Abstract: An apparatus in one example comprises one or more adhesives that serve to provide at least primary attachment of a heat sink with one or more electrical components coupled with a circuit board.

Abstract: An installation instruction conveying device. In one embodiment, the installation instruction conveying device is comprised of a first surface having instructions visibly disposed thereon for installing a component. The installation instruction conveying device is further comprised of a means for adhering said installation instruction conveying device to a component installation location. The installation instruction conveying device prevents the installation of the component at the component installation location unless the installation instruction conveying device is removed from said component installation location.

Abstract: A heat sink comprises a base having a substantially flat region for interfacing with an electronic component, and at least one heat pipe having a first region substantially parallel to the flat region of the base and a second region substantially perpendicular to the flat region of the base. By providing a heat pipe in a heat sink that is L-shaped or U-shaped, a greater portion of the heat pipe is in contact with the heat-generating electronic component. As a result, thermal efficiency increases because there is more direct contact with the heat pipe.

Abstract: A heat sink includes a heat pipe and a base adapted to allow the heat pipe to directly contact a component. By directly contacting the component, thermal efficiency is increased. Furthermore, increasing the surface area of the heat pipe that is in direct contact with the component also increases thermal efficiency.

Abstract: A fastener assembly provides an adjustable restrained connection between a fastener and a retainer. The assembly connects to a support member and connects the support member to a component.

Abstract: In one embodiment, the present invention is a heat sink apparatus comprising a heat sink device and a heat sink shroud. The heat sink device is for transferring heat from a heat source. The heat sink shroud is thermally coupled with the heat sink device. Hence, the heat sink shroud transfers heat from the heat sink device and dissipates the heat generated by the heat source.

Abstract: An installation instruction conveying device. In one embodiment, the installation instruction conveying device is comprised of a first surface having instructions visibly disposed thereon for installing a component. The installation instruction conveying device is further comprised of a means for adhering said installation instruction conveying device to a component installation location. The installation instruction conveying device prevents the installation of the component at the component installation location unless the installation instruction conveying device is removed from said component installation location.