Patents by Inventor Harold W. Moyer

Harold W. Moyer has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Semiconductor integrated circuit packages
    Patent number: 4803540
    Abstract: A lead frame for mounting a semiconductor chip in an integrated circuit package incorporates a deformation absorbing member as an integral part of the paddle support arm so that the initial, desired physical and electrical characteristics are unaltered after a forming operation such as paddle downsetting.
    Type: Grant
    Filed: November 24, 1986
    Date of Patent: February 7, 1989
    Assignee: American Telephone and Telegraph Co., AT&T Bell Labs
    Inventors: Harold W. Moyer, Harry R. Scholz
  • Electronic component package using multi-level lead frames
    Patent number: 4801765
    Abstract: Disclosed is a semiconductor package with a high pin count. External contacts to the chip are provided by interdigitated leads formed from an upper and lower lead frame. The lower lead frame includes a paddle for mounting the chip. The upper lead frame initially has its leads tied together and a center portion is punched out to fit the size of the particular chip. The two lead frames are preferably coplanar in the area around the boundaries of the package encapsulant.
    Type: Grant
    Filed: January 6, 1986
    Date of Patent: January 31, 1989
    Assignee: American Telephone and Telegraph Company, AT&T Bell Laboratories
    Inventors: Harold W. Moyer, Harry R. Scholz
  • Plastic integrated circuit package
    Patent number: 4612564
    Abstract: The specification describes an integrated circuit package with a lead frame that incorporates crossunder members for power distribution. It uses a paddle member for chip support and back plane contact, with crossunders extending alongside the paddle. Insulating means is interposed between the chip and the lead frame with an opening to allow contact from the chip to the paddle.
    Type: Grant
    Filed: June 4, 1984
    Date of Patent: September 16, 1986
    Assignee: AT&T Bell Laboratories
    Inventor: Harold W. Moyer
  • Solder preform stabilization for lead frames
    Patent number: 4504427
    Abstract: Fabricating spacer bars or dam bars in conventional lead frames of a low melting material, e.g. solder, permits facile removal of the bar after molding. The low melting bars can be removed by furnace heating, localized radiant energy heating, exposure to rapid thermal annealing (RTA), hot air or hot liquid leveling, etc.
    Type: Grant
    Filed: June 17, 1983
    Date of Patent: March 12, 1985
    Assignee: AT&T Bell Laboratories
    Inventor: Harold W. Moyer
  • Assembling an electronic device
    Patent number: 4399610
    Abstract: An electronic device (10) is attached to a carrier tape (20) by a cluster (22) of leads (12) which are closely spaced relative to each other. The device (10) is detached from tape (20) along with the leads (12) and tape members (28) interconnecting such leads (12) for maintaining the spacings therebetween. The leads (12) are formed with a given configuration while the members (28) are still attached. Such members (28) are then trimmed from the leads (12) to electrically isolate such leads (12) while still maintaining the desired spacings therebetween.
    Type: Grant
    Filed: April 1, 1981
    Date of Patent: August 23, 1983
    Assignee: Western Electric Company, Inc.
    Inventor: Harold W. Moyer
  • Semiconductor integrated circuit packages
    Patent number: RE34269
    Abstract: A lead frame for mounting a semiconductor chip in an integrated circuit package incorporates a deformation absorbing member as an integral part of the paddle support arm so that the initial, desired physical and electrical characteristics are unaltered after a forming operation such as paddle downsetting.
    Type: Grant
    Filed: February 18, 1992
    Date of Patent: June 1, 1993
    Assignee: AT&T Bell Laboratories
    Inventors: Harold W. Moyer, Harry R. Scholz