Abstract: Golf balls and methods and systems for manufacturing golf balls. In one exemplary embodiment, a portion of a golf ball comprises a core material having a void, a semiconductor component disposed at least partially in the void, and a filler material in the void and surrounding the semiconductor component, the filler material being placed in the void in a liquid state and occupying a first volume in the liquid state and the filler material transforming into a solid state which occupies substantially the first volume. Methods for manufacturing golf balls and fixtures and apparatuses for manufacturing golf balls are also described.

Abstract: Golf balls and methods and systems for manufacturing golf balls. In one exemplary embodiment, a portion of a golf ball comprises a core material having a void, a semiconductor component disposed at least partially in the void, and a filler material in the void and surrounding the semiconductor component, the filler material being placed in the void in a liquid state and occupying a first volume in the liquid state and the filler material transforming into a solid state which occupies substantially the first volume. Methods for manufacturing golf balls and fixtures and apparatuses for manufacturing golf balls are also described.

Abstract: Method and apparatus for preparing sequences of test vectors to test for proper assembly of complex custom IC's onto printed circuit boards. The method, operating with appropriate apparatus for driving and sensing pins of a sample IC, automatically prepares an in-circuit test vector sequence, starting with only rudimentary information about the pins of the IC and no information at all about the functions or internal structure of the IC. The method makes use of goal-seeking and minimization procedures. The goal-seeking procedure constructs vector sequences from pseudorandom numbers until it finds a sequence which effectively and stably attains a set of pin fault coverage goals stated by the human operator. The minimization procedure then shortens the sequence, discarding excess vectors and keeping only those which efficiently contribute to the attainment of the pin fault coverage goal.