I/O) modules for interfacing with remote field sensors and actuators. Bi-directional communication between controllers and I/O modules is achieved by a parallel-wired, process I/O bus. Failures within the system, including the bus structure itself, that continually keep the bus active (i.e., in a low state) are isolated by a combination of software diagnostic routines for performing bus checkout and a unique quick disconnect feature that readily isolates the fault condition first between the I/O module nest area and the controllers, then, if necessary, to individual I/O modules. During fault isolation procedures, individual I/O modules may be disconnected from the bus while the values of field signals are simultaneously maintained to provide minimum process upset.