Patents by Inventor Harrison S. Teplitz

Harrison S. Teplitz has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Split enclosure for fan-less cooling
    Patent number: 11940661
    Abstract: A split enclosure apparatus for fan-less cooling may be provided. The apparatus may comprise a device and a housing. The device may comprise a plurality of components. The housing may enclose the device and may comprise a first external surface, a second external surface, and a joint between the first external surface and the second external surface. The first external surface may be dedicated to cooling a first one of the plurality of components. The second external surface may be dedicated to cooling a second one of the plurality of components. The joint between the first external surface and the second external surface may be electrically conductive and thermally resistive.
    Type: Grant
    Filed: December 17, 2021
    Date of Patent: March 26, 2024
    Assignee: Cisco Technology, Inc.
    Inventors: Joseph F. Jacques, Edward John Kliewer, Harrison S. Teplitz
  • SPLIT ENCLOSURE FOR FAN-LESS COOLING
    Publication number: 20230194810
    Abstract: A split enclosure apparatus for fan-less cooling may be provided. The apparatus may comprise a device and a housing. The device may comprise a plurality of components. The housing may enclose the device and may comprise a first external surface, a second external surface, and a joint between the first external surface and the second external surface. The first external surface may be dedicated to cooling a first one of the plurality of components. The second external surface may be dedicated to cooling a second one of the plurality of components. The joint between the first external surface and the second external surface may be electrically conductive and thermally resistive.
    Type: Application
    Filed: December 17, 2021
    Publication date: June 22, 2023
    Applicant: Cisco Technology, Inc.
    Inventors: Joseph F. Jacques, Edward John Kliewer, Harrison S. Teplitz