Patents by Inventor Harold Z. Htutt

Harold Z. Htutt has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 8787021
    Abstract: A cooler for a memory module includes heat plates on the sides of the memory module and heat fins extending from the top of the heat plates. The heat fins are optimized according to simulated or actual airflow about the memory module inside an enclosure. The heat fins may curve diagonally outward from the memory module and their free ends may be arranged substantially parallel to the airflow so air flows over their larger lateral surfaces down to the memory module.
    Type: Grant
    Filed: June 17, 2011
    Date of Patent: July 22, 2014
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Vance B. Murakami, Harold Z. Htutt
  • Publication number: 20120320523
    Abstract: A cooler for a memory module includes heat plates on the sides of the memory module and heat fins extending from the top of the heat plates. The heat fins are optimized according to simulated or actual airflow about the memory module inside an enclosure. The heat fins may curve diagonally outward from the memory module and their free ends may be arranged substantially parallel to the airflow so air flows over their larger lateral surfaces down to the memory module.
    Type: Application
    Filed: June 17, 2011
    Publication date: December 20, 2012
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Vance B. Murakami, Harold Z. Htutt