Patents by Inventor Harrison E. Holmes

Harrison E. Holmes has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 11732328
    Abstract: Disclosed is a conductive ink composition and a manufacturing method thereof. The composition includes about 50 to about 99 wt % copper nanoparticles and about 1 to about 50 wt % tin. Copper nanoparticles are atomized and suspended in a tin bath, wherein the copper nanoparticles are evenly dispersed within the bath through sonification. The composition is cooled, extracted, and formed into a filament for use as a conductive ink. The ink has a resistivity of about 46.2×E?9 ?*m to about 742.5×E?9 ?*m. Once in filament form, the tin-copper mix will be viable for material extrusion, thus allowing for a lower cost, electrically conductive traces to be used in additive manufacturing.
    Type: Grant
    Filed: August 22, 2022
    Date of Patent: August 22, 2023
    Assignee: The United States of America, as Represented by the Secretary of the Navy
    Inventor: Harrison E. Holmes
  • Publication number: 20230056933
    Abstract: Disclosed is a conductive ink composition and a manufacturing method thereof. The composition includes about 50 to about 99 wt % copper nanoparticles and about 1 to about 50 wt % tin. Copper nanoparticles are atomized and suspended in a tin bath, wherein the copper nanoparticles are evenly dispersed within the bath through sonification. The composition is cooled, extracted, and formed into a filament for use as a conductive ink. The ink has a resistivity of about 46.2×E-9 ?*m to about 742.5×E-9 ?*m. Once in filament form, the tin-copper mix will be viable for material extrusion, thus allowing for a lower cost, electrically conductive traces to be used in additive manufacturing.
    Type: Application
    Filed: August 22, 2022
    Publication date: February 23, 2023
    Applicant: The United States of America, as represented by the Secretary of the Navy
    Inventor: Harrison E. Holmes
  • Patent number: 11466171
    Abstract: Disclosed is a conductive ink composition and a manufacturing method thereof. The composition includes about 50 to about 99 wt % copper nanoparticles and about 1 to about 50 wt % tin. Copper nanoparticles are atomized and suspended in a tin bath, wherein the copper nanoparticles are evenly dispersed within the bath through sonification. The composition is cooled, extracted, and formed into a filament for use as a conductive ink. The ink has a resistivity of about 46.2×E?9 ?*m to about 742.5×E?9 ?*m. Once in filament form, the tin-copper mix will be viable for material extrusion, thus allowing for a lower cost, electrically conductive traces to be used in additive manufacturing.
    Type: Grant
    Filed: March 9, 2021
    Date of Patent: October 11, 2022
    Assignee: The United States of America, as Represented by the Secretary of the Navy
    Inventor: Harrison E. Holmes
  • Publication number: 20220289995
    Abstract: Disclosed is a conductive ink composition and a manufacturing method thereof. The composition includes about 50 to about 99 wt % copper nanoparticles and about 1 to about 50 wt % tin. Copper nanoparticles are atomized and suspended in a tin bath, wherein the copper nanoparticles are evenly dispersed within the bath through sonification. The composition is cooled, extracted, and formed into a filament for use as a conductive ink. The ink has a resistivity of about 46.2×E-9 ?*m to about 742.5×E-9 ?*m. Once in filament form, the tin-copper mix will be viable for material extrusion, thus allowing for a lower cost, electrically conductive traces to be used in additive manufacturing.
    Type: Application
    Filed: March 9, 2021
    Publication date: September 15, 2022
    Applicant: The United States of America, as represented by the Secretary of the Navy
    Inventor: Harrison E. Holmes