Abstract: Embodiments of substrates, semiconductor devices and methods are shown that include elongated structures to improve conduction. Elongated structures and methods are also shown that provide electromagnetic isolation to reduce noise in adjacent components.

Abstract: A method and device includes a first conductor formed on a first dielectric layer as a partial turn of a coil. A second conductor is formed on a second dielectric layer that covers the first dielectric layer and first conductor, the second conductor forming a partial turn of the coil. A vertical interconnect couples the first and second conductors to form a first full turn of the coil. The interconnect coupling can be enhanced by embedding some selective magnetic materials into the substrate.

Abstract: Embodiments of substrates, semiconductor devices and methods are shown that include elongated structures to improve conduction. Elongated structures and methods are also shown that provide electromagnetic isolation to reduce noise in adjacent components.

Abstract: Embodiments of substrates, semiconductor devices and methods are shown that include elongated structures to improve conduction. Elongated structures and methods are also shown that provide electromagnetic isolation to reduce noise in adjacent components.

Abstract: A system, method and circuit for providing a boost voltage with a transient operation of a vehicular start-stop system are provided. The system includes a duty cycle or current monitor to detect a change in duty cycle or current based on the transient operation; a crank time-out detector to determine whether the change in duty cycle is over a predetermined threshold; and a reset generator to generate a reset of a boost circuit that generates the boost voltage after a predetermined delay.

Abstract: A system, method and circuit for providing a boost voltage with a transient operation of a vehicular start-stop system are provided. The system includes a duty cycle or current monitor to detect a change in duty cycle or current based on the transient operation; a crank time-out detector to determine whether the change in duty cycle is over a predetermined threshold; and a reset generator to generate a reset of a boost circuit that generates the boost voltage after a predetermined delay.

Abstract: Some embodiments relate to an electronic package. The electronic package includes a substrate that includes a plurality of buildup layers. A first die is embedded in one of the buildup layers on one side of the substrate. A second die is bonded to the substrate within a cavity on an opposing side of the substrate. The first die and the second die may be electrically connected to conductors within the plurality of buildup layers. Other embodiments relate to method of connecting a first die to a second die to form an electronic package. The method includes attaching a first die to a core and fabricating a substrate onto the core. The method further includes creating a cavity in another of the buildup layers on an opposing side of the substrate and attaching a second die to the substrate within the cavity.

Abstract: Embodiments of substrates, semiconductor devices and methods are shown that include elongated structures to improve conduction. Elongated structures and methods are also shown that provide electromagnetic isolation to reduce noise in adjacent components.

Abstract: Embodiments of substrates, semiconductor devices and methods are shown that include elongated structures to improve conduction. Elongated structures and methods are also shown that provide electromagnetic isolation to reduce noise in adjacent components.

Abstract: Some embodiments relate to an electronic package. The electronic package includes a substrate that includes a plurality of buildup layers. A first die is embedded in one of the buildup layers on one side of the substrate. A second die is bonded to the substrate within a cavity on an opposing side of the substrate. The first die and the second die may be electrically connected to conductors within the plurality of buildup layers. Other embodiments relate to method of connecting a first die to a second die to form an electronic package. The method includes attaching a first die to a core and fabricating a substrate onto the core. The method further includes creating a cavity in another of the buildup layers on an opposing side of the substrate and attaching a second die to the substrate within the cavity.

Abstract: A system, method and circuit for providing a boost voltage with a transient operation of a vehicular start-stop system are provided. The system includes a duty cycle or current monitor to detect a change in duty cycle or current based on the transient operation; a crank time-out detector to determine whether the change in duty cycle is over a predetermined threshold; and a reset generator to generate a reset of a boost circuit that generates the boost voltage after a predetermined delay.

Abstract: Some embodiments relate to an electronic package. The electronic package includes a substrate that includes a plurality of buildup layers. A first die is embedded in one of the buildup layers on one side of the substrate. A second die is bonded to the substrate within a cavity on an opposing side of the substrate. The first die and the second die may be electrically connected to conductors within the plurality of buildup layers. Other embodiments relate to method of connecting a first die to a second die to form an electronic package. The method includes attaching a first die to a core and fabricating a substrate onto the core. The method further includes creating a cavity in another of the buildup layers on an opposing side of the substrate and attaching a second die to the substrate within the cavity.

