Patents by Inventor Harpreet GILL

Harpreet GILL has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Integrated circuits with internal pads
    Patent number: 9391032
    Abstract: An embodiment includes an integrated circuit, comprising: a substrate; a first circuit formed on the substrate and coupled to a plurality of first pads on the substrate; and a second circuit formed on the substrate and coupled to a plurality of second pads on the substrate. The first pads are formed on a perimeter of the substrate; and the second pads extend from the perimeter of the substrate towards an interior of the substrate.
    Type: Grant
    Filed: May 1, 2014
    Date of Patent: July 12, 2016
    Assignee: SAMSUNG ELECTRONICS CO., LTD.
    Inventors: Young Koog, Jiankang Wang, Harpreet Gill, Sunghwan Min
  • INTEGRATED CIRCUIT LAYOUTS AND METHODS TO IMPROVE PERFORMANCE
    Publication number: 20150186586
    Abstract: An embodiment includes a method, comprising: receiving a netlist associated with an integrated circuit; identifying a parameter of a cell in the netlist; associating the cell with a reserved area in response to the parameter; and placing the cell in a layout for the integrated circuit with the reserved area.
    Type: Application
    Filed: May 23, 2014
    Publication date: July 2, 2015
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Santhosh PILLAI, Harpreet GILL
  • INTEGRATED CIRCUITS WITH INTERNAL PADS
    Publication number: 20150145122
    Abstract: An embodiment includes an integrated circuit, comprising: a substrate; a first circuit formed on the substrate and coupled to a plurality of first pads on the substrate; and a second circuit formed on the substrate and coupled to a plurality of second pads on the substrate. The first pads are formed on a perimeter of the substrate; and the second pads extend from the perimeter of the substrate towards an interior of the substrate.
    Type: Application
    Filed: May 1, 2014
    Publication date: May 28, 2015
    Applicant: Samsung Electronics Co., Ltd.
    Inventors: Young KOOG, Jiankang WANG, Harpreet GILL, Sunghwan MIN