Patents by Inventor Harold M. Cook

Harold M. Cook has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Reversible heat sink packaging assembly for an integrated circuit
    Patent number: 6813154
    Abstract: A reversible heat sink packaging assembly (400) for integrated circuits is provided. The packaging assembly (400) includes a chip carrier (102) having an opening (104) formed therein and a heat sink (302). The heat sink (302) is attached to one side of a die (304). The die (304) fits into the opening (104) of the carrier (102) with the heat sink (302) abutting one side (208) of the carrier and the die being wire bonded (402) to the other side (108) of the carrier. The packaging assembly (400) can be oriented either device side up or down.
    Type: Grant
    Filed: December 10, 2002
    Date of Patent: November 2, 2004
    Assignee: Motorola, Inc.
    Inventors: Jose Diaz, Harold M. Cook, Edmund B. Boucher
  • Thermal dissipation package for an electrical surface mount component
    Patent number: 6784366
    Abstract: An electronic component (202), such as a power transistor, is formed of a molded plastic package having top (206), bottom (204) and side (208) surfaces and electrical contacts. A lead frame (210) attaches to one of the contacts and wraps about the component (202) so as to provide heat dissipation capability from the bottom and top surfaces of the molded plastic package.
    Type: Grant
    Filed: June 10, 2003
    Date of Patent: August 31, 2004
    Assignee: Motorola, Inc.
    Inventors: Edmund B. Boucher, Harold M. Cook, Jose N. Diaz
  • REVERSIBLE HEAT SINK PACKAGING ASSEMBLY FOR AN INTEGRATED CIRCUIT
    Publication number: 20040109292
    Abstract: A reversible heat sink packaging assembly (400) for integrated circuits is provided. The packaging assembly (400) includes a chip carrier (102) having an opening (104) formed therein and a heat sink (302). The heat sink (302) is attached to one side of a die (304). The die (304) fits into the opening (104) of the carrier (102) with the heat sink (302) abutting one side (208) of the carrier and the die being wire bonded (402) to the other side (108) of the carrier. The packaging assembly (400) can be oriented either device side up or down.
    Type: Application
    Filed: December 10, 2002
    Publication date: June 10, 2004
    Inventors: Jose Diaz, Harold M. Cook, Edmund B. Boucher
  • RF interconnect
    Patent number: 5092783
    Abstract: An RF contact (2) provides multiple RF paths (51-53) with minimal RF path lengths between a first (8) and second (36) interconnecting surfaces. A stationary member (6) is soldered on the first surface (8). A main spring member (22) is resiliently (26) connected to the stationary member (6) on a springing end (27) to provide contact travel (38) which ensures wiping action with the second surface (36). A secondary spring member (28) having at least two wiping portions (42 and 46) is resiliently (29) connected to the displacement member on its other end (38) to engage the stationary member (6) and the main spring member (22) along the at least two wiping portions (42 and 46) when the main spring member (22) is resiliently biased against the secondary spring member (28) and the stationary member (6).
    Type: Grant
    Filed: May 16, 1991
    Date of Patent: March 3, 1992
    Assignee: Motorola, Inc.
    Inventors: Jose I. Suarez, William J. Martin, James V. Lauder, Harold M. Cook
  • Coaxial connector
    Patent number: 4892491
    Abstract: A coaxial connector includes a housing carrying an insulator. The insulator carries a center contact with a spring biasing the cneter contact. A volute spring engages the housing and provides the ground or shield contact. The housing is formed of two halves with the volute spring and alignment pins holding the housing halves together. A coaxial cable has its shield clamped between the housing halves for providing the ground connection to the volute spring. The coaxial cable center conductor is connected to the center contact within the housing.
    Type: Grant
    Filed: December 19, 1988
    Date of Patent: January 9, 1990
    Assignee: Motorola, Inc.
    Inventors: Joseph A. Budano, II, Andrzei T. Guzik, Rudy Yorio, Harold M. Cook