Abstract: Some embodiments relate to an electronic package. The electronic package includes a substrate that includes a plurality of buildup layers. A first die is embedded in one of the buildup layers on one side of the substrate. A second die is bonded to the substrate within a cavity on an opposing side of the substrate. The first die and the second die may be electrically connected to conductors within the plurality of buildup layers. Other embodiments relate to method of connecting a first die to a second die to form an electronic package. The method includes attaching a first die to a core and fabricating a substrate onto the core. The method further includes creating a cavity in another of the buildup layers on an opposing side of the substrate and attaching a second die to the substrate within the cavity.

Abstract: A method and device includes a first conductor formed on a first dielectric layer as a partial turn of a coil. A second conductor is formed on a second dielectric layer that covers the first dielectric layer and first conductor, the second conductor forming a partial turn of the coil. A vertical interconnect couples the first and second conductors to form a first full turn of the coil. The interconnect coupling can be enhanced by embedding some selective magnetic materials into the substrate.

Abstract: Embodiments of substrates, semiconductor devices and methods are shown that include elongated structures to improve conduction. Elongated structures and methods are also shown that provide electromagnetic isolation to reduce noise in adjacent components.

Abstract: A limiter circuit includes a voltage rail having an input and an output, the input receiving an applied input voltage, a switching device in electrical communication with the voltage rail to selective control an electric current flowing through the output of the voltage rail, limiter capacitor in electrical communication with the input of the voltage rail and the switching device, wherein the limiter capacitor and the switching device are in parallel electrical communication between the input and an electrical ground, and a first resistor interposed between the limiter capacitor and the electrical ground, wherein an impedance of the resistor and the limiter capacitor define a time constant for the charging the limiter capacitor, and wherein the time constant of the limiter capacitor controls a voltage applied to the switching device and a current flowing through the output of the voltage rail.

Abstract: An error data dumping process on a game console is described, in which a request for an error data dump may be initiated using commands mapped to a handheld game controller. The request may include parameters for customizing the resulting dump, where the parameters may identify one or more physical memory address ranges to be included in the dump. Allocated virtual memory contents may also be added to the dump data structure, as can call stack data (such as thread lists and module lists) and system information. The assembled dump data can be written to a file and uploaded, via secure communication, to a network location where it may be indexed.

Abstract: A regulated voltage supply contains a zener diode controlled by a constant current generator to maintain the zener voltage at a constant level regardless of the swings of the voltage input to the diode. A current amplifier responds to the constant current generator to maintain the output voltage of the regulated voltage supply at the value of the zener voltage regardless of the demands of the load. A low voltage inhibit circuit responds to the magnitude of the input voltage and the magnitude of the voltage on the zener diode to generate a binary voltage signal for inhibiting the operation of a load such as a microcomputer when the voltage regulator is below the zener voltage level and the input is below the desired voltage.

Abstract: A passive processing circuit for processing a ground side switch closure to a CMOS input (20) of an MCU, particularly useful in a D.C. electrical system where ground offsets may occur, such as in an automotive vehicle. Three resistors (R1, R2, R3) are connected between supply and ground potentials of a D.C. power supply voltage (10). The junction of two (R1, R2) connects to an output (16) of a grounded input switch (12). The junction of two (R2, R3) connects to the CMOS input (20). A fourth resistor (R4) connects between the bi-directional input/output (22) of the MCU and the junction of the second and third resistors. The MCU executes an algorithm that selectively allows and disallows the resistor (R4) to coact with the second and third resistors. The circuit provides a cost-efficient solution for extending the range of supply line voltage over which a CMOS input can correctly read a switch closure.

Abstract: In one embodiment of the present invention, an electronic device comprises a circuit board having a first side and a second side and having circuit traces formed only on the first side. The electronic device further includes a voltage regulator providing a regulated voltage via a regulated voltage output terminal and having a regulated voltage return terminal. Additionally, the electronic device includes a microcontroller mounted to the first side of the circuit board and having a plurality of regulated voltage input terminals and corresponding microcontroller voltage return terminals. The electronic device also comprises a bus comprising a first circuit trace coupled to the regulated voltage output terminal and a second circuit trace coupled to the regulated voltage return terminal, the first circuit trace and the second circuit trace running substantially parallel to one another.