Abstract: A method of manufacturing an electronics assembly includes forming a base layer, forming a first thermally and electrically conductive intermediate layer onto the base layer using an additive manufacturing process, placing an electronics component onto the first thermally and electrically conductive intermediate layer, the electronics component comprising a plurality of vias, and forming a second thermally and electrically conductive intermediate layer over the first thermally and electrically conductive intermediate layer and over at least a portion of the electronics component using an additive manufacturing process, wherein a material of the second thermally and electrically conductive intermediate layer extends through the vias to contact the first thermally and electrically conductive intermediate layer and the vias, thereby forming a bond therebetween.

Abstract: A method of manufacturing an electronics assembly includes forming a base layer, forming a first thermally and electrically conductive intermediate layer onto the base layer using an additive manufacturing process, placing an electronics component onto the first thermally and electrically conductive intermediate layer, the electronics component comprising a plurality of vias, and forming a second thermally and electrically conductive intermediate layer over the first thermally and electrically conductive intermediate layer and over at least a portion of the electronics component using an additive manufacturing process, wherein a material of the second thermally and electrically conductive intermediate layer extends through the vias to contact the first thermally and electrically conductive intermediate layer and the vias, thereby forming a bond therebetween.

Abstract: An AAMP system includes a plurality of AAMP system stations disposed in an environment and configured to perform one or more AAMP processing routines, and a plurality of robots configured to autonomously travel within the environment, where one or more robots from among the plurality of robots include an auxiliary AAMP processing station configured to perform one or more auxiliary AAMP processing routines. The AAMP system includes a controller configured to select an AAMP system station from among the plurality of AAMP system stations to perform the one or more AAMP processing routines based on AAMP system operation data and select a robot from among the plurality of robots to initiate the one or more AAMP processing routines at the selected AAMP system station based on a digital model of the environment and robot operation data, where the robot operation data includes an auxiliary processing state.

Abstract: An automated additive manufacturing production (AAMP) system includes a controller, a plurality of AAMP system stations disposed in an environment and configured to perform one or more AAMP routines, and a plurality of robots configured to autonomously travel within the environment. The controller is configured to select one or more AAMP system stations from among the plurality of AAMP system stations to perform the one or more AAMP routines based on a digital model of the environment and AAMP system operation data. The AAMP system operation data includes a printer state, a cleaning device state, or a combination thereof.

Abstract: A method of manufacturing an electronics assembly includes forming a base layer using an additive manufacturing process, forming a first thermally and electrically conductive intermediate layer onto the base layer using an additive manufacturing process, placing an electronics component onto the first thermally and electrically conductive intermediate layer, the electronics component comprising a plurality of vias, forming a second thermally and electrically conductive intermediate layer over the first thermally and electrically conductive intermediate layer and over at least a portion of the electronics component using an additive manufacturing process, wherein a material of the second thermally and electrically conductive intermediate layer extends through the vias to contact the first thermally and electrically conductive intermediate layer and the vias, thereby forming a bond therebetween, and forming a protective layer over at least a portion of the second thermally and electrically conductive intermedia

Abstract: A method of manufacturing an electronics assembly includes forming a base layer using an additive manufacturing process, forming a first thermally and electrically conductive intermediate layer onto the base layer using an additive manufacturing process, placing an electronics component onto the first thermally and electrically conductive intermediate layer, the electronics component comprising a plurality of vias, forming a second thermally and electrically conductive intermediate layer over the first thermally and electrically conductive intermediate layer and over at least a portion of the electronics component using an additive manufacturing process, wherein a material of the second thermally and electrically conductive intermediate layer extends through the vias to contact the first thermally and electrically conductive intermediate layer and the vias, thereby forming a bond therebetween, and forming a protective layer over at least a portion of the second thermally and electrically conductive intermedia

Abstract: A high pressure casting die is disclosed. The high pressure casting die may include a die half that defines a recessed area and a build plate that may nest within the recessed area of the die half. The high pressure die casting may further include an additive section that is disposed on the build plate. The additive section may include a plurality of metallic powder layers, the thermal conductivity or the thermal expansion coefficient of the build plate and the additive section may be within 10% of each other.

Abstract: A mold core package for forming a molding tool includes a plurality of stacked particulate layers having a binding agent. The plurality of stacked particulate layers form sacrificial walls defining a mold cavity. A sacrificial displacement line and a sacrificial displacement body extend from the mold core package and are adapted to displace a molten material applied to the mold core package.

Abstract: A mold core package for forming a molding tool includes a plurality of stacked particulate layers having a binding agent. The plurality of stacked particulate layers form sacrificial walls. An elongate sacrificial displacement line extends through the mold core package adjacent a forming surface of the mold core package. A mold cavity is defined by the stacked particulate layers.

Abstract: A method comprising the use of additive manufacturing techniques for creating molds and pattern parts for subsequent use in the casting of die components and die shoes for use in die stamping processes.

Abstract: A mold core package for forming a molding tool includes a plurality of stacked particulate layers having a binding agent. The plurality of stacked particulate layers form sacrificial walls. An elongate sacrificial displacement line extends through the mold core package adjacent a forming surface of the mold core package. A mold cavity is defined by the stacked particulate layers.

Abstract: A mold core package for forming a molding tool includes a plurality of stacked particulate layers having a binding agent. The plurality of stacked particulate layers form sacrificial walls defining a mold cavity. A sacrificial displacement line and a sacrificial displacement body extend from the mold core package and are adapted to displace a molten material applied to the mold core package.

Abstract: A powder slush molding tool having heating and cooling features cast as part of the tool, wherein the tool created using molds formed by additive manufacturing techniques, and wherein the tool is further used for making a flexible polymeric soft skin for use in a vehicle interior.