Patents by Inventor Harold R. Chase

Harold R. Chase has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Non-cylindrical conducting shapes in multilayer laminated substrate cores
    Patent number: 9198293
    Abstract: Non-cylindrical conducting shapes are described in the context of multilayer laminated substrate cores. In one example a package substrate core includes a plurality of dielectric layers pressed together to form a multilayer core, a conductive bottom pattern on a bottom surface of the multilayer core, and a conductive top pattern on a top surface of the multilayer core. At least one elongated via extends through each layer of the multilayer core, each elongated via containing a conductor and each connected to a conductor of a via in an adjacent layer to electrically connect the top pattern and the bottom pattern through the conductors of the elongated vias.
    Type: Grant
    Filed: January 16, 2013
    Date of Patent: November 24, 2015
    Assignee: Intel Corporation
    Inventors: Harold R. Chase, Mathew J. Manusharow, Mark S. Hlad, Mihir K. Roy
  • NON-CYLINDRICAL CONDUCTING SHAPES IN MULTILAYER LAMINATED SUBSTRATE CORES
    Publication number: 20140197545
    Abstract: Non-cylindrical conducting shapes are described in the context of multilayer laminated substrate cores. In one example a package substrate core includes a plurality of dielectric layers pressed together to form a multilayer core, a conductive bottom pattern on a bottom surface of the multilayer core, and a conductive top pattern on a top surface of the multilayer core. At least one elongated via extends through each layer of the multilayer core, each elongated via containing a conductor and each connected to a conductor of a via in an adjacent layer to electrically connect the top pattern and the bottom pattern through the conductors of the elongated vias.
    Type: Application
    Filed: January 16, 2013
    Publication date: July 17, 2014
    Inventors: Harold R. Chase, Mathew J. Manusharow, Mark S. Hlad, Mihir K. Roy