Abstract: Vacuum pumping system comprises a plurality of vacuum processing vessels, semiconductor processing reactors, and the like, connected to a common manifold evacuated by a generously large central vacuum unit. The manifold is maintained at a substantially constant designated pre-set pressure higher than the pressures within the reactors by means of a gas bleed inlet valve controllably feeding an inert gas into the manifold. A blower package with valving, interposed between each reactor and the common manifold, discharges directly into the manifold and prevents pressure surges and excursions in the manifold and reactors as well as permitting each reactor to operate at different pressures independently of the existing manifold pressure.

Abstract: Lead frames with semiconductor microcircuit chips bonded thereto are automatically rapidly precisely loaded onto loading frames for subsequent encapsulation of the chips. The lead frames are contained within magazines, each lead frame resting on a separate rack therewithin. An air-actuated piston causes a plurality of pusher bars to each eject a lead frame from each of a plurality of the magazines, horizontally disposed, onto a nest member which pivots to invert the lead frames ejected thereon onto the loading frame. The lead frames are precisely positioned on the nest member early in the pivot thereof when the lead frame are caused to slide downwardly on the smooth-surfaced nest member to thereby contact an abutment and to be retained in that precise position by vacuum until deposited on the loading frame